JPH01230293A - Mounting equipment for semiconductor element - Google Patents
Mounting equipment for semiconductor elementInfo
- Publication number
- JPH01230293A JPH01230293A JP63056583A JP5658388A JPH01230293A JP H01230293 A JPH01230293 A JP H01230293A JP 63056583 A JP63056583 A JP 63056583A JP 5658388 A JP5658388 A JP 5658388A JP H01230293 A JPH01230293 A JP H01230293A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- leads
- hot air
- wiring board
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 238000007664 blowing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000005339 levitation Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 101100276984 Mus musculus Ccdc88c gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000026058 directional locomotion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、外部リードを有する半導体素子と配線基板と
を、手動、あるいは自動で半田付けにより接続する装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manually or automatically connecting a semiconductor element having external leads to a wiring board by soldering.
従来、外部リードを有する半導体素子の実′Ａ装置とし
ては第２図に示す様なりフロー炉が用いられていた。第
２図において、２１は赤外線ヒーター、あるいは遠赤外
線ヒーターなどの加熱装置ｎ、８は半導体素子、６は配
線基板、２２は半導体素子８と配線基板６とを搬送する
ベルトである。半導体装置８のリートと配線基板６の配
線パターンとの接合部には半田ペーストが印刷されてお
り、加熱装置２１の下あるいは間を通過する際に半田が
溶融し、後に冷却されて半田付け、すなわち接続が完了
する。Conventionally, a flow furnace as shown in FIG. 2 has been used as an apparatus for manufacturing semiconductor devices having external leads. In FIG. 2, 21 is a heating device n such as an infrared heater or a far-infrared heater, 8 is a semiconductor element, 6 is a wiring board, and 22 is a belt for conveying the semiconductor element 8 and the wiring board 6. Solder paste is printed on the joint between the lead of the semiconductor device 8 and the wiring pattern of the wiring board 6, and the solder melts when passing under or between the heating device 21, and is later cooled and soldered. In other words, the connection is completed.
また、最近では、ベーパーフェーズ類と呼ばれるＪＡ置
もあり、これは、半導体素子８と配線基板６が高温の不
活性蒸気中をベルトにより搬送されて半田付けが完了す
るものであった。Recently, there are also JA machines called vapor phase machines, in which the semiconductor element 8 and the wiring board 6 are conveyed by a belt through high-temperature inert vapor to complete soldering.
〔発明が解決しようとする課題］
しかし、前述の従来技術では、印刷された半田ペースト
を加熱、溶融すべき接続部のみならず、゛１１導体素子
８及び配線基板６全体が加熱されることになる。その結
果、半導体素子内部のシリコンチップと樹脂封止材との
間の熱膨張率の差により、゛１６導体装：ｎ内部に欠陥
を生じて信頼性を著しく低下させる。また、湿度により
ｆ！Ｉｔ指封止材が吸湿している場合には、熱により樹
脂対１Ｌ材中の水蒸気が膨張して樹脂封＋ｈ材が破裂し
、クラックを生じるという問題点を有する。[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, the printed solder paste is heated and not only the connecting portions to be melted, but also the entire conductor element 8 and wiring board 6 are heated. Become. As a result, the difference in thermal expansion coefficient between the silicon chip and the resin sealing material inside the semiconductor element causes defects inside the conductor package, significantly reducing reliability. Also, depending on the humidity, f! If the It finger sealing material absorbs moisture, there is a problem in that the water vapor in the resin 1L material expands due to heat, causing the resin sealing material to burst and cracks to occur.
また、配線基板６においては、全体的に加熱されるため
にそりが発生し、冷却した後もそった状態が残るという
問題点を有する。Further, the wiring board 6 has a problem in that warpage occurs because the entire wiring board 6 is heated, and the warp remains even after cooling.
そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは、半導体素子と配線基板の接続部
のみを集中加熱して半田を溶融することにより、信頼性
の高い接続を行うことができ、さらに自動で前記接続を
行なうことができる、半導体素子の実装袋；ｎを提供す
るところにある。The present invention is intended to solve these problems, and its purpose is to achieve a highly reliable connection by heating only the connection area between the semiconductor element and the wiring board to melt the solder. Another object of the present invention is to provide a mounting bag for a semiconductor element, which can perform the above-mentioned connections automatically.
本発明の半導体素子の実装装置は、
（１）リードが少なくとも１方向に延在する半導体素子
のリードに対応した配線パターンにあらかじめ半田ペー
ストが印刷された配線基板上に、前記半導体素子のリー
ドと配線基板の前記配線パターンとを位置合せしてマウ
ントし、ノズルより吹き出る熱風を前記半導体素子のリ
ードに吹きつけて半田ペーストを溶融せしめることを特
徴とする。The semiconductor element mounting apparatus of the present invention includes: (1) The leads of the semiconductor element and the leads of the semiconductor element are mounted on a wiring board on which solder paste is printed in advance on a wiring pattern corresponding to the leads of the semiconductor element, in which the leads extend in at least one direction. The method is characterized in that the wiring board is aligned with the wiring pattern and mounted, and hot air blown from a nozzle is blown onto the leads of the semiconductor element to melt the solder paste.
