JPS58141848A - Supply unit for solder in automatic soldering device - Google Patents
Supply unit for solder in automatic soldering deviceInfo
- Publication number
- JPS58141848A JPS58141848A JP2442982A JP2442982A JPS58141848A JP S58141848 A JPS58141848 A JP S58141848A JP 2442982 A JP2442982 A JP 2442982A JP 2442982 A JP2442982 A JP 2442982A JP S58141848 A JPS58141848 A JP S58141848A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tube
- automatic soldering
- gears
- supply unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、自動はんだ付は装置におけるはんだ送シュニ
ットに係シ、特にはんだつま〕を検出出来る自動はんだ
付は装置のはんだ供給ユニットに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solder feeding unit in an automatic soldering apparatus, and more particularly to a solder supply unit for an automatic soldering apparatus capable of detecting solder pinches.
従来の市販のはんだを供給するユニットは、はんだ送シ
ネ良管検出する機構が付いていないため、こて先で糸は
んだが溶融しないと、はんだ送シチューブ内ではんだが
つまシ、連続的にはんだ付は不良が発生し装置として信
頼性が低下する欠点があつ九。Conventional commercially available solder supply units do not have a mechanism to detect the solder feed tube, so if the solder thread does not melt at the soldering tip, the solder will collect in the solder feed tube and the solder will continue to flow. The disadvantage of this type is that defects occur and the reliability of the device decreases.
本発＠Ｏｍｌ的は、２つのギヤで送り出されるはんだが
ワーク上で＠融不足になると、はんだ送）チェープ内で
つｔシ、紘んだ付は不良が連続して発生すゐため、Ｆ−
ｏ′）ｉｐを自動的に検出して、連続して発生す為はん
だ付は不良を防止すゐようなはんだ供給具エツトを提供
することにある。In this @Oml, if the solder sent out by two gears becomes insufficiently melted on the workpiece, failures will occur continuously in the solder feed chain and solder joints. −
o') The objective is to provide a solder supply tool that automatically detects IP and prevents soldering defects from occurring continuously.
はんだが溶融不足になるとはんだ送シチュープ内で連続
して送シ出されるはんだがつｔ夛、はんだがギヤＯ真下
のチェープ入口で大暑〈曲るために２つのギヤが空回〕
シ、ワークにはんだが供給されないのではんだ付は不良
となる。そこで、つまった場合にチェープ入口ではんだ
が大きく曲ることに着関し、曲がったはんだを電気的に
検出するようにしたものである。When the solder is insufficiently melted, the solder is continuously fed out in the solder feeding stew, and the solder is extremely hot at the entrance of the chain directly below gear O. (Two gears idle due to bending.)
B. Solder is not supplied to the workpiece, resulting in poor soldering. Therefore, regarding the fact that the solder bends significantly at the entrance of the chain when the chain becomes clogged, the bent solder is electrically detected.
以下、本発明の一実ｊｌＩ？１ｌｔ−第１図および第２
図によ〉説−する。ロール１に巻かれ丸糸はんだ２は、
ギヤ３とギヤ４がモータによシ回転すると、その間から
送られてはんだ送）チューブ５に供給される。はんだ送
〉チェープＳの先１ｉｅ（上ｐｓｉ＞には、微量の電流
（５０ｓム以下）！−流しである検出板Ｔと８が取付け
られてシ）、これらに導＠Ｓと１０がそれぞれ接続しで
ある。また、導線−ａＯの関にブザー１１が接続されて
いる。なお、・ははんだζてである。The following is a fruit of the present invention. 1lt-Figure 1 and 2
The explanation is as shown in the figure. The round thread solder 2 wound around the roll 1 is
When the gears 3 and 4 are rotated by the motor, the solder is fed from between them and supplied to the solder feeding tube 5. Solder feeding> Tip 1ie of the chain S (upper psi> has a small amount of current (less than 50 sm!) - detection plates T and 8 are attached to the sink), and conductors @S and 10 are connected to these, respectively. It is. Further, a buzzer 11 is connected to the conducting wire -aO. Note that ・ is solder ζ.
