JPH11145698A - Apparatus and method for mounting electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the pitch time by reducing the time for disposing electronic parts. SOLUTION: Devices 2a and 2b for picking up parts image are placed near portions 3a and 3b for disposing parts, respectively. Thus, this method has less time for moving a parts holding head to the portion for disposing parts than the conventional method for mounting electronic parts which includes a method for disposing parts by an apparatus for mounting electronic parts provided with one portion for disposing of parts for a plurality of devices for picking up parts image, which can shorten the pitch time to improve production capability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of discarding a component when the result of measuring the holding posture of the electronic component is abnormal, and an electronic component mounting apparatus provided with a component discarding unit.

[0002]

2. Description of the Related Art In recent years, an electronic component mounting apparatus has been required to mount electronic components on an electronic circuit board quickly and accurately to improve the mounting quality.

Hereinafter, an example of a conventional electronic component mounting apparatus will be described with reference to FIG.

A conventional electronic component mounting apparatus 10 shown in FIG.
A board transport device 4 for loading and unloading a circuit board, a front component supply device 32a having a plurality of component supply units,
X, Y, comprising a rear part supply device 32b, a head unit 8 having a mechanism capable of loading a desired suction nozzle, and a mechanism capable of vertically moving and rotating the loaded suction nozzle, and a board recognition camera 9. An XY robot 5 that can move in the direction, a front component imaging device 2a for electronic components, a rear component imaging device 2b, and a component discarding unit 3 for discarding components when the component posture measurement result is abnormal.

The operation of the conventional electronic component mounting apparatus 10 operates as follows. The circuit board is carried into the mounting position by the board transfer device 4. The XY robot 5 moves the board recognition camera 9 on the circuit board and checks the position where the board is to be mounted. Next, the XY robot 5 moves the board recognition camera 9 onto the front component supply device 32a and the rear component supply unit 32b, and after recognizing a component to be held, causes the nozzle 8 to hold the electronic component 33. The electronic component 33 held by the nozzle 8 is photographed by the front component imaging device 2a or the rear component imaging device 2b installed at the shortest distance from the held position, and the holding posture of the component is measured.
Determine the result. Next, if the measurement result of the holding posture of the component is normal, the position of the component is corrected based on the obtained image information, and then the XY robot 5 is moved to the electronic component 33.
Is mounted on the circuit board. However, if the component holding posture result is abnormal, the XY robot 5 is moved to the installed component discarding unit 3 and the electronic component 3 held by the nozzle 8 is moved.
Discard 3

[0006]

FIG. 3 shows, as described above,
As an example of conventional equipment, an electronic component mounting device 10 having two electronic component imaging devices 2 and one component disposal unit 3
Is shown.

The operation after recognition of the circuit board in the conventional electronic component mounting apparatus 10 will be described in detail below. When mounting the component in the rear component supply device 32b, after recognizing the component to be held, the electronic component 33 is held in the nozzle 8, and the holding posture is measured by the rear component imaging device 2b located at the shortest distance. Is determined. If the determination result of the holding posture is abnormal, the electronic component 33 held by the component holding device 6
Is moved in the X and Y directions by the XY robot 5, and the component is discarded by the component discarding unit 3 provided in the equipment. However, when mounting a component in the front component supply device 32a, the posture measurement of the holding component in the front component imaging device 2a,
After the result judgment, when the component holding posture is abnormal, the XY robot 5
Is moved in the X and Y directions, and in the step of discarding the component in the component discarding unit 3, time is spent for moving the component holding device 6 to the component discarded component 3.

As described above, in the electronic component mounting apparatus 10 including the conventional component discarding unit 3, in the component discarding process when the component posture measurement result is abnormal, the component holding unit 6 moves the X, X, There is a problem that the time of moving in the Y direction contributes to an increase in the tact time, which leads to a reduction in production capacity.

The present invention has been made to solve this problem, and eliminates the movement of the component holding device at the time of discarding the component, eliminating the time associated with the movement, thereby preventing the tact time from increasing. It is an object of the present invention to provide an electronic component mounting apparatus including a plurality of component imaging devices and a plurality of component discarding units, and an electronic component mounting method using the plurality of component discarding units.

[0010]

According to a first aspect of the present invention, a plurality of component discarding units are provided near each of a plurality of component imaging devices.

An electronic component mounting method according to a second aspect of the present invention comprises:
When the component posture measurement result is abnormal, the component imaging apparatus of the first aspect and the component disposal unit are handled.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an electronic component mounting apparatus having a component imaging device and a component disposal unit in the vicinity thereof, and an electronic component mounting method using the component disposal unit, according to an embodiment of the present invention. This will be described below with reference to FIG.

In the drawings, the same components are denoted by the same reference numerals. Further, in the present embodiment, an electronic component mounting apparatus and an electronic component mounting method in which an electronic component corresponding to a component is automatically mounted on a circuit board after being held by a nozzle provided in the component holding device are described. take.

First, an electronic component mounting apparatus provided with a component discarding unit in one-to-one correspondence with the component imaging apparatus according to the embodiment will be described.

As shown in FIG. 1, the front parts disposal part 3a and the rear parts disposal part 3b of this embodiment are respectively composed of a front parts disposal conveyor 30a, a rear parts disposal conveyor 30b, a front parts disposal box 31a, and a rear part. And a parts disposal conveyor 31b. The front discard box 31a and the rear discard box 31b are used for discarding relatively inexpensive electronic components, and the front discard conveyor 30a and the rear discard conveyor 30b are used for discarding expensive electronic components. Further, as shown in the equipment layout diagram of FIG. 2, the front component discarding unit 3a and the rear component discarding unit 3b are located near each of the front component imaging device 2a and the rear component imaging device 2b. Further, the front component discarding unit 3a is located near the front component imaging device 2a, and the rear component discarding unit 3b is located near the rear component imaging device 2b. The front component disposal conveyor 30a and the rear component disposal conveyor 30b have a mechanism capable of intermittently feeding a predetermined pitch when electronic components are discarded.

