JPH01284477A - Automatic soldering device - Google Patents

Abstract

PURPOSE:To prevent the melting of the solder for mounting chip parts by the molten solder, the movement of the position thereof and the consequent generation of defective soldering by cooling the chip parts by the blast blown from a blast fan providing at the upper part of a solder tank at the time of soldering lead parts to a circuit board previously soldered with the chip parts. CONSTITUTION:The lead parts are inserted to the circuit board soldered with the chip parts in a previous stage and a flux is coated to the rear surface of the circuit board and the terminals of the lead parts by a fluxer 1. After the flux is dried in a preheater part 2, the terminals of the lead parts are soldered to the circuit board by the molten solder in the solder tank 3. The blast is blown from the part above the circuit board by the cooling fan 5 for preventing the melting of the solder disposed above the solder tank 3 to cool the front surface of the circuit board to prevent the solder mounting the chip parts from melting in this case; thereafter, the circuit board and the chip parts and lead parts soldered thereto are cooled by the cooling fan 4. The movement of the chip parts and the generation of the defective soldering by the melting of the solder mounting the chip parts are thus prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus for soldering lead components to a circuit board.

BACKGROUND OF THE INVENTION In recent years, mounting chip components and lead components on a circuit board has been widely used as a hybrid integrated circuit.

A conventional automatic soldering device has the configuration shown in the plan view and front view of FIGS. 2(a) and 2(b).

FIG. 2 will be explained in detail below.

In Fig. 2, 1 is a fluxer, 2 is a pre-heater part, and 3
is a solder bath, and 4 is a cooling fan. Insert the lead parts into the circuit board on which the chip parts were soldered with 5n63Pb37 solder at 183°C in the previous process, apply flux to the back side of the circuit board and the terminals of the lead parts with fluxer 1, and apply flux with pre-heater 2. The lead components inserted into the circuit board are dipped in molten solder heated to 250°C ± 5°C in the solder bath 3, the lead components are soldered, and the circuit board is bonded to the circuit board by the cooling fan 4. Cools mounted chip components and lead components.

Problems to be Solved by the Invention In such a conventional configuration, the chip components soldered onto the circuit board are mounted on the top surface of the circuit board by molten solder heated to 250°C ± 5°C in the solder bath 3. This has the disadvantage that the chip components move at the temperature at which the solder melts, causing soldering defects and reducing the reliability of the hybrid integrated circuit.

The present invention is intended to solve the above problems, and aims to prevent the solder of chip components mounted on the upper surface of a circuit board from melting.

Means for Solving the Problems In order to achieve this object, the automatic soldering device of the present invention is equipped with a cooling fan to prevent solder melting on the top of the solder bath, and when soldering is performed, the soldering device is installed on the top surface of the circuit board in advance. Air is blown from the top of the chip parts to prevent the solder on the chip parts from melting.
At the same time, it has the function of soldering lead components inserted into the circuit board.

Effect: This structure prevents soldering of chip components from becoming defective, which has been a problem in the past, and prevents a decrease in the reliability of the hybrid integrated circuit.

Embodiment FIGS. 1(a) and 1(b) are a plan view and a schematic front view of an automatic soldering apparatus showing an embodiment of the present invention. The automatic soldering apparatus of the present invention will be explained with reference to FIG.

In Fig. 1, flux is applied to the lead components inserted into the circuit board first in fluxer 1, the flux is dried in pre-heater section 2, and solder bath 3 is heated at 250°C ± 5°C.
While soldering is carried out with molten solder heated to 180°C, air is blown from the top of the circuit board by the solder melt prevention cooling fan 5 to bring the temperature of the top surface of the circuit board below 180°C. It cools the chip components and lead components mounted on the board and circuit board.

As described above, the solder of the chip components mounted on the top of the circuit board in the previous process is melted by the molten solder heated to 250°C ± 5°C in the solder bath 3 by the air blowing from the solder melt prevention cooling fan 5. prevent.

Effects of the Invention The present invention installs a cooling fan to prevent solder melting on the top of the solder tank and blows air, thereby reducing the temperature of the top surface of the circuit board of the chip components previously soldered to the top of the circuit board to be 180 degrees Celsius or less, thereby preventing the soldering of the chip components. This has the effect of preventing chips from melting and preventing soldering of chip parts from becoming defective.

[Brief explanation of the drawing]

Figure 1 + is a plan view of an automatic soldering device according to an embodiment of the present invention;
A schematic front view, Figure 2 is a plan view of a conventional automatic soldering device,
It is a schematic front view. 1... Fluxer, 2... Pre-heater section, 3... Solder bath, 4... Cooling fan,
5... Cooling fan to prevent solder melting. Name of agent: Patent attorney Toshio Nakao and 1 other person 1 - Fluxer 2 - Brihita department 3 - Hobo tank 4 - Imaru Faso

Claims (1)

[Claims] Automatic soldering characterized in that a cooling fan is installed above a molten solder bath in which lead parts are inserted into a circuit board on which chip parts have been mounted and molten soldered in advance, and the lead parts of the parts are soldered. Device.