はんだ送シチューブＳから送夛出される系はんだ２が、
こて先１に当る時にζて先６の酸化等の理由で溶融不足
になると、ギヤ３，４とはんだ送夛チューブＳの入口の
間で糸はんだ２が自シ、検出板Ｔと８に接触する。この
結果、電流が検出板Ｔから検出板＄に流れてブザー１１
が動作し、はんだ送シチュープ５から糸はんだ２が出て
とない異常を知らせる。The system solder 2 fed out from the solder feeding tube S is
If the ζ tip 6 becomes insufficiently melted due to oxidation or other reasons when it hits the soldering iron tip 1, the solder thread 2 will be released between the gears 3 and 4 and the inlet of the solder feeding tube S, and the solder wire will be exposed to the detection plates T and 8. Contact. As a result, current flows from the detection plate T to the detection plate $ and the buzzer 11
is activated, and the thread solder 2 does not come out from the solder feeding stew 5, indicating an abnormality.
本発明によれば、ζて先で糸はんだが＊＊不足になると
きはんだ送シチューブ内で糸はんだがつまって、連続的
に発生するはんだ付は不良を防止することが出来、装置
の信ｌ１ｌＩ性を向上させる効果がある。According to the present invention, it is possible to prevent soldering defects that occur continuously due to clogging of the solder thread in the solder feed tube when the solder thread becomes insufficient at the tip of the solder, and the reliability of the device is improved. It has the effect of improving sex.
【図面の簡単な説明】
第１図は本発明の自動はんだ付は装置におけるはんだ供
給！＋Ｌエツジの一部断面構成図、第２図−）はその検
出部の千夏図、第２図（ｂ）はＢ−Ｂ断面図であ為。
１・・・・芦−ル、２１１＋１＠−系はんだ、３゜４・
優・・ギヤ、５＊・・争はんだ送シチューブ、・・・Φ
・はんだこて、７，８ｅｅｓ−検出板、＃、１０＠−・
・導線、１１・・・ψブザー。[Brief explanation of the drawings] Figure 1 shows the automatic soldering of the present invention, solder supply in the device! A partial cross-sectional configuration diagram of the +L edge, Figure 2 (-) is a Chinese diagram of the detection part, and Figure 2 (b) is a BB cross-sectional diagram. 1...Ashi-ru, 211+1@- system solder, 3゜4・
Excellent...Gear, 5*...Contested soldering tube,...Φ
・Soldering iron, 7,8ees-detection plate, #, 10@-・
・Conductor, 11...ψ buzzer.
Claims (1)
部分にはんだこて先を接触させ、はんだ送シチューブか
ら送シ込まれ丸糸はんだを定量溶融して前記はんだ付は
部分をはんだ付けする自動はんだ付は装置において、は
んだつｔｂを検出する手段を備えたことを特徴とする自
動はんだ付は装置におけるはんだ供給ユニット。Move the soldering iron, touch the tip of the soldering iron to the part to be soldered, melt a certain amount of round thread solder fed from the solder feed tube, and solder the part. A solder supply unit in an automatic soldering apparatus, characterized in that the automatic soldering apparatus comprises means for detecting solder tb.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2442982A JPS58141848A (en) | 1982-02-19 | 1982-02-19 | Supply unit for solder in automatic soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2442982A JPS58141848A (en) | 1982-02-19 | 1982-02-19 | Supply unit for solder in automatic soldering device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32371589A Division JPH02192877A (en) | 1989-12-15 | 1989-12-15 | Automatic soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58141848A true JPS58141848A (en) | 1983-08-23 |
| JPH03152B2 JPH03152B2 (en) | 1991-01-07 |
Family
ID=12137905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2442982A Granted JPS58141848A (en) | 1982-02-19 | 1982-02-19 | Supply unit for solder in automatic soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58141848A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012207990A (en) * | 2011-03-29 | 2012-10-25 | Fujitsu Ltd | Solder state detection device |
-
1982
- 1982-02-19 JP JP2442982A patent/JPS58141848A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012207990A (en) * | 2011-03-29 | 2012-10-25 | Fujitsu Ltd | Solder state detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03152B2 (en) | 1991-01-07 |
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