（２）半導体素子のリードと、そのリードに対応した配
線基板上の配線パターンの一方あるいは両方を画像認識
し、位；ｎずれを補正することにより位１ａ合せを行う
ことを特徴とする。(2) It is characterized in that the position 1a is aligned by image-recognizing one or both of the leads of the semiconductor element and the wiring pattern on the wiring board corresponding to the leads, and correcting the position;n deviation.
（３）半導体メモリーに記録されたデータによって、熱
風の吹き出すノズルが前記半導体素子のリード上を移動
することを特徴とする。(3) A nozzle blowing out hot air moves over the leads of the semiconductor element according to data recorded in the semiconductor memory.
（４）前記半導体素子がマウントされた配線基板を搭・
戎したテーブルが移動して、前記半導体素子のリードが
熱風の吹き出すノズルの下を通過することを特徴とする
。(4) Mounting the wiring board on which the semiconductor element is mounted.
The present invention is characterized in that the clamped table moves so that the leads of the semiconductor element pass under a nozzle from which hot air is blown.
（５）前記熱風が吹き出るノズルをｍ数個有し、半導体
素子の複数箇所のリードに同時に熱風を吹きつけること
を特徴とする。(5) It is characterized in that it has several m nozzles from which the hot air is blown, and the hot air is blown onto the leads at a plurality of locations of the semiconductor element at the same time.
〔実 施 例］
第１図は本発明の実施例における半導体素子の実装装置
の構成図である。プリズム１は半導体素子８をビデオカ
メラ２で撮影するための台形のプリズムである。プリズ
ム３は配線基板６をビデオカメラ４で撮影するための平
行四辺形のプリズムである。半導体素子８を手動で配線
基板６にマウントするためには、半導体素子８を撮影す
るビデオカメラ２の映像出力と配線基板６を撮影するビ
デオカメラ４の映像出力とをビデオミキサーにより混成
してモニタ画面５に映像を重ねて映し出す０次に、半導
体素子８のリードと配線基板６の配線パターン７が一致
する様にアライメント用Ｘ−Ｙテーブル１０によって配
線基板６を移動する。ここで、配線基板６は半導体素子
のリートと対応するパターンに、半田ペーストが印刷さ
れたものを用いる。[Embodiment] FIG. 1 is a configuration diagram of a semiconductor element mounting apparatus in an embodiment of the present invention. The prism 1 is a trapezoidal prism for photographing the semiconductor element 8 with the video camera 2. The prism 3 is a parallelogram prism for photographing the wiring board 6 with the video camera 4. In order to manually mount the semiconductor element 8 on the wiring board 6, the video output of the video camera 2 that photographs the semiconductor element 8 and the video output of the video camera 4 that photographs the wiring board 6 are combined by a video mixer and monitored. Next, the wiring board 6 is moved by the alignment X-Y table 10 so that the leads of the semiconductor element 8 and the wiring pattern 7 of the wiring board 6 match. Here, the wiring board 6 used is one in which solder paste is printed in a pattern corresponding to the lead of the semiconductor element.
次に、プリズムｌ、プリズム３を、それぞれ矢印１０１
、矢印１０３の方向に開き、Ｚ軸アーム９を配線基板６
に降ろし、半導体素子８をマウントする。この様にして
半導体素子８をマウントした基板６は、リフロー用Ｘ−
Ｙデープル１１に移動され、リフロー工程に入る。Next, mark prism l and prism 3 with arrows 101 and 101, respectively.
, open in the direction of arrow 103, and connect Z-axis arm 9 to wiring board 6.
and mount the semiconductor element 8 thereon. The substrate 6 on which the semiconductor element 8 is mounted in this manner is
It is moved to the Y daple 11 and enters the reflow process.
リフロ一部は、リフロー川テーブル１１．熱風ノズル１
２．２軸アーム１３により構成される。The reflow part is the reflow river table 11. hot air nozzle 1
2. Consists of a two-axis arm 13.
リフロー用テーブルｌｌは、熱風ノズル１２の下を半導
体素子８のリードが通過する様に、あらかじめ記録され
たデータに基づいて移動する。熱風ノズル１２からは、
窒素などの不活性ガスがヒーターにより２００℃〜３０
０℃に加熱されて噴き出す。使用する気体は、溶融する
半田の表面の酸化を防止する為に不活性ガスが望ましい
。The reflow table 11 moves based on prerecorded data so that the leads of the semiconductor element 8 pass under the hot air nozzle 12. From the hot air nozzle 12,
Inert gas such as nitrogen is heated to 200℃~30℃ using a heater.