The front part disposal section 3 installed in this manner.
In the present embodiment, the rear component disposal unit 3b is used in the electronic component mounting apparatus 1 having a configuration as shown in FIG.

Next, a description will be given of the electronic component mounting apparatus 1 provided with the above-described front component discarding unit 3a, rear component discarding unit 3b, front component imaging device 2a, and rear component imaging device 2b. The component mounting apparatus 1 for electronic components is used for loading a circuit board,
At the time of unloading and component mounting, the board transfer device 4 for holding the circuit board, the front electronic component supply device 32a containing the electronic components 33 to be mounted, and the electronic component 33 held from the rear electronic component supply device 32b are mounted on the circuit board. A component holding device 6 that can be moved to the mounting position in the X and Y directions by the XY robot 5, a front component imaging device 2a that captures and measures the holding posture of the electronic component 33 held by the component holding device 6, and a rear component imaging device 2b and at least a control device for controlling the operation of the XY robot 5, the component holding device 6, the front component imaging device 2a, and the rear component imaging device 2b. The component holding device 6 includes a nozzle 8 for holding an electronic component by, for example, suction, and a board recognition camera 9 for imaging and recognizing a board mark written at a component mounting position on a circuit board. Is provided.

Next, regarding the operation of the electronic component mounting apparatus 1, mainly the front component imaging device 2a, the rear component imaging device 2
The operation of the electronic component mounting apparatus 1 after the completion of the measurement of the component holding posture by b will be mainly described below.

When mounting the components of the front component supply device 32a, the XY robot 5 moves the component holding device 6 to X, Y
The electronic component 33 is moved onto the electronic component supply device 32a while moving in the direction, and the electronic component 33 is held and sucked by the nozzle 8. Next, the XY robot 5 moves the component holding device 6 holding the electronic component 33 to the suction nozzle 8 in the X and Y directions to the front component imaging device 2a located at the shortest distance from the holding position. The holding posture of the held electronic component 33 is measured, and the result is determined. If the holding posture determination result of the electronic component 33 is normal, the component holding device 6 holding the electronic component 33 on the suction nozzle 8 is set to the
It is mounted on a desired electronic circuit board by moving in the Y direction.

However, if there is an abnormality in the component holding posture determination result by the front component imaging device 2a, the component holding device 6 is transferred to the front component disposal unit 3a installed near the front component imaging device 2a that measured the component. The electronic component 33 is discarded by being moved by the XY robot 5. At that time, the waste conveyor 30a is intermittently fed at a predetermined pitch.

Similarly, when mounting the components of the rear component supply device 32b, after holding the electronic component 33 by the component holding device 6, the electronic component 33 held by the rear component imaging device 2b located at the shortest distance from the holding position. After measuring the holding posture of the component 33 and determining the result, if there is an abnormality in the component holding posture determination result, the component holding device 6 is moved to the rear component disposal unit 3b,
Discard parts.

As described above, according to the present embodiment, by using the front component imaging device 2a and the front component discarding unit 3a, and using the rear component imaging device 2b and the rear component discarding unit 3b, the component holding posture measurement result when abnormal is detected. In the component disposal process, the time associated with moving the component holding device 6 can be eliminated.
As a result, the tact can be shortened.

[0023]

As described above in detail, an electronic component mounting apparatus provided with a plurality of component imaging devices, a plurality of component discarding units according to the first aspect of the present invention, and an electronic component mounting method according to the second aspect. According to, when there is an abnormality in the measurement result of the component holding posture,
The time required to move the component holding device having the head unit to the component disposal unit can be eliminated, and the tact time can be reduced, and as a result, the production capacity is improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of the electronic component mounting apparatus.

FIG. 3 is a perspective view of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component mounting device 2a front component imaging device 2b rear component imaging device 3a front component discarding unit 3b rear component discarding unit 4 component transport device 5 XY robot 6 component holding device 8 nozzle unit 9 board recognition camera 10 conventional electronic component mounting device 30a front parts disposal conveyor 30b rear parts disposal conveyor 31a front parts disposal box 31b rear parts disposal box 32a front parts supply device 32b rear parts supply device

 ──────────────────────────────────────────────────の Continuing on the front page (72) Osamu Okuda, Inventor 1006 Odakadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor ▲ Yoshi ▼ Yoshihiro Tadashi 1006, Odori Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. In company

Claims (3)

[Claims] A means for supplying an electronic component; a circuit board supporting means for fixing a circuit board on which the electronic component is mounted in a fixed position; and a predetermined position on the circuit board for attracting a desired electronic component from the component supply means. The suction head to be mounted, a plurality of component imaging devices capable of recognizing the attitude of the electronic component sucked by the suction head, and this component can be discarded when the component imaging device determines that the suction attitude of the component is defective. An electronic component mounting apparatus having a plurality of component disposal units. 2. The electronic component mounting apparatus according to claim 1, wherein the plurality of component imaging devices are provided in the vicinity of the corresponding component disposal units. 3. An electronic component mounting device for picking up a desired electronic component from a component supply unit by a suction head, recognizing a posture of the sucked electronic component by a component imaging device, and mounting the electronic component at a desired position on a circuit board. In the method, if the suction posture determination result by the component imaging device is normal, the electronic component is mounted at a desired position on the circuit board, and if the suction posture determination result is abnormal, the electronic component is positioned near the component imaging device. An electronic component mounting method, wherein the electronic component is disposed in a component disposal section.