JPH02108570U - - Google Patents
Info
- Publication number
- JPH02108570U JPH02108570U JP1989015005U JP1500589U JPH02108570U JP H02108570 U JPH02108570 U JP H02108570U JP 1989015005 U JP1989015005 U JP 1989015005U JP 1500589 U JP1500589 U JP 1500589U JP H02108570 U JPH02108570 U JP H02108570U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- solder wire
- wire
- cylindrical body
- feeding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000005476 soldering Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係る糸はんだ送り
装置を示す斜視図、第２図ａ，ｂ，ｃ，ｄは本考
案の一実施例に係る糸はんだ送り装置を用い、レ
ーザ光によつてはんだ付を行なう場合の工程を示
す図、第３図ａはその工程中の一部を示す斜視図
、第３図ｂは第３図ａの断面図、第４図ａは従来
の糸はんだ送り装置を用いてはんだ付する場合の
状態を示す斜視図、第４図ｂはその断面図である
。
１ａ，１ｂ，１ｃ，１１ａ，１１ｂ：糸はんだ
、１０，２０ａ，２０ｂ：レーザ光、２ａ，２ｂ
：ローラ、３：モータ、４，２４：円筒体、５：
溜り部、６，２６：電気部品リード、７，２７：
スルーホール、８，２８：プリント基板、９，２
９：電気部品ボデイ、１２：糸はんだリール。
Fig. 1 is a perspective view showing a solder thread feeding device according to an embodiment of the present invention, and Fig. 2 a, b, c, and d show a solder thread feeding device according to an embodiment of the present invention. Figure 3a is a perspective view showing a part of the soldering process, Figure 3b is a sectional view of Figure 3a, and Figure 4a is a conventional thread. FIG. 4b is a perspective view showing a state in which soldering is performed using a solder feeding device, and FIG. 4B is a sectional view thereof. 1a, 1b, 1c, 11a, 11b: Thread solder, 10, 20a, 20b: Laser light, 2a, 2b
: Roller, 3: Motor, 4, 24: Cylindrical body, 5:
Reservoir, 6, 26: Electrical component lead, 7, 27:
Through hole, 8, 28: Printed circuit board, 9, 2
9: Electrical component body, 12: Thread solder reel.
Claims (1)
はんだリールと、該糸はんだを挟持しながら回転
し糸はんだを送り出す一対のローラと、この送り
出された糸はんだをガイドする円筒体とを備え、
該円筒体の先端に皿状の溜り部を形成したことを
特徴とする糸はんだ送り装置。 A solder wire reel that is rotatably held and winds a solder wire, a pair of rollers that rotate while holding the solder wire and feed out the solder wire, and a cylindrical body that guides the solder wire that is sent out.
A wire solder feeding device characterized in that a dish-shaped reservoir is formed at the tip of the cylindrical body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015005U JPH02108570U (en) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989015005U JPH02108570U (en) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02108570U true JPH02108570U (en) | 1990-08-29 |
Family
ID=31226683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989015005U Pending JPH02108570U (en) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02108570U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736474U (en) * | 1993-12-20 | 1995-07-04 | 上田日本無線株式会社 | Soldering device using laser beam |
| JP2007067168A (en) * | 2005-08-31 | 2007-03-15 | Fujifilm Corp | Laser soldering method and laser soldering equipment |
| JP2011029659A (en) * | 2010-09-30 | 2011-02-10 | Denso Corp | Laser soldering method |
| JP2020192586A (en) * | 2019-05-29 | 2020-12-03 | ファナック株式会社 | Solder device for soldering with laser light and robot device including the same |
-
1989
- 1989-02-10 JP JP1989015005U patent/JPH02108570U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736474U (en) * | 1993-12-20 | 1995-07-04 | 上田日本無線株式会社 | Soldering device using laser beam |
| JP2007067168A (en) * | 2005-08-31 | 2007-03-15 | Fujifilm Corp | Laser soldering method and laser soldering equipment |
| JP2011029659A (en) * | 2010-09-30 | 2011-02-10 | Denso Corp | Laser soldering method |
| JP2020192586A (en) * | 2019-05-29 | 2020-12-03 | ファナック株式会社 | Solder device for soldering with laser light and robot device including the same |
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