JPH036092A - Soldering of printed board and apparatus therefor - Google Patents
Soldering of printed board and apparatus thereforInfo
- Publication number
- JPH036092A JPH036092A JP14140089A JP14140089A JPH036092A JP H036092 A JPH036092 A JP H036092A JP 14140089 A JP14140089 A JP 14140089A JP 14140089 A JP14140089 A JP 14140089A JP H036092 A JPH036092 A JP H036092A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- solder
- soldering
- blower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims description 37
- 229910000679 solder Inorganic materials 0.000 claims abstract description 48
- 238000007664 blowing Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 13
- 230000001154 acute effect Effects 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半田槽を用いて半田付を行うプリント基板の半
田付方法および同方法に利用できる半田付装置に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for soldering a printed circuit board in which soldering is performed using a solder bath, and a soldering apparatus that can be used in the method.
一般に、電子部品をインサートしたプリント基板の半田
付を行う場合は、半田槽（半田デイツプ槽）の上を通過
するプリント基板の下面に一定時間半田を接触させ、こ
れにより、自動で半田付が行われるようにした半田付装
置を用いている。Generally, when soldering a printed circuit board with electronic components inserted, the solder is brought into contact with the bottom surface of the printed circuit board for a certain period of time as it passes over a solder bath (solder dip bath). A soldering device is used that allows the soldering to occur.
また、プリント基板には半田付の前に半田を活性化させ
るフラックスを塗布するとともに、半田が良好に付着す
るように、プリヒート工程において温度１００°Ｃ程度
で加熱乾燥することによって、プリント基板の内部に浸
透している湿気やフラックスに含有する溶剤（アルコー
ル等）を気化させている。In addition, before soldering, the printed circuit board is coated with flux that activates the solder, and the inside of the printed circuit board is heated and dried at a temperature of about 100°C in the preheating process to ensure good solder adhesion. This vaporizes the moisture that permeates the flux and the solvent (alcohol, etc.) contained in the flux.
ところで、このようなプリヒート工程を経ても、現実に
は湿気分が僅かながら残留し、また、逆に半田の活性化
が進行し過ぎてしまう場合もある。Incidentally, even after such a preheating step, a small amount of moisture actually remains, and in some cases, activation of the solder progresses too much.
この結果、温度が２３０〜２５０℃の半田を用いる半田
付時には、第４図に示すように、半田３０がプリント基
板３１のスルーホール３２を通過し、小さい半田の粒（
ハンダボール）３０ａ・・・となってプリント基＠３１
の上面３１ｕに飛散する現象を生じ、かかるハンダボー
ル３０ａ・・・がそのままプリント基板３１に残留すれ
ば、パターンショートの原因となる。なお、３３は部品
、３３ａはそのリードを示す。As a result, when soldering using solder at a temperature of 230 to 250°C, the solder 30 passes through the through hole 32 of the printed circuit board 31, and small solder particles (
solder ball) 30a... and print base @31
If the solder balls 30a are scattered on the upper surface 31u and remain on the printed circuit board 31, pattern shorts may occur. Note that 33 indicates a component, and 33a indicates its lead.
このため、通常は超音波洗浄等により厳格に洗浄を行っ
ているのが実情であり、洗浄工程、検査工程が大変とな
るとともに、十分な信頼性を得れないという解決すべき
課題が存在した。For this reason, the reality is that strict cleaning is usually performed using ultrasonic cleaning, etc., which makes the cleaning and inspection processes difficult, and there are issues that need to be solved such as insufficient reliability. .
本発明はこのような背景技術に存在する課題を解消した
プリント基板の半田付方法及び装置の提供を目的とする
ものである。An object of the present invention is to provide a method and apparatus for soldering a printed circuit board that solves the problems existing in the background art.
