JPH0160772U - - Google Patents
Info
- Publication