JPS6242377B2 - - Google Patents
Info
- Publication number
- JPS6242377B2 JPS6242377B2 JP59182618A JP18261884A JPS6242377B2 JP S6242377 B2 JPS6242377 B2 JP S6242377B2 JP 59182618 A JP59182618 A JP 59182618A JP 18261884 A JP18261884 A JP 18261884A JP S6242377 B2 JPS6242377 B2 JP S6242377B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- spool
- gold wire
- electrode terminal
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 10
- 238000004804 winding Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 30
- 238000010586 diagram Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H63/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package
- B65H63/08—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package responsive to delivery of a measured length of material, completion of winding of a package, or filling of a receptacle
- B65H63/086—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package responsive to delivery of a measured length of material, completion of winding of a package, or filling of a receptacle responsive to completion of unwinding of a package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H63/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package
- B65H63/08—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package responsive to delivery of a measured length of material, completion of winding of a package, or filling of a receptacle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/36—Wires
- B65H2701/361—Semiconductor bonding wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明はワイヤボンデイング装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding device.
半導体技術分野でつかつているワイヤボンデイ
ング装置では、半導体素子パツドとリード間を電
気的に接続する金線など導電性のあるワイヤをス
プールに巻線状に巻いておき、これからワイヤを
引き出しキヤピラリを介してボンデイングしてい
る。そして当然、このワイヤボンデイングが進む
にしたがいスプールに巻かれたワイヤの保有量は
少なくなり、最後にはスプールにワイヤが一巻も
残らない状態に至るが、従来においては、このワ
イヤ消費終了状態を作業者の監視により認識した
上で充分なワイヤ保有量を有するスプールと交換
しているが、通常、作業者１人で複数台の装置を
監視することから、これらのすべての装置につい
て適時にワイヤ消費終了状態を認識するに至らな
い。このため、スプールのワイヤが消費し尽され
た状態においても、ボンデイング作業が続行さ
れ、必然的にワイヤ切れを生じ、切断切れを100
％誘発している。 In wire bonding equipment used in the semiconductor technology field, conductive wire such as gold wire is wound around a spool to electrically connect semiconductor element pads and leads, and then the wire is pulled out and passed through a capillary. I am bonding. Naturally, as this wire bonding progresses, the amount of wire wound on the spool decreases, and eventually it reaches a state where there is no wire left on the spool. The spool is replaced with a spool that has a sufficient amount of wire after being recognized by the worker's monitoring, but since one worker usually monitors multiple devices, wires are replaced in a timely manner for all of these devices. It is not possible to recognize the end of consumption state. For this reason, even when the wire on the spool is used up, the bonding work continues, which inevitably causes wire breakage, resulting in 100% wire breakage.
% induced.
本発明はこのような従来の不都合を解消するも
のであつて、その目的とするところは、１人の作
業者が複数台のボンデイング装置を監視する場合
においても、それぞれのスプールのワイヤ消費終
了時をすみやかに認識できるワイヤボンデイング
装置を提供するにある。以下添付図面に関連して
本発明の実施例について説明する。 The present invention is intended to eliminate such conventional inconveniences, and its purpose is to monitor when the wire consumption of each spool ends, even when one worker monitors multiple bonding devices. An object of the present invention is to provide a wire bonding device that can quickly recognize a wire bonding device. Embodiments of the present invention will be described below with reference to the accompanying drawings.