本発明に係るプリント基板の半田付方法は、半田槽２に
収容した半田３にプリント基板１１の下面１１ｃｌを一
定時間接触させて半田付けを行うに際し、少なくとも下
面ｌｉｄを半田３に接触させている間、特にプリント基
板１１の上面ｆｌｕに対して平行ないし鋭角となる方向
から送風するようにしたことを特徴とする。In the printed circuit board soldering method according to the present invention, at least the lower surface lid is brought into contact with the solder 3 when soldering is performed by bringing the lower surface 11cl of the printed circuit board 11 into contact with the solder 3 stored in the solder tank 2 for a certain period of time. In particular, the air is blown from a direction parallel to or at an acute angle to the upper surface flu of the printed circuit board 11.
また、本発明に係るプリント基板の半田付装置ｌによれ
ば、プリント基板１１の下面ｌｉｄに、半田槽２に収容
した半田３を一定時間接触させることにより、プリント
基板１１の半田付を行う半田付装置を構成するに際して
、半田付中におけるプリント基板１１の上面１１ｕに対
して送風可能な送風機５を配設してなることを特徴とす
る。なお、この場合、風Ｗはプリント基板１１の上面１
１ｕに対して平行ないし鋭角となる方向から送風するよ
うに送風機５の配設角度を選定するとともに、位置セン
サ６．７によりプリント基板ＩＩの位置を検出し、プリ
ント基板１１が所定の位置に存在するときのみ、送風機
５を作動させる制御部８を設けることが望ましい。Further, according to the printed circuit board soldering apparatus l according to the present invention, the solder 3 contained in the solder tank 2 is brought into contact with the lower surface lid of the printed circuit board 11 for a certain period of time, thereby soldering the printed circuit board 11. The soldering device is characterized in that it includes a blower 5 that can blow air onto the upper surface 11u of the printed circuit board 11 during soldering. In this case, the wind W is the upper surface 1 of the printed circuit board 11.
The arrangement angle of the blower 5 is selected so that air is blown from a direction parallel to or at an acute angle to 1u, and the position of the printed circuit board II is detected by the position sensor 6.7, and the printed circuit board 11 is located at a predetermined position. It is desirable to provide a control unit 8 that operates the blower 5 only when the air blower 5 is used.
本発明に係るプリント基板の半田付方法及び装置１によ
れば、プリント基板１１の下面ｌｉｄが半田３に接触し
た際に、その上面１１ｕには風Ｗが当たり、その上面１
１ｕは一時的に冷却される。According to the printed circuit board soldering method and apparatus 1 according to the present invention, when the lower surface lid of the printed circuit board 11 comes into contact with the solder 3, the wind W hits the upper surface 11u of the printed circuit board 11,
1u is temporarily cooled.
この結果、上面＋１ｕに至る半田３は急速に凝固し、ハ
ンダボールの発生が抑制される。なお、風Ｗは本来半田
槽２にとって害となるものであるが、風Ｗの方向をプリ
ント基板１１の上面ｆｌｕに対して水平ないし鋭角に選
定するため、風Ｗはプリント基板ｌｌ上に存在する各種
部品に邪魔されることなく、上面ｆｌｕに沿って流れる
とともに、制御部８によって、プリント基板１１が存在
するときのみ、送風機５を作動させるため、半田槽２へ
の悪影響は防止される。As a result, the solder 3 reaching the upper surface +1u solidifies rapidly, and the generation of solder balls is suppressed. Incidentally, the wind W is originally harmful to the solder tank 2, but since the direction of the wind W is selected to be horizontal or at an acute angle with respect to the upper surface flu of the printed circuit board 11, the wind W exists on the printed circuit board ll. It flows along the upper surface flu without being obstructed by various parts, and since the blower 5 is operated by the control unit 8 only when the printed circuit board 11 is present, an adverse effect on the solder tank 2 is prevented.
以下には、本発明に係る好適な実施例を挙げ、図面に基
づき詳細に説明する。Hereinafter, preferred embodiments of the present invention will be described in detail based on the drawings.
まず、半田付装置１の構成について第１図〜第３図を参
照して説明する。First, the configuration of the soldering device 1 will be explained with reference to FIGS. 1 to 3.
