JPH02192877A - Automatic soldering device - Google Patents
Automatic soldering deviceInfo
- Publication number
- JPH02192877A JPH02192877A JP32371589A JP32371589A JPH02192877A JP H02192877 A JPH02192877 A JP H02192877A JP 32371589 A JP32371589 A JP 32371589A JP 32371589 A JP32371589 A JP 32371589A JP H02192877 A JPH02192877 A JP H02192877A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wire
- tube
- feed tube
- gears
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 50
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052742 iron Inorganic materials 0.000 claims abstract description 9
- 238000001514 detection method Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 6
- 230000005856 abnormality Effects 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、自動はんだ付け装置におけるはんだ送りユニ
ットに係り、特にはんだつまりを検出出来る自動はんだ
付け装置のはんだ供給ユニットに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solder feeding unit in an automatic soldering device, and more particularly to a solder feeding unit in an automatic soldering device that can detect solder clogging.
従来の市販のはんだを供給するユニットは、はんだ送り
不良を検出する機構が付いていないため、こて先で糸は
んだが溶融しないと、はんだ送りチューブ内ではんだが
つまり、連続的にはんだ付け不良が発生し装置として信
頼性が低下する欠点があった。Conventional commercially available solder supply units do not have a mechanism to detect poor solder feeding, so if the solder thread does not melt at the iron tip, the solder gets clogged in the solder feeding tube, resulting in continuous soldering defects. This has the disadvantage of reducing the reliability of the device.
本発明の目的は、2つのギヤで送り出されるはんだがワ
ーク上で溶融不足になると、はんだ送りチューブ内でつ
まり、はんだ付け不良が連続して発生するため、このつ
まりを自動的に検出して、連続して発生するはんだ付け
不良を防止するようなはんだ供給ユニットを提供するこ
とにある。The object of the present invention is to automatically detect clogging, because if the solder fed by the two gears becomes insufficiently melted on the workpiece, clogging occurs in the solder feeding tube, resulting in continuous soldering defects. It is an object of the present invention to provide a solder supply unit that prevents soldering defects from occurring continuously.
はんだが溶融不足になるとはんだ送りチューブ内で連続
して送り出されるはんだがつまり、はんだがギヤの真下
のチューブ入口で大きく曲るために2つのギヤが空回り
し、ワークにはんだが供給されないのではんだ付け不良
となる。そこで、つまった場合にチューブ入口ではんだ
が大きく曲ることに着目し、曲がったはんだを電気的に
検出するようにしたものである。When the solder is insufficiently melted, the solder that is continuously fed out in the solder feed tube becomes clogged, causing the solder to bend significantly at the tube entrance directly below the gear, causing the two gears to spin idle, preventing solder from being supplied to the workpiece. It becomes defective. Therefore, we focused on the fact that the solder bends significantly at the tube entrance when the tube becomes clogged, and the bent solder is detected electrically.
以下1本発明の一実施例を第1図および第2図により説
明する。ロール1に巻がれた糸はんだ2゛は、ギヤ3と
ギヤ4がモータにより回転すると、その間から送られて
はんだ送りチューブ5に供給される。はんだ送りチュー
ブ5の先端(上端)には、微量の電流(50mA以下)
を流しである検出板7と8が取付けられており、これら
に導線9と10がそれぞれ接続しである。また、溝線9
と10の間にブザー11が接続されている。なお、6は
はんだこてである。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. When the gears 3 and 4 are rotated by a motor, the solder thread 2' wound around the roll 1 is fed between them and supplied to the solder feed tube 5. A small amount of current (50 mA or less) is applied to the tip (upper end) of the solder feed tube 5.
Detection plates 7 and 8, which are sinks, are mounted, and conductive wires 9 and 10 are connected to these, respectively. Also, groove line 9
A buzzer 11 is connected between and 10. Note that 6 is a soldering iron.