第１図は本発明を成す上で前提となつたワイヤ
ボンデイング装置の概略図である。この装置１は
ワイヤとしてのたとえば金線２を線巻状に巻いた
スプール３を有し、これを強制回転できるように
図示しない駆動モータの回転軸に連結し支持して
いる。また、スプール３の第１図手前寄りの位置
にはスプール３から引き出した金線２を吹くエア
ーノズル４をねかせて設け、その先方には吹き流
される金線２をガイドする板５を設けて、これら
をいずれも前記駆動モータに関連して取り付けた
連絡杆６で支持している。また、金線２のたれ下
つた方の端部はキヤピラリ７に達し、これに近接
して設けたチヤツク８で保持し、さらに、スプー
ル３と板５の間には、スプール３から引き出した
金線２の外側にあつてかつ接触できるようにモー
タドライブ回路９に通じる電極端子１０を配置
し、連絡杆６に固定している。そして、電極端子
１０とスプール３の間にはワイヤの供給限界時を
検知する検出装置としての電極端子１１をねかせ
た状態に配置し、この先端をスプール３から引き
出され通常の状態にある金線２に触れない位置、
すなわち引き出された金線２の内側でかつスプー
ル３の下部近接位置にくるように設けている。ま
た、この電極端子１１は金線供給限界予知信号を
発生する回路を内蔵した検出部１２および記憶部
１３に接続し、さらにこれをランプ、チヤイムな
どの表示部１４に接続を図つている。 FIG. 1 is a schematic diagram of a wire bonding device that is a premise for realizing the present invention. This device 1 has a spool 3 in which a wire, for example, a gold wire 2, is wound in the form of a wire, and the spool 3 is connected to and supported by a rotating shaft of a drive motor (not shown) so as to be forced to rotate. Further, an air nozzle 4 for blowing the gold wire 2 pulled out from the spool 3 is installed in a position near the front of the spool 3 in FIG. , all of which are supported by a connecting rod 6 attached in connection with the drive motor. The hanging end of the gold wire 2 reaches the capillary 7 and is held by a chuck 8 provided close to this, and between the spool 3 and the plate 5 there is a metal An electrode terminal 10 communicating with the motor drive circuit 9 is arranged outside the wire 2 so that it can be contacted, and is fixed to the connecting rod 6. Between the electrode terminal 10 and the spool 3, an electrode terminal 11 as a detection device for detecting the wire supply limit is arranged in a lying state, and the tip of the electrode terminal 11 is pulled out from the spool 3 and the gold wire is in the normal state. A position that does not touch 2,
That is, it is provided inside the drawn-out gold wire 2 and close to the bottom of the spool 3. Further, this electrode terminal 11 is connected to a detection section 12 and a storage section 13, which have a built-in circuit for generating a gold wire supply limit prediction signal, and is further connected to a display section 14 such as a lamp or a chime.
第２図は第１図に示した電極端子１１の斜視図
で、これの先端を金線２が触れても傷を付けない
ように曲面形成するとともに金線２が横にはみ出
さない程度の横幅をもたせている。 FIG. 2 is a perspective view of the electrode terminal 11 shown in FIG. 1. The tip of the electrode terminal 11 is formed into a curved surface so that it will not be damaged even if the gold wire 2 touches it, and also has a curved surface to prevent the gold wire 2 from protruding sideways. It has width.
第３図は第１図に示したスプール３の斜視図
で、金線２の一端をフランジ部３ａの内面にたと
えばテープで固定している。 FIG. 3 is a perspective view of the spool 3 shown in FIG. 1, in which one end of the gold wire 2 is fixed to the inner surface of the flange portion 3a with, for example, tape.
ここで、第１図に示す装置の作用を説明すれ
ば、スプール３は図示しない駆動モータにより第
１図矢印ａ方向に強制回転され、またスプール３
から引き出したキヤピラリ７まで延長して保持し
た金線２は、ほぼ中間位置でエアーノズル４から
の一定した空気の噴射をうけて屈曲状態となり、
金線にテンシヨンがあたえられている。この場合
の金線２は第１図に符号Ａで示す状態から同じく
符号Ｂで示す状態までの幅をもつもので、符号Ａ
の状態はスプール３に金線２が１周以上巻かれて
いる状態において、スプール３が駆動モータによ
り強制回転される以前の状態で、この時、電極端
子１０に金線２が触れると電極端子１０側が高→
低レベルに落ちて、モータドライブ回路９が一定
時間電流を駆動モータに流す。また符号Ｂの状態
は駆動モータによりスプール３が強制回転された
直後の金線２の位置を示している。このように金
線２がスプール３に１周以上巻かれているときは
以上のように金線２の供給が行われる。 Here, to explain the operation of the device shown in FIG. 1, the spool 3 is forcibly rotated in the direction of arrow a in FIG. 1 by a drive motor (not shown), and the spool 3 is
The gold wire 2, which is extended and held from the capillary 7 pulled out from the metal wire 2, is bent at an almost intermediate position by receiving a constant jet of air from the air nozzle 4.
Tension is applied to the gold wire. The gold wire 2 in this case has a width ranging from the state shown by the symbol A in FIG.
This state is a state in which the gold wire 2 is wound around the spool 3 for one turn or more, and before the spool 3 is forcibly rotated by the drive motor.At this time, when the gold wire 2 touches the electrode terminal 10, the electrode terminal 10 side is high →
It falls to a low level and the motor drive circuit 9 passes current to the drive motor for a certain period of time. Further, the state indicated by symbol B indicates the position of the gold wire 2 immediately after the spool 3 is forcibly rotated by the drive motor. When the gold wire 2 is wound around the spool 3 one turn or more in this way, the gold wire 2 is supplied as described above.
