JPH0426671U - - Google Patents
Info
- Publication number
- JPH0426671U JPH0426671U JP6792890U JP6792890U JPH0426671U JP H0426671 U JPH0426671 U JP H0426671U JP 6792890 U JP6792890 U JP 6792890U JP 6792890 U JP6792890 U JP 6792890U JP H0426671 U JPH0426671 U JP H0426671U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- circuit board
- cream solder
- solder
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000006071 cream Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Nozzles (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図は本考案の一実施例を示し、第１図はハンダ
デイスペンサのノズルの一部切欠斜面図、第２図
はノズルにて回路基板の電極にクリームハンダを
塗布した状態を示す一部切欠縦断側面図、第３図
は回路基板に電子部品のリード線を挿通した状態
を示す一部切欠縦断側面図、第４図及び第５図は
従来例を示し、第４図は回路基板の電極にノズル
にてクリームハンダを塗布した状態を示す一部切
欠縦断側面図、第５図は回路基板に電子部品のリ
ード線を挿通する状態を示す一部切欠縦断側面図
である。
１０……ノズル、１２……心棒、１３……クリ
ームハンダ、１４……回路基板。
The figures show one embodiment of the present invention. Figure 1 is a partially cutaway perspective view of the nozzle of a solder dispenser, and Figure 2 is a partially cutaway view showing cream solder being applied to the electrodes of a circuit board with the nozzle. 3 is a partially cutaway vertical side view showing a state in which the lead wire of an electronic component is inserted into the circuit board, FIGS. 4 and 5 show a conventional example, and FIG. 4 is an electrode of the circuit board. FIG. 5 is a partially cutaway longitudinal side view showing a state in which cream solder is applied with a nozzle to the circuit board, and FIG. 5 is a partially cutaway longitudinal side view showing a state in which lead wires of electronic components are inserted into a circuit board. 10... Nozzle, 12... Mandrel, 13... Cream solder, 14... Circuit board.
Claims (1)
等に該クリームハンダを塗布できるようにしたハ
ンダデイスペンサにおいて、該ノズル内の中央に
心棒を設けたことを特徴とするハンダデイスペン
サのノズル。 1. A solder dispenser capable of dispensing cream solder from a nozzle and applying the cream solder to a circuit board, etc., characterized in that a mandrel is provided at the center of the nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6792890U JPH0426671U (en) | 1990-06-28 | 1990-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6792890U JPH0426671U (en) | 1990-06-28 | 1990-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426671U true JPH0426671U (en) | 1992-03-03 |
Family
ID=31601944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6792890U Pending JPH0426671U (en) | 1990-06-28 | 1990-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426671U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62237044A (en) * | 1986-04-07 | 1987-10-17 | Toyota Motor Corp | Control method for variable compression ratio mechanism of internal combustion engine |
-
1990
- 1990-06-28 JP JP6792890U patent/JPH0426671U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62237044A (en) * | 1986-04-07 | 1987-10-17 | Toyota Motor Corp | Control method for variable compression ratio mechanism of internal combustion engine |