第１図において、２１はプリント基板１１を搬送するコ
ンベアであり、同図中右方向へ移動する。In FIG. 1, 21 is a conveyor that conveys the printed circuit board 11, and moves to the right in the figure.
同コンベア２１は若干山形に迂回し、その下方には半田
３を収容する半田槽２を配設する。半田槽２内の半田３
は流動させ、上表面の一部３ａを山形に盛り上がらせる
ことにより、その上端をコンベア２１に載って搬送され
るプリント基板１１の下面ｌｉｄに接触させる。The conveyor 21 makes a slight detour in the shape of a chevron, and a solder tank 2 for accommodating the solder 3 is disposed below the conveyor 21. Solder 3 in solder tank 2
is caused to flow and a part 3a of the upper surface is raised in a mountain shape, so that the upper end thereof is brought into contact with the lower surface lid of the printed circuit board 11 carried on the conveyor 21.
一方、コンベア２１の上方には送風機５を配設する。送
風機５は外部ケース２２を備え、モータ２３ａによって
回転せしめられるファン２３ｂを内蔵する。また、外部
ケース２２の前部には前方へ突出する送風ダクト２４を
一体に備える。送風ダクト２４の先端には送風口２４２
Ｌを設け、この送風口２４ａは第２図に示すように、プ
リント基板１１の上面ｆｌｕにのみ風Ｗが効率的に当た
る形状と大きさを選定し、かつ上面ｆｌｕに対する角度
Ｒを平行又は鋭角となるように選定する。これにより、
風Ｗは点線矢印のようにプリント基板１１の上面ｆｌｕ
に沿って流れ、半田槽２には流れ込まない。また、風Ｗ
はプリント基板１１における部品の横方向から流れ込む
ことになり、部品の存在は邪魔とならない。On the other hand, a blower 5 is disposed above the conveyor 21. The blower 5 includes an external case 22 and includes a fan 23b rotated by a motor 23a. Further, the front portion of the external case 22 is integrally provided with a blower duct 24 that projects forward. A ventilation port 242 is provided at the tip of the ventilation duct 24.
As shown in FIG. 2, the shape and size of the air outlet 24a are selected such that the air W can efficiently hit only the upper surface flu of the printed circuit board 11, and the angle R with respect to the upper surface flu is parallel or acute. Select accordingly. This results in
The wind W flows across the upper surface of the printed circuit board 11 as indicated by the dotted arrow.
, and does not flow into the solder tank 2. Also, the wind W
will flow from the side of the component on the printed circuit board 11, and the presence of the component will not be a hindrance.
他方、第３図に示すようにコンベア２１の近傍には、例
えば光センサ等を利用した前後一対の位置センサ６．７
を配設する。一方の位置センサ６はプリント基板１１の
後端縁部１１ｂを感知し、プリント基板１１が半田槽２
に入る直前の位置を検出するとともに、他方の位置セン
サ７はプリント基板１１の先端縁部Ｉｆｆを感知し、プ
リント基板１１が半田槽２から出る直後の位置を検出す
る。また、８は制御部であり、その入力側には位置セン
サ６．７を、その出力側には送風機５をそれぞれ接続す
るとともに、電源２６を接続する。On the other hand, as shown in FIG. 3, in the vicinity of the conveyor 21, there are a pair of front and rear position sensors 6 and 7 using, for example, optical sensors.
Place. One position sensor 6 senses the rear edge 11b of the printed circuit board 11, and the printed circuit board 11 is connected to the solder bath 2.
At the same time, the other position sensor 7 senses the leading edge If of the printed circuit board 11 and detects the position immediately before the printed circuit board 11 exits the solder bath 2 . Further, 8 is a control unit, to which a position sensor 6.7 is connected to the input side, and to the output side thereof, the blower 5 is connected, as well as a power source 26.
制御部８は主にスイッチ回路で構成し、位置センサ６の
検出結果に対応して送風機５を作動させ、位置センサ７
の検出結果に対応して送風機５を停止させる機能を有す
る。The control unit 8 is mainly composed of a switch circuit, and operates the blower 5 in accordance with the detection result of the position sensor 6.
