JP2001287027A - Soldering apparatus and preheating method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering apparatus which can reduce the cost and the set man-hours and reliably perform the preheating. SOLUTION: A plurality of guide nozzles 5 for jetting the molten solder 8 are provided on a nozzle jig 6 provided on a molten solder tank 9. A printed circuit board 2 set on a set frame 10 is lowered, and each portion 3a to be soldered is guided to the soldering position close to the position immediately above each guide nozzle 5. By detecting the soldering position, the printed circuit board 2 is held for a predetermined time at the soldering position and preheated until the molten solder 8 is jetted out. Then, the molten solder 8 is jetted out of each guide nozzle 5 to solder each portion 3a to be soldered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus suitable for soldering a plurality of components with leads on a printed circuit board and a method for preheating the same.

[0002]

2. Description of the Related Art Conventionally, there is a so-called multi-point solder as this type of soldering apparatus. For example, as shown in FIG. 6, a printed circuit board 2 on which chip components 1 such as transistors are surface-mounted on both sides by reflow soldering.
On the other hand, as shown in FIG. 7, it is used when performing soldering at a plurality of spots, such as when attaching a plurality of leaded components 3 such as capacitors.

As shown in FIG. 8, this soldering apparatus has a nozzle jig provided with guide nozzles 5 for guiding the molten solder to be jetted, corresponding to the mounting position of the leaded component 3 to be soldered. FIG. 2
As shown in FIG. 5, the nozzle jig 6 is mounted at a predetermined position of a molten solder tank 9 in which the molten solder 8 is stored.

A set frame 10 on which the printed circuit board 2 as a member to be soldered is set in a mounted state is provided above the molten solder tank 9, and the molten solder 8 is placed in the molten solder tank 9. A drive motor as a jet mechanism for jetting from each guide nozzle 5 of the nozzle jig 6, a jet fan 12 rotated by the drive motor, and the like are provided at appropriate positions.

In FIGS. 2 to 5, only a single component 3 with a lead and a guide nozzle 5 are shown, and other components 3 with a lead and a guide nozzle 5 are omitted.

Next, a description will be given of processing steps in the conventional soldering using this soldering apparatus.

As shown in FIG. 9, the soldering process includes a preheating step T1 for preheating (preheating) the printed board 2 on which the components 3 with leads are mounted, and a preheated printed board 2 A setting step T2 for setting the frame 10 and a lowering step T for lowering the set frame 10
3, a flow step T4 for soldering the soldering target portions 3a of the components 3 with leads on the printed circuit board 2 with the molten solder 8, and an extracting step T5 for taking out the printed circuit board 2 after the soldering is completed. .

In the preheating step T1, the printed circuit board 2 in a state where the components 3 with leads are mounted at predetermined positions is preheated by a separately disposed preheating device.

In the setting step T2, the preheated printed circuit board 2 is taken out of the preheating device, and is set in the set frame 10 as shown in FIG. 2, and the start switch of the device is turned on.

In the lowering step T3, the set frame 10 is lowered by turning on the start switch, and the lowering position of the set frame 10 is detected by an appropriately provided sensor to stop the lowering operation. As shown in FIG. 3, the soldering target portions 3a of the parts 3 with leads on the printed circuit board 2 arrive at the soldering positions close to the positions directly above the guide nozzles 5, respectively.

In the flow step T4, the drive of the drive motor is started based on the detection signal obtained by detecting the lower limit position by the sensor, and the jet fan 12 is driven to rotate. As shown in FIG. 4, the molten solder 8 in the molten solder tank 9 is agitated and guided into each guide nozzle 5 by the rotational drive of the jet fan 12, and is jetted from each guide nozzle 5. Then, the molten solder 8 jetted from each of the guide nozzles 5 comes into contact with each of the soldering target portions 3a, and the respective soldering target portions 3a are soldered by the melting solder 8, respectively. Is stopped.

In the take-out step T5, after the flow step T4 is completed, as shown in FIG. 5, the set frame 10 is raised to the initial raised position, and the soldered printed circuit board 2 is taken out of the set frame 10. Here, a series of soldering steps is completed.