It is heated to 0℃ and spews out. The gas used is preferably an inert gas in order to prevent oxidation of the surface of the melted solder.
Ｚ軸アーム１３は、Ｚ軸方向にト下し、半田ペーストを
リフローする際には、熱風ノズル１２の先端が半導体素
子８のリート付近に位置するまで降下し、リフローが終
わると上昇、定位置に戻る。The Z-axis arm 13 is lowered in the Z-axis direction, and when reflowing the solder paste, descends until the tip of the hot air nozzle 12 is located near the lead of the semiconductor element 8, and when the reflow is finished, rises and returns to the fixed position. Return to
第１図に示す様に５熱風ノズル１２を２個設けることに
より、２辺から突出した半導体素子８のリードを２辺同
時にリフローすることが可能であり、半導体素子８のリ
フロー後の傾き、リード浮きを防Ｉトすることができる
。また、さらに熱風ノズル１２を追加することによって
、複数個の半導体素子８あるいはチップ部品などを同時
にリフロー゛ｌ−］口付けをすることが可能になる。By providing two hot air nozzles 12 as shown in FIG. 1, it is possible to reflow the leads of the semiconductor element 8 protruding from two sides at the same time on both sides. Can prevent floating. Furthermore, by adding a hot air nozzle 12, it becomes possible to reflow a plurality of semiconductor elements 8 or chip components at the same time.
以上の構成は、マウント部の位置合せ、リフロ一部のり
フロー位置移動ともに配線基板６を固定したＸ−Ｙテー
ブル１０．１１を移動することにより行なうが、ｚ軸ア
ーム９及び１３にＸ−Ｙ方向の移動装置を付加すれば、
第１図に示すＸ−Ｙテーブル１０及び１１をマウント部
からりフロ一部へ基板を移動するヘルドに変更すること
ができ、これによりマウント５リフローの連り′Ｃ処即
が可能になり、素子実装の高速化が計れる。The above configuration is performed by moving the X-Y table 10.11 on which the wiring board 6 is fixed, for both alignment of the mount part and movement of the reflow flow position. If you add a directional movement device,
The X-Y tables 10 and 11 shown in FIG. 1 can be changed to a heald for moving the board from the mount part to the reflow part, thereby making it possible to perform the mount 5 reflow process. It is possible to speed up element mounting.
ここで、ビデオカメラ２．４及びプリズムｌ、；３も、
２輔アーム９と同じ移動装置に取付けられており、Ｘ−
Ｙ方向の移動を行なっても、正常に半導体素子のリート
及び配線基板の認識を行うことができる。Here, the video camera 2.4 and the prism l;
It is attached to the same moving device as the second arm 9, and
Even if the device is moved in the Y direction, it is possible to correctly recognize the semiconductor element lead and the wiring board.
［発明の効果］
（１）以」ユ述べたように本発明は５ノズルから吹き出
す熱風により半田ペーストを溶融して′４６導体素子の
リードと配線基板を接続するので、熱が加わるのは半導
体素子のリートと配線基板だけであるため、半導体チッ
プ及び封止樹脂にはほとんど熱的ストレスが加わらない
。したがって、半導体チップの破壊、封止樹脂のクラッ
ク等が発生せず、信顧性の高い半田付けを行うことがで
きる。[Effects of the Invention] (1) As mentioned above, in the present invention, the hot air blown from the five nozzles melts the solder paste to connect the leads of the '46 conductor element and the wiring board, so the heat is applied only to the semiconductor. Since there are only the element leads and the wiring board, almost no thermal stress is applied to the semiconductor chip and the sealing resin. Therefore, the semiconductor chip is not destroyed, the sealing resin is not cracked, and highly reliable soldering can be performed.
（２）半導体素子のリードと、そのリードに対応した配
線基板上の配線パターンを画像認識して位置合せを行う
ため、位置ずれが礪めて少ない。(2) Since the leads of the semiconductor element and the wiring pattern on the wiring board corresponding to the leads are aligned by image recognition, misalignment is reduced.
（３）記憶装置に記録されたデータにもとづいて、熱風
の吹き出すノズルが半導体素子のリード上を移動するた
め、半田ペーストを確実に溶融することができる。(3) Since the hot air blowing nozzle moves over the leads of the semiconductor element based on the data recorded in the storage device, the solder paste can be reliably melted.
