JPH0453616B2 - - Google Patents

Info

Publication number
JPH0453616B2
JPH0453616B2 JP1323715A JP32371589A JPH0453616B2 JP H0453616 B2 JPH0453616 B2 JP H0453616B2 JP 1323715 A JP1323715 A JP 1323715A JP 32371589 A JP32371589 A JP 32371589A JP H0453616 B2 JPH0453616 B2 JP H0453616B2
Authority
JP
Japan
Prior art keywords
solder
thread
soldering
tube
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1323715A
Other languages
Japanese (ja)
Other versions
JPH02192877A (en
Inventor
Takashi Atobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP32371589A priority Critical patent/JPH02192877A/en
Publication of JPH02192877A publication Critical patent/JPH02192877A/en
Publication of JPH0453616B2 publication Critical patent/JPH0453616B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 本発明は、自動はんだ付け装置におけるはんだ
送りユニツトに係り、特にはんだつまりを検出出
来る自動はんだ付け装置のはんだ供給ユニツトに
関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solder feeding unit in an automatic soldering apparatus, and more particularly to a solder feeding unit for an automatic soldering apparatus that can detect solder clogging.

従来の市販のはんだを供給するユニツトは、は
んだ送り不良を検出する機構が付いていないた
め、こて先で糸はんだが溶融しないと、はんだ送
りチユーブ内ではんだがつまり、連続的にはんだ
付け不良が発生し装置として信頼性が低下する欠
点があつた。
Conventional commercially available solder supply units do not have a mechanism to detect poor solder feeding, so if the solder thread does not melt at the tip, the solder will clog in the solder feeding tube, resulting in continuous soldering defects. This had the disadvantage of reducing the reliability of the device.

本発明の目的は、2つのギヤで送り出されるは
んだがワーク上で溶融不足になると、はんだ送り
チユーブ内でつまり、はんだ付け不良が連続して
発生するため、このつまりを自動的に検出して、
連続して発生するはんだ付け不良を防止するよう
なはんだ供給ユニツトを提供することにある。
The object of the present invention is to automatically detect clogging, because if the solder fed by the two gears becomes insufficiently melted on the workpiece, clogging occurs in the solder feeding tube, resulting in continuous soldering defects.
It is an object of the present invention to provide a solder supply unit that prevents soldering defects from occurring continuously.

はんだが溶融不足になるとはんだ送りチユーブ
内で連続して送り出されるはんだがつまり、はん
だがギヤの真下のチユーブ入口で大きく曲るため
に2つのギヤが空回り、ワークにはんだが供給さ
れないのではんだ付け不良となる。そこで、つま
つた場合にチユーブ入口ではんだが大きく曲るこ
とに着目し、曲がつたはんだを電気的に検出する
ようにしたものである。
When the solder is insufficiently melted, the solder that is continuously fed out in the solder feed tube becomes clogged, and the solder bends significantly at the tube entrance directly below the gear, causing two gears to idle, and solder not being fed to the workpiece, resulting in poor soldering. becomes. Therefore, we focused on the fact that the solder bends significantly at the tube entrance when the tube becomes clogged, and the bent solder is electrically detected.

以下、本発明の一実施例を第1図および第2図
により説明する。ロール1に巻かれた糸はんだ2
は、ギヤ3とギヤ4がモータにより回転すると、
その間から送られてはんだ送りチユーブ5に供給
される。はんだ送りチユーブ5の先端(上端)に
は、微量の電流(50mA以下)を流してある検出
板7と8が取付けられており、これらに導線9と
10がそれぞれ接続してある。また、導線9と1
0の間にブザー11が接続されている。なお、6
ははんだこてである。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. Solder thread 2 wrapped around roll 1
When gear 3 and gear 4 are rotated by the motor,
The solder is sent from there and supplied to the solder feeding tube 5. Detection plates 7 and 8 through which a small amount of current (50 mA or less) flows are attached to the tip (upper end) of the solder feed tube 5, and conductive wires 9 and 10 are connected to these, respectively. Also, conductors 9 and 1
A buzzer 11 is connected between 0 and 0. In addition, 6
is a soldering iron.

