JPH0658355U - Solder insolubility detector - Google Patents

Abstract

(57) [Summary] [Purpose] To detect insolubility of solder due to insufficient heating of the soldering location in the automatic soldering equipment. A solder 1 inserted in a metal tube 19 is inserted in an insertion hole 11 of a rotating member 8 supported by a shaft 9, and the solder 1 is inserted in a softer tube 18 to form a roller 2
Is sent to the soldering point between the land 5 and the lead 6 of the printed circuit board 3. Normally, the contact point 14 of the rotating member 8 and the contact point 13 of the support base 12 are in contact with each other. When the solder is sent while the solder is not melted, the solder is caught and the rotating member is rotated upward, so that the two contacts 13 and 14 are separated from each other.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 This invention is an automatic soldering device that automatically solders components, wires, etc. to a printed circuit board using thread solder, and detects solder insolubility to detect when the solder has become insoluble at the soldering point. It relates to the device.

[0002]

[Prior art]

 FIG. 3 is a configuration diagram schematically showing a conventional automatic soldering device. In FIG. 3, a thread solder (hereinafter, simply referred to as solder) 1 is transferred by a roller 2 and bent as shown in the drawing so that its tip reaches a soldering point. Through holes 4 are provided in the printed circuit board 3, and lands 5 are provided around the through holes 4. Leads 6 such as terminals and electric wires of circuit parts are inserted through the through holes 4, and the leads 6 and the lands 5 are soldered. Spots are emitted from the light source 7 to the soldering points to heat the lands 5 and the leads 6.

When soldering is performed with the above configuration, light is emitted from the light source 7 to heat the land 5 and the leads 6, and when sufficiently heated, the solder 1 is transferred to bring the tip end into contact with the land 5. The solder 1 is melted and the land 5 and the lead 6 are connected. Next, the printed circuit board 3 is moved so that the next soldering point on the printed circuit board 3 is located at the supply point of the solder 1, and the same irradiation as above is performed by irradiating light, and then the solder 1 is supplied. And solder.

[0004]

[Problems to be solved by the device]

 Since the conventional automatic soldering device performs the soldering as described above, if the heating of the land 5 and the leads 6 is insufficient for some reason, even if the solder 1 is supplied, the soldering is insufficient due to insufficient heating. 1 may not melt and soldering may not be performed. For this reason, there were problems such as defective wiring of the printed circuit board and, in some cases, an accident such as a short circuit between components.

The present invention has been made to solve the above problems, and when the solder is not melted due to insufficient heating or the like at the soldering location, a solder insolubility detection device for detecting this Is intended to provide.

[0006]

[Means for Solving the Problems]

 The solder insolubility detecting device according to the present invention is provided with a rotating member provided with an insertion hole through which the solder to be transferred is inserted, and a detecting means for detecting the rotation of the rotating member.

[0007]

[Action]

 The solder insolubility detection device in this invention does not melt even if the solder is supplied when the soldering point is insufficiently heated. Then, a reaction force is generated in the solder in the direction opposite to the supply direction, and the rotating member through which the solder is inserted rotates, and this rotation is detected by a switch, etc. Is detected.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, the same parts as those in FIG. 3 are designated by the same reference numerals and the description thereof will be omitted. In FIG. 1, a rotating member 8 is provided so as to be rotatable by a shaft 9 and urged in a counterclockwise direction in the drawing by a spring 10. The rotating member 8 is provided with an insertion hole 11 through which the solder 1 is inserted so as to follow the curve of the solder 1. The insertion direction of the insertion hole 11 and the axial direction of the shaft 9 intersect. The rotating member 8 is supported by placing the portion on the insertion hole 11 side on the support 12. On the upper surface of this support base 12, there are provided a contact 14 made of a metal piece or the like in contact with a contact 14 made of a metal piece of the rotating member 8. These contacts 13 and 14 are connected to the detection circuit 17 via lead wires 15 and 16, respectively. The contacts 13, 14 and the lead wires 15, 16 and the detection circuit 17 constitute a detection means.

On the other hand, the solder 1 is inserted into the guide tube 18 made of a flexible material such as rubber from the place where it exits the roller 2, and is inserted into the hard guide tube 19 such as metal in the insertion hole 11. . That is, the guide tube 19 is inserted into the insertion hole 11, and the solder 1 is inserted therein.

Next, the operation of the above configuration will be described. In a state where soldering is normally performed, the rotating member 8 is supported by the support base 12 and is in a horizontal state as shown in FIG. At this time, the contact 13 and the contact 14 are in contact with each other. The solder 1 is transferred by a fixed amount through the guide tube 18 and the guide tube 19 in the insertion hole 11 and supplied to the soldering point between the land 5 and the lead 6. The land 5 and the leads 6 are sufficiently heated by the irradiation of light from the light source 7, and the solder 1 supplied one after another is melted and soldering is performed.

Next, when the land 5 and the lead 6 are insufficiently heated, even if the solder 1 is sent to the land 5, the solder 1 is not melted, and the tip comes into contact with the soldering point. When the solder 1 is still fed in this state, the portion of the solder 1 inserted in the soft guide tube 18 tries to bend together with the guide tube 18. At this time, the portion of the hard guide tube 19 does not bend. A reaction force as shown by an arrow a in FIG. 2 is exerted by the above-mentioned bending force, and this reaction force causes the rotating member 8 to resist the spring 10 clockwise about the shaft 9 as shown in the figure. Rotate.

By this rotation, the contact 13 and the contact 14 are separated from each other, and at this time, the detection circuit 17 outputs the detection signal S indicating that the solder is not melted. This immediately stops the solder feed. When the melting of the solder 1 is returned to normal, the rotating member 8 is returned to the original horizontal state by the spring 10.

The balance with the reaction force can be adjusted by changing the position of the shaft 9 which is the fulcrum of rotation of the rotating member 8 and the strength of the spring 10. Further, in the above embodiment, the case where the present invention is applied to the automatic soldering device in which the heating of the soldering point is performed by the light source 7 has been described. Of course, it can also be applied to an automatic soldering device.

[0014]

[Effect of device]

 According to the present invention, the rotating member is inserted through the rotating member, and the rotating member is rotated by the reaction force due to the unmelting of the solder, so that the unmelting of the solder at the soldering point can be reliably detected. This has the effect of eliminating wiring defects on the printed circuit board and improving quality.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

FIG. 2 is a configuration diagram showing an operation of the embodiment.

FIG. 3 is a schematic diagram showing a conventional automatic soldering device.

[Explanation of symbols]

 1 Thread Solder 3 Printed Circuit Board 5 Land 6 Lead 7 Light Source 8 Rotating Member 9 Shaft 13, 14 Contact (Detecting Means) 15, 16 Lead Wire (Detecting Means) 17 Detection Circuit (Detecting Means)

Claims (1)

[Scope of utility model registration request] 1. A rotating member having an insertion hole through which thread-shaped solder that is transferred so that the tip portion reaches a portion to be soldered is provided, and an axial direction is a direction crossing the insertion direction of the insertion hole. A solder insolubility detecting device provided with a shaft arranged to rotatably support the rotating member and a detecting means for detecting the rotation of the rotating member.