さらに、スプール３に巻いた金線２の消費がす
すみ、スプール３に金線２が１巻も巻かれていな
い状態、すなわち金線２の供給限界にくると、第
４図中符号Ｃで示すようにスプール３の金線巻円
の接線方向から金線２の引き出し位置が移り、こ
れにより金線２が電極端子１１に接触し、電極端
子１１が高→低レベルに落ちて、これが第１図の
ように検出部１２、記憶部１３の金線供給限界予
知信号として表示部１４に送られ、この表示部１
４を通して金線供給の限界のきたことを作業者に
認識させる。この場合電気回路は第５図に示して
おり、大きくは３つに分かれて電極端子１１を含
めた検出部１２、記憶部１３、表示部１４からな
る。そして、１５はトランジスタ、１６はフリツ
プフロツプ、１７はインバータ、１８はランプ
で、金線２と電極端子１１が接触するトランジス
タ１５がOFFになるとフリツプフロツプ１６が
反転して低レベルになつて、インバータ１７でさ
らに反転してドライブがかかつてランプ１８がつ
く仕組になつている。 Furthermore, when the consumption of the gold wire 2 wound around the spool 3 progresses and there is no longer a single turn of the gold wire 2 wound around the spool 3, that is, when the supply limit of the gold wire 2 is reached, this is indicated by the symbol C in FIG. As shown in FIG. As shown in the figure, the gold wire supply limit prediction signal from the detection unit 12 and storage unit 13 is sent to the display unit 14.
4 to make workers aware that the gold wire supply has reached its limit. In this case, the electric circuit is shown in FIG. 5, and is roughly divided into three parts: a detection section 12 including an electrode terminal 11, a storage section 13, and a display section 14. 15 is a transistor, 16 is a flip-flop, 17 is an inverter, and 18 is a lamp. When the transistor 15, where the gold wire 2 and the electrode terminal 11 are in contact, is turned off, the flip-flop 16 is inverted and becomes low level, and the inverter 17 Furthermore, when the drive is reversed, the lamp 18 is turned on.
本発明は、上記第１図に示したワイヤボンデイ
ング装置の電極端子１１のかわりに第６図に示す
ように金線２２を巻きつけたスプール２３のフラ
ンジ部２３ａに貫通孔２３ｂをあけて、これに対
応させて逆Ｕ字形の保持部材２４に孔検出用のホ
トトランジスタ２５およびランプ２８を対向させ
て設け、これらをカウンタ２６さらにアラーム回
路２７に接続したものを用いる。本発明において
は、スプール２３に巻いた金線２２の巻き数すな
わちスプールの回転数をあらかじめ記憶してお
く、例えば、金線巻き時、フランジ部２３ａに設
けた貫通孔２３ｂがホト・トランジスタによつて
何回カウントされたか記憶しておく。そして、検
出のためのセツトをした時点から貫通孔２３ｂが
前記ホト・トランジスタ２５、ランプ２８および
貫通孔２３ｂの組合わせたものと、カウンタ２６
により何回カウントされたかによつて、スプール
の回転数をカウントすることができる。従つて、
あらかじめ記憶された情報をもとに上記スプール
の回転数のカウントによりワイヤ消費量がどの程
度か認識するこができる、又、スプールからの金
線供給が限界になる時点も認識することとができ
る、その時は上記アラームがなるようにする。 In the present invention, instead of the electrode terminal 11 of the wire bonding apparatus shown in FIG. 1, a through hole 23b is formed in the flange portion 23a of a spool 23 around which a gold wire 22 is wound, as shown in FIG. A phototransistor 25 for hole detection and a lamp 28 are provided facing each other on an inverted U-shaped holding member 24 corresponding to the above, and these are connected to a counter 26 and an alarm circuit 27. In the present invention, the number of turns of the gold wire 22 wound on the spool 23, that is, the number of rotations of the spool is stored in advance. For example, when winding the gold wire, the through hole 23b provided in the flange portion 23a is Remember how many times it was counted. From the time of setting for detection, the through hole 23b is connected to the combination of the phototransistor 25, the lamp 28 and the through hole 23b, and the counter 26.
The number of revolutions of the spool can be counted by how many times it is counted. Therefore,
Based on pre-stored information, it is possible to recognize the amount of wire consumed by counting the number of revolutions of the spool, and it is also possible to recognize the point at which the supply of gold wire from the spool reaches its limit. , at that time, the above alarm will sound.
以上の説明から明らかなように本発明によれ
ば、あらかじめワイヤの巻数（スプールの回転
数）を記憶しておきその情報をもとに上記検出装
置によりワイヤの供給程度を検出し、ワイヤ供給
限界を表示することができる。 As is clear from the above description, according to the present invention, the number of turns of wire (number of revolutions of the spool) is memorized in advance, and based on that information, the degree of wire supply is detected by the detection device, and the wire supply limit is can be displayed.