はんだ送りチューブ5から送り出される糸はんだ2が、
こて先6に当る時にこて先6の酸化等の理由で溶融不足
になると、ギヤ3,4とはんだ送りチューブ5の入口の
間で糸はんだ2が曲り、検出板7と8に接触する。この
結果、電流が検出板7から検出板8に流れてブザー11
が動作し、はんだ送りチューブ5から糸はんだ2が出て
こない異常を知らせる。The thread solder 2 sent out from the solder feeding tube 5 is
If the soldering iron tip 6 becomes insufficiently melted when it hits the soldering iron tip 6 due to oxidation or other reasons, the solder thread 2 bends between the gears 3 and 4 and the inlet of the solder feed tube 5 and comes into contact with the detection plates 7 and 8. . As a result, current flows from the detection plate 7 to the detection plate 8 and the buzzer 11
is activated and notifies the user of an abnormality in which the solder wire 2 does not come out from the solder feed tube 5.
本発明によれば、こて先で糸はんだが溶融不足になると
きはんだ送りチューブ内で糸はんだがつまって、連続的
に発生するはんだ付け不良を防止することが出来、装置
の信頼性を向上させる効果がある。According to the present invention, it is possible to prevent soldering defects that occur continuously due to clogging of the solder wire in the solder feed tube when the solder wire becomes insufficiently melted at the iron tip, thereby improving the reliability of the device. It has the effect of
第1図は本発明の自動はんだ付け装置におけるはんだ供
給ユニットの一部断面構成図、第2図(a)はその検出
部の平面図、第2図(b)はB−B断面図である。FIG. 1 is a partially sectional configuration diagram of a solder supply unit in an automatic soldering apparatus of the present invention, FIG. 2(a) is a plan view of its detection section, and FIG. 2(b) is a BB sectional view. .
Claims (1)
上記糸状のはんだを溶融するためのはんだこてと、上記
はんだ供給ユニットからの上記糸状のはんだを上記はん
だこてに送るためのはんだ送りチューブと、通常の接点
開放であり、異常時に上記糸状のはんだによって上記接
点を閉じるように構成されたはんだつまりの電気的検出
装置とを具備して成ることを特徴とする自動はんだ付け
装置。1. A solder supply unit that supplies filamentous solder;
There is a soldering iron for melting the filamentous solder, a solder feeding tube for feeding the filamentous solder from the solder supply unit to the soldering iron, and a normal contact opening. and an electrical detection device for a solder blockage configured to close the contacts with solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32371589A JPH02192877A (en) | 1989-12-15 | 1989-12-15 | Automatic soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32371589A JPH02192877A (en) | 1989-12-15 | 1989-12-15 | Automatic soldering device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2442982A Division JPS58141848A (en) | 1982-02-19 | 1982-02-19 | Supply unit for solder in automatic soldering device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02192877A true JPH02192877A (en) | 1990-07-30 |
JPH0453616B2 JPH0453616B2 (en) | 1992-08-27 |
Family
ID=18157795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32371589A Granted JPH02192877A (en) | 1989-12-15 | 1989-12-15 | Automatic soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02192877A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103084691A (en) * | 2013-01-29 | 2013-05-08 | 常州快克锡焊股份有限公司 | Tin soldering machine abnormal tin-discharging monitoring mechanism and method, tin-discharging device and tin soldering machine |
CN109048108A (en) * | 2018-09-03 | 2018-12-21 | 武义县武阳茶机厂 | A kind of hard solder line piezo automatic welding device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS533944A (en) * | 1976-07-01 | 1978-01-14 | Asao Seki | Method and device for feeding wire solder in automatic soldering machine |
JPS55112142A (en) * | 1979-02-21 | 1980-08-29 | Nippon Steel Weld Prod & Eng Co Ltd | Detecting method of entanglement of coil-form wire material |
-
1989
- 1989-12-15 JP JP32371589A patent/JPH02192877A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS533944A (en) * | 1976-07-01 | 1978-01-14 | Asao Seki | Method and device for feeding wire solder in automatic soldering machine |
JPS55112142A (en) * | 1979-02-21 | 1980-08-29 | Nippon Steel Weld Prod & Eng Co Ltd | Detecting method of entanglement of coil-form wire material |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103084691A (en) * | 2013-01-29 | 2013-05-08 | 常州快克锡焊股份有限公司 | Tin soldering machine abnormal tin-discharging monitoring mechanism and method, tin-discharging device and tin soldering machine |
CN109048108A (en) * | 2018-09-03 | 2018-12-21 | 武义县武阳茶机厂 | A kind of hard solder line piezo automatic welding device |
Also Published As
Publication number | Publication date |
---|---|
JPH0453616B2 (en) | 1992-08-27 |
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