（４）熱風が吹き出すノズルを複数個有することにより
、複数の半導体素子を同時に半田付けすることができる
。また、１個の半導体素子については２辺以上の辺に延
在するリードを同時に加熱、半［Ｈペーストを溶融する
ため、リード浮きや半導体素子の傾きが発生しない。(4) By having a plurality of nozzles from which hot air is blown, a plurality of semiconductor elements can be soldered simultaneously. Further, since the leads extending on two or more sides of one semiconductor element are simultaneously heated and the half-[H paste is melted, floating of the leads and tilting of the semiconductor element do not occur.
第１図は、本発明の半導体素子の実装装置の構成を示す
正面図、第２図は従来、半１１ペースト溶融に用いてい
たりフロー類の断面図。
１．３・・・プリズム
２．４・・・ビデオカメラ
５・・・・・モニターカメラ
６・・・・・配線基板
７・・・・・配線パターン
８・・・・・半導体素子
９．１３・・Ｚ軸アーム
ｌ０１１１−−Ｘ−Ｙテーブル
１２・・・・・熱風ノズル
以」二
出願人 セイコーエプソン株式会社FIG. 1 is a front view showing the configuration of a semiconductor element mounting apparatus according to the present invention, and FIG. 2 is a sectional view of a flow type conventionally used for melting semi-11 paste. 1.3... Prism 2.4... Video camera 5... Monitor camera 6... Wiring board 7... Wiring pattern 8... Semiconductor element 9.13 ...Z-axis arm 10111--X-Y table 12...Hot air nozzle 2 Applicant: Seiko Epson Corporation
Claims (5)
のリードに対応した配線パターンにあらかじめ半田ペー
ストが印刷された配線基板上に、前記半導体素子のリー
ドと配線基板の前記配線パターンとを位置合せしてマウ
ントし、ノズルより吹き出る熱風を前記半導体素子のリ
ードに吹きつけて半田ペーストを溶融せしめることを特
徴とする半導体素子の実装装置。(1) Align the leads of the semiconductor element and the wiring pattern of the wiring board on a wiring board on which solder paste is printed in advance on a wiring pattern corresponding to the lead of a semiconductor element whose leads extend in at least one direction. 1. A mounting apparatus for a semiconductor element, characterized in that the semiconductor element is mounted by blowing hot air blown from a nozzle onto the leads of the semiconductor element to melt the solder paste.
線基板上の配線パターンの一方あるいは両方を画像認識
し、位置ずれを補正することにより位置合せを行うこと
を特徴とする第１項記載の半導体素子の実装装置。(2) The method according to item 1, wherein alignment is performed by image-recognizing one or both of the leads of the semiconductor element and the wiring pattern on the wiring board corresponding to the leads and correcting positional deviations. Semiconductor element mounting equipment.
ータによって、熱風の吹き出すノズルが前記半導体素子
のリード上を移動することを特徴とする第１項記載の半
導体素子の実装装置。(3) The semiconductor element mounting apparatus according to item 1, wherein a nozzle blowing out hot air moves over the leads of the semiconductor element according to data recorded on a semiconductor memory, a magnetic tape, or the like.
したテーブルが移動して、前記半導体素子のリードが熱
風の吹き出すノズルの下を通過することを特徴とする第
１項記載の半導体素子の実装装置。(4) The mounting of the semiconductor element according to item 1, wherein the table on which the wiring board on which the semiconductor element is mounted moves, and the leads of the semiconductor element pass under a nozzle that blows out hot air. Device.
素子の複数箇所のリードに同時に熱風を吹きつけること
を特徴とする第１項記載の半導体素子の実装装置。(5) The semiconductor element mounting apparatus according to item 1, wherein the semiconductor element mounting apparatus has a plurality of nozzles from which the hot air is blown, and the hot air is blown onto leads at a plurality of places of the semiconductor element at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63056583A JPH01230293A (en) | 1988-03-10 | 1988-03-10 | Mounting equipment for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63056583A JPH01230293A (en) | 1988-03-10 | 1988-03-10 | Mounting equipment for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01230293A true JPH01230293A (en) | 1989-09-13 |
Family
ID=13031192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63056583A Pending JPH01230293A (en) | 1988-03-10 | 1988-03-10 | Mounting equipment for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01230293A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100349895B1 (en) * | 1994-08-29 | 2002-12-11 | 삼성에스디아이 주식회사 | Method and apparatus for soldering film type electronic component |
| JP2008198925A (en) * | 2007-02-15 | 2008-08-28 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic component |
-
1988
- 1988-03-10 JP JP63056583A patent/JPH01230293A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100349895B1 (en) * | 1994-08-29 | 2002-12-11 | 삼성에스디아이 주식회사 | Method and apparatus for soldering film type electronic component |
| JP2008198925A (en) * | 2007-02-15 | 2008-08-28 | Matsushita Electric Ind Co Ltd | Apparatus and method for mounting electronic component |
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