It has a function of stopping the blower 5 in response to the detection result.
次に、本発明に係る半田付方法を含む半田付装置１の動
作について説明する。Next, the operation of the soldering apparatus 1 including the soldering method according to the present invention will be explained.
まず、プリント基板１１はコンベア２１に載った状態で
一定間隔置きに搬送される。プリント基板１１が半田槽
２に入る直前の位置に達すると、位置センサ６がそれを
検出し、制御部８は電源から送風機５に通電を行う。こ
の結果、送風機５は作動し、送風ダクト２４の送風口２
４ａから風Ｗが吐出する。この風Ｗはプリント基板１１
の上面１１ｕに沿って流れ、プリント基板１１の上面１
１ｕのみが一時的に冷却される。これにより、ハンダボ
ールの発生が抑制されつつ半田付が行われる。そして、
プリント基板１１が半田槽２から出た直後の位置に達す
ると位置センサ７はそれを検出し、制御部８によって送
風機５の作動を停止させる。First, the printed circuit board 11 is carried on the conveyor 21 at regular intervals. When the printed circuit board 11 reaches a position immediately before entering the solder bath 2, the position sensor 6 detects this, and the control section 8 energizes the blower 5 from the power supply. As a result, the blower 5 operates and the air outlet 2 of the air duct 24
Wind W is discharged from 4a. This wind W is printed circuit board 11
The upper surface 1 of the printed circuit board 11 flows along the upper surface 11u of the printed circuit board 11.
Only 1 u is temporarily cooled. This allows soldering to be performed while suppressing the generation of solder balls. and,
When the printed circuit board 11 reaches the position immediately after coming out of the solder bath 2, the position sensor 7 detects this, and the control section 8 stops the operation of the blower 5.
以上、実施例について詳細に説明したが本発明はこのよ
うな実施例に限定されるものではない。Although the embodiments have been described in detail above, the present invention is not limited to these embodiments.
例えば、送風機は風を送ることのできる各種手段を利用
できるとともに、必要により、風は冷却されてもよい。For example, a blower can utilize various means capable of blowing air, and if necessary, the air may be cooled.
また、制御部による送風機の制御はタイマ等を組み合わ
せた態様でもよい。その他、細部の構成等において、本
発明の要旨を逸脱しない範囲で任意に変更できる。Further, the control of the blower by the control unit may be performed in combination with a timer or the like. Other details such as the configuration can be arbitrarily changed without departing from the gist of the present invention.
このように、本発明に係る半田付方法及び装置は、プリ
ント基板の下面を半田に接触させている間、プリント基
板の上面に対して送風するようにしたため、半田付時に
おけるハンダボールの発生が効果的に抑制され、半田付
後の洗浄工程も大幅に軽減できる。しかもパターンショ
ートの虞れも著しく減少するため、信頼性の向上に寄与
できるという効果を奏する。As described above, the soldering method and apparatus according to the present invention blows air against the top surface of the printed circuit board while the bottom surface of the printed circuit board is in contact with the solder, thereby preventing the generation of solder balls during soldering. This can be effectively suppressed, and the cleaning process after soldering can also be significantly reduced. Furthermore, the risk of pattern short circuits is significantly reduced, resulting in the effect of contributing to improved reliability.