はんだ送りチユーブ5から送り出される糸はん
だ2が、こて先6に当る時にこて先6の酸化等の
理由で溶融不足になると、ギヤ3,4とはんだ送
りチユーブ5の入口の間で糸はんだ2が曲り、検
出板7と8に接触する。この結果、電流が検出板
7から検出板8に流れてブザー11が動作し、は
んだ送りチユーブ5から糸はんだ2が出てこない
異常を知らせる。
When the solder wire 2 sent out from the solder feed tube 5 hits the tip 6, if it becomes insufficiently melted due to oxidation of the tip 6, etc., the solder wire 2 is transferred between the gears 3 and 4 and the inlet of the solder feed tube 5. 2 is bent and comes into contact with detection plates 7 and 8. As a result, a current flows from the detection plate 7 to the detection plate 8, which activates the buzzer 11 to notify the user of an abnormality in which the solder wire 2 does not come out from the solder feed tube 5.

本発明によれば、こて先で糸はんだが溶融不足
になるときはんだ送りチユーブ内で糸はんだがつ
まつて、連続的に発生するはんだ付け不良を防止
することが出来、装置の信頼性を向上させる効果
がある。
According to the present invention, it is possible to prevent soldering defects that occur continuously due to clogging of the solder thread in the solder feed tube when the solder thread becomes insufficiently melted at the iron tip, thereby improving the reliability of the device. It has the effect of improving

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の自動はんだ付け装置における
はんだ供給ユニツトの一部断面構成図、第2図a
はその検出部の平面図、第2図bはB−B断面図
である。 1……ロール、2……糸はんだ、3,4……ギ
ヤ、5……はんだ送りチユーブ、6……はんだこ
て、7,8……検出板、9,10……導線、11
……ブザー。
Fig. 1 is a partial cross-sectional configuration diagram of a solder supply unit in an automatic soldering apparatus of the present invention, and Fig. 2a
2 is a plan view of the detection portion, and FIG. 2b is a sectional view taken along line B-B. 1... Roll, 2... Solder thread, 3, 4... Gear, 5... Solder feeding tube, 6... Soldering iron, 7, 8... Detection plate, 9, 10... Conductor, 11
……buzzer.

Claims (1)

【特許請求の範囲】[Claims] 1 糸状のはんだを供給するはんだ供給のユニツ
トと、上記糸状のはんだを溶融するためのはんだ
こてと、上記はんだ供給ユニツトからの上記糸状
のはんだを上記はんだこてに送るためのはんだ送
りチユーブと、通常の接点開放であり、異常時に
上記糸状のはんだによつて上記接点を閉じるよう
に構成されたはんだつまりの電気的検出装置とを
具備して成ることを特徴とする自動はんだ付け装
置。
1. A solder supply unit for supplying thread-like solder, a soldering iron for melting the thread-like solder, and a solder feeding tube for feeding the thread-like solder from the solder supply unit to the soldering iron. An automatic soldering device comprising: a solder blockage electrical detection device which normally opens the contacts and which is configured to close the contacts with the filamentous solder in the event of an abnormality.
JP32371589A 1989-12-15 1989-12-15 Automatic soldering device Granted JPH02192877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32371589A JPH02192877A (en) 1989-12-15 1989-12-15 Automatic soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32371589A JPH02192877A (en) 1989-12-15 1989-12-15 Automatic soldering device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2442982A Division JPS58141848A (en) 1982-02-19 1982-02-19 Supply unit for solder in automatic soldering device

Publications (2)

Publication Number Publication Date
JPH02192877A JPH02192877A (en) 1990-07-30
JPH0453616B2 true JPH0453616B2 (en) 1992-08-27

Family

ID=18157795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32371589A Granted JPH02192877A (en) 1989-12-15 1989-12-15 Automatic soldering device

Country Status (1)

Country Link
JP (1) JPH02192877A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103084691B (en) * 2013-01-29 2015-06-03 常州快克锡焊股份有限公司 Tin soldering machine abnormal tin-discharging monitoring mechanism and method, tin-discharging device and tin soldering machine
CN109048108B (en) * 2018-09-03 2020-07-28 武义县武阳茶机厂 Automatic welding device for buzzing piece of hard welding wire

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS533944A (en) * 1976-07-01 1978-01-14 Asao Seki Method and device for feeding wire solder in automatic soldering machine
JPS55112142A (en) * 1979-02-21 1980-08-29 Nippon Steel Weld Prod & Eng Co Ltd Detecting method of entanglement of coil-form wire material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS533944A (en) * 1976-07-01 1978-01-14 Asao Seki Method and device for feeding wire solder in automatic soldering machine
JPS55112142A (en) * 1979-02-21 1980-08-29 Nippon Steel Weld Prod & Eng Co Ltd Detecting method of entanglement of coil-form wire material

Also Published As

Publication number Publication date
JPH02192877A (en) 1990-07-30

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