[0013]

However, according to the conventional soldering process, the printed circuit board 2 is preheated by a separately provided preheating device before soldering by the soldering device. Need
A separate preheating device is required, and after the printed circuit board 2 is set in the preheating device and preheated, it is necessary to take out the printed circuit board 2 from the preheating device and set it in the set frame 10 of the soldering device. There is also a problem that it takes time and heat is released before the printed circuit board 2 taken out of the preheating device is set on the set frame 10.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a soldering apparatus and a method for preheating the soldering apparatus, which can reduce the equipment cost and the number of setting steps, and more reliably perform the preheating.

[0015]

A technical means for solving the above-mentioned problem is that a nozzle jig provided in a molten solder tank is provided with a plurality of guide nozzles for a molten solder jet and set on a set frame. The lowering of the soldering target member, the plurality of soldering target portions of the soldering target member are guided to the soldering positions approaching the positions directly above the respective guide nozzles, and at this soldering position, the respective guide nozzles In the soldering device in which the molten solder is jetted and soldering is performed on each soldering target portion, in the processing step of the control unit of the soldering device, by detecting the soldering position of the soldering target member by the descending operation. ,
There is provided a timer preheating step for holding the member to be soldered at the soldering position for a certain period of time before the molten solder is jetted from each of the guide nozzles.

In the preheating method using the apparatus, a predetermined preheating time is maintained until the molten solder is jetted from each of the guide nozzles at the soldering position of the member to be soldered. The point is that each soldering target portion of the member is preheated by the heat of the molten solder.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. The same components as those described above are denoted by the same reference numerals, and description thereof will be omitted.

FIG. 1 shows a soldering process in a control unit of the present soldering apparatus. A printed board 2 as an example of a soldering target member on which each of the parts 3 with leads is mounted is set in a set frame 10. Setting step U1,
A lowering step U2 for lowering the set frame 10; a timer preheating step U3 for preheating each soldering target portion 3a of the printed circuit board 2 into which leads such as the components 3 with leads are inserted; It comprises a flow step U4 for soldering each soldering target portion 3a with the molten solder 8, and an unloading step U5 for taking out the printed circuit board 2 after the soldering is completed.

That is, in the setting step U1, as shown in FIG. 2, the printed circuit board 2 on which the components 3 with leads are respectively mounted at predetermined positions is set on the set frame 10 and appropriately positioned. Turn on the start switch provided in the system.

In the lowering step U2, the set frame 10 is lowered by detecting the ON operation of the start switch,
The lowering operation of the set frame 10 is stopped by detecting the lower limit position of the set frame 10 by a sensor provided as appropriate, and as shown in FIG. It arrives at the soldering position close to the position directly above each guide nozzle 5, respectively.

In the timer preheating step U3, the preheating timer is activated based on the detection signal by the detection of the lower limit position by the sensor, and the soldering shown in FIG. 3 is continued until the preheating time set by the preheating timer elapses. The state held for a fixed time at the attachment position is maintained. At this time, the heat of the lower molten solder 8 is guided upward through the respective guide nozzles 5, and the respective soldering target portions 3a located immediately above the respective guide nozzles 5 are efficiently preheated.

The preheating time by the preheating timer can be freely changed as appropriate, and the time required for preheating the respective soldering target portions 3a to an appropriate temperature may be appropriately set according to the type of the product.

In the flow step U4, when it is detected that the preheating time by the operation of the preheating timer has elapsed, the drive of the drive motor is started, and the jet fan 12 is driven to rotate. As shown in FIG. 4, the molten solder 8 in the molten solder tank 9 is agitated and guided into each guide nozzle 5 by the rotational drive of the jet fan 12, and is jetted from each guide nozzle 5.

Then, the molten solder 8 jetted from each of the guide nozzles 5 comes into contact with each of the soldering target portions 3a, and each of the soldering target portions 3a is soldered by the melting solder 8, and after a predetermined time elapses by a timer. Then, the drive motor is stopped.

In the unloading step U5, after the flow step T4 is completed, as shown in FIG. 5, the set frame 10 is raised to the initial raised position, and the soldered printed circuit board 2 is removed from the set frame 10. Here, a series of soldering steps is completed.

As described above, according to the present embodiment, each soldering target portion 3a of the printed circuit board 2 is held between the lowering step U2 and the flow step U4 at the soldering position for a certain period of time. A timer preheating step U3 for efficiently preheating by utilizing the heat of No. 8 is provided, and unlike the conventional case, there is no need to separately provide a preheating device other than the soldering device, so that the equipment cost can be reduced.