第１図二本発明に係る半田付装置の模式的構成図、
第２図：同半田付装置における送風ダクトの一部斜視図
、
第３図二同半田付装置の制御系を含むブロック系統図、
背景技術の説明図。
第４図：
尚図面中、
■、半田付装置
３：半田
６．７＝位置センサ
ｌｌニブリント基板１
１１ｕ上面
２ 半田槽
５：送風機
８：制御部
１２・下面Fig. 1 2: A schematic configuration diagram of the soldering apparatus according to the present invention; Fig. 2: A partial perspective view of a blower duct in the soldering apparatus; Fig. 3: A block system diagram including a control system of the soldering apparatus. , An explanatory diagram of the background technology. Figure 4: In the drawing, ■, Soldering device 3: Solder 6.7 = Position sensor ll niblint board 1 11u top surface 2 Solder tank 5: Blower 8: Control unit 12, bottom surface
Claims (1)
一定時間接触させて半田付を行うプリント基板の半田付
方法において、少なくとも前記下面を半田に接触させて
いる間、プリント基板の上面に対して送風することを特
徴とするプリント基板の半田付方法。 〔２〕 プリント基板の上面に対して平行ないし鋭角と
なる方向から送風することを特徴とするプリント基板の
半田付方法。 〔３〕 プリント基板の下面に、半田槽に収容した半田
を一定時間接触させることにより、プリント基板の半田
付を行うプリント基板の半田付装置において、半田付中
におけるプリント基板の上面に対して送風可能な送風機
を配設してなることを特徴とするプリント基板の半田付
装置。 〔４〕 送風機はプリント基板の上面に対して平行ない
し鋭角となる方向から風が当たるように配設したことを
特徴とする請求項３記載のプリント基板の半田付装置。 〔５〕 位置センサによりプリント基板の位置を検出し
、プリント基板が所定の位置に存在するときのみ、送風
機を作動させる制御部を設けたことを特徴とする請求項
３記載のプリント基板の半田付装置。[Scope of Claims] [1] A printed circuit board soldering method in which soldering is performed by bringing the lower surface of a printed circuit board into contact with solder stored in a solder tank for a certain period of time, at least while the lower surface is in contact with the solder, A method for soldering a printed circuit board, characterized by blowing air against the upper surface of the printed circuit board. [2] A method for soldering a printed circuit board, characterized by blowing air from a direction parallel to or at an acute angle to the top surface of the printed circuit board. [3] In a printed circuit board soldering device that solders a printed circuit board by bringing the solder contained in a solder bath into contact with the bottom surface of the printed circuit board for a certain period of time, air is blown against the top surface of the printed circuit board during soldering. A soldering device for printed circuit boards, characterized in that it is equipped with a blower. [4] The printed circuit board soldering apparatus according to claim 3, wherein the blower is arranged so that the air blows from a direction parallel to or at an acute angle to the upper surface of the printed circuit board. [5] Soldering a printed circuit board according to claim 3, further comprising a control unit that detects the position of the printed circuit board using a position sensor and operates the blower only when the printed circuit board is in a predetermined position. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1141400A JP2736681B2 (en) | 1989-06-02 | 1989-06-02 | Printed circuit board soldering method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1141400A JP2736681B2 (en) | 1989-06-02 | 1989-06-02 | Printed circuit board soldering method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH036092A true JPH036092A (en) | 1991-01-11 |
| JP2736681B2 JP2736681B2 (en) | 1998-04-02 |
Family
ID=15291122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1141400A Expired - Fee Related JP2736681B2 (en) | 1989-06-02 | 1989-06-02 | Printed circuit board soldering method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2736681B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010144517A (en) * | 2008-12-16 | 2010-07-01 | Mitsubishi Electric Corp | Hermetic compressor |
| DE112019006408T5 (en) | 2018-12-27 | 2021-09-23 | National University Corporation Yamagata University | Polycarbonate resin composition, method for its production, masterbatch pellet and molded article |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01284477A (en) * | 1988-05-10 | 1989-11-15 | Matsushita Electric Ind Co Ltd | Automatic soldering device |
-
1989
- 1989-06-02 JP JP1141400A patent/JP2736681B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01284477A (en) * | 1988-05-10 | 1989-11-15 | Matsushita Electric Ind Co Ltd | Automatic soldering device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010144517A (en) * | 2008-12-16 | 2010-07-01 | Mitsubishi Electric Corp | Hermetic compressor |
| DE112019006408T5 (en) | 2018-12-27 | 2021-09-23 | National University Corporation Yamagata University | Polycarbonate resin composition, method for its production, masterbatch pellet and molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2736681B2 (en) | 1998-04-02 |
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