従つて、作業者１人で複数台の装置を監視する
場合でも、それぞれの装置すべてに監視が行きと
どき、ワイヤボンデイングなどの作業中において
ワイヤ不足によるワイヤ切れを生じさせない。し
たがつて、製品の断線不良を大幅になくすことが
でき良質の製品を提供することができる。 Therefore, even when a single worker monitors a plurality of devices, all the devices are monitored, and wire breaks due to insufficient wires do not occur during work such as wire bonding. Therefore, disconnection defects in products can be largely eliminated and high-quality products can be provided.
第１図は本発明の前提となつたワイヤボンデイ
ング装置の概略図、第２図は第１図に示すスプー
ルの斜視図、第３図は第１図に示す電極端子の斜
視図、第４図は第１図のワイヤボンデイング装置
のワイヤ供給検出の作用説明図、第５図は第１図
の電気回路図、第６図は本発明に従つたワイヤボ
ンデイング装置のワイヤ供給検出部を示した説明
図である。
１……ワイヤボンデイング装置、２……金線、
３……スプール、３ａ……フランジ部、４……エ
アーノズル、５……ガイドする板、６……連絡
管、７……キヤピラリ、８……チヤツク、９……
モータドライブ回路、１０……電極端子、１１…
…電極端子、１２……検出部、１３……記憶部、
１４……表示部、１５……トランジスタ、１６…
…フリツプフロツプ、１７……インバータ、１８
……ランプ、２２……金線、２３……スプール、
２３ａ……フランジ部、２３ｂ……貫通孔、２４
……保持部材、２５……ホト・トランジスタ、２
６……カウンタ、２７……アラーム回路。
Fig. 1 is a schematic diagram of the wire bonding device that is the premise of the present invention, Fig. 2 is a perspective view of the spool shown in Fig. 1, Fig. 3 is a perspective view of the electrode terminal shown in Fig. 1, and Fig. 4 5 is an electric circuit diagram of FIG. 1, and FIG. 6 is an explanatory diagram showing the wire supply detection section of the wire bonding apparatus according to the present invention. It is a diagram. 1... Wire bonding device, 2... Gold wire,
3...Spool, 3a...Flange part, 4...Air nozzle, 5...Guiding plate, 6...Connecting pipe, 7...Capillary, 8...Chick, 9...
Motor drive circuit, 10... Electrode terminal, 11...
... Electrode terminal, 12 ... Detection section, 13 ... Storage section,
14...Display section, 15...Transistor, 16...
...Flip-flop, 17...Inverter, 18
... Lamp, 22 ... Gold wire, 23 ... Spool,
23a...Flange portion, 23b...Through hole, 24
...Holding member, 25...Phototransistor, 2
6...Counter, 27...Alarm circuit.
Claims (1)
リに供給するワイヤボンデイング装置において、
前記スプールのフランジを挾むように設けられた
保持部材と、この保持部材に設けられた光電変換
部と、前記フランジに設けられたフランジ回転検
出用貫通孔と、前記スプールへワイヤを巻き付け
るときのスプールの回転数をあらかじめ記憶して
おく記憶部とを有し、前記キヤピラリへのワイヤ
供給時、前記貫通孔を通る光を前記光電変換部に
より検出することにより前記スプールの回転数を
検出し、この検出情報と前記あらかじめ記憶され
ている情報とから前記ワイヤの消費量を検出する
機構を有するワイヤボンデイング装置。1 In a wire bonding device that supplies a wire wound around a spool to a capillary,
A holding member provided to sandwich the flange of the spool, a photoelectric conversion unit provided on the holding member, a through hole for detecting flange rotation provided in the flange, and a spool used when winding a wire around the spool. and a storage section that stores the number of rotations in advance, and when feeding the wire to the capillary, the number of rotations of the spool is detected by detecting light passing through the through hole with the photoelectric conversion section, and this detection is performed. A wire bonding apparatus having a mechanism for detecting the consumption amount of the wire from information and the pre-stored information.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59182618A JPS6074448A (en) | 1984-09-03 | 1984-09-03 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59182618A JPS6074448A (en) | 1984-09-03 | 1984-09-03 | Wire bonding device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51113119A Division JPS6013303B2 (en) | 1976-09-22 | 1976-09-22 | wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6074448A JPS6074448A (en) | 1985-04-26 |
| JPS6242377B2 true JPS6242377B2 (en) | 1987-09-08 |
Family
ID=16121435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59182618A Granted JPS6074448A (en) | 1984-09-03 | 1984-09-03 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6074448A (en) |
-
1984
- 1984-09-03 JP JP59182618A patent/JPS6074448A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6074448A (en) | 1985-04-26 |
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