Further, the printed circuit board 2 in a state in which the respective leaded components 3 are respectively mounted at predetermined positions on the set frame 10 may be directly set. Take out and set frame 10
It is not necessary to set again, so that the setting man-hour can be reduced and the labor can be reduced.

Further, when preheating the respective soldering target portions 3a, the preheating is performed at the soldering position, and after the preheating is completed, the soldering target portions 3a are subjected to a flow process U4 as a next process.
Since the soldering of a is immediately started, escape of heat due to preheating can be effectively prevented, preheating can be performed more reliably, and there is an advantage that good soldering is performed by the preheating effect.

The preheating time in the timer preheating step U3 and the jetting time of the molten solder 8 in the flow step U4 may be set appropriately to the optimum time according to the soldering target portion 3a of the target product. By configuring the time to be freely changeable, it is possible to respond to various products,
The versatility can be improved.

The printed board 2 is shown as a member to be soldered, and the portion of the leaded component 3 into which the lead is inserted is shown as the soldered part. The present invention is not limited to the case of soldering, but can be similarly applied to products requiring similar soldering.

[0031]

As described above, according to the soldering apparatus and the method for preheating the same according to the present invention, it is possible to detect the soldering position of the member to be soldered by the descending operation in the processing step of the control unit of the soldering apparatus. Before the molten solder is jetted from each of the guide nozzles, a timer preheating step of holding the soldering target member at the soldering position for a predetermined time is provided, and the melting soldering is performed at the soldering position of the soldering target member. Before jetting from each guide nozzle, it is a method of holding a predetermined preheating time and preheating each soldering target portion of the soldering target member by the heat of the molten solder, so there is no need to separately provide a preheating device, Equipment costs can be reduced, and the number of set man-hours can be reduced.
There is an advantage that labor can be reduced.

Also, when preheating each soldering target portion, the preheating is performed at the soldering position and the soldering is performed after the preheating is completed, so that the escape of heat due to the preheating can be effectively prevented, and the preheating can be more reliably performed. There is also an advantage that good soldering can be performed by the preheating effect.

[Brief description of the drawings]

FIG. 1 is a process chart according to an embodiment of the present invention.

FIG. 2 is an operation explanatory view of the soldering device.

FIG. 3 is an operation explanatory view of the soldering device.

FIG. 4 is an operation explanatory view of the soldering device.

FIG. 5 is an operation explanatory view of the soldering device.

FIG. 6 is a side view of a printed circuit board on which chip components are surface-mounted.

FIG. 7 is a side view of a printed circuit board on which components with leads are mounted.

FIG. 8 is a perspective view of a main part of a nozzle jig.

FIG. 9 is a process chart in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip component 2 Printed circuit board 3 Leaded component 3a Soldering target part 5 Guide nozzle 6 Nozzle jig 8 Melting solder 9 Melting solder tank 10 Set frame 12 Jet fan

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Claims (2)

[Claims] 1. A nozzle jig provided in a molten solder tank is provided with a plurality of guide nozzles for jetting molten solder, and a member to be soldered set in a set frame is lowered to operate the member to be soldered. A plurality of soldering target portions are guided to the soldering positions approaching the positions directly above the respective guide nozzles, and molten solder is jetted from the respective guide nozzles at the soldering positions to perform soldering on the respective soldering target portions. In the processing step of the control section of the soldering device, the soldering position is detected by detecting the soldering position of the soldering target member by the descending operation. A soldering apparatus comprising a timer preheating step for holding a member to be soldered at a soldering position for a predetermined time. 2. A nozzle jig provided in a molten solder tank is provided with a plurality of guide nozzles for jetting molten solder, and the member to be soldered set in the set frame is lowered to operate the member to be soldered. A plurality of soldering target portions are guided to the soldering positions approaching the positions directly above the respective guide nozzles, and molten solder is jetted from the respective guide nozzles at the soldering positions to perform soldering on the respective soldering target portions. At the soldering position of the soldering target member, a predetermined preheating time is maintained until the molten solder is jetted from each of the guide nozzles, and each soldering target portion of the soldering target member is held. A preheating method for a soldering device, comprising preheating by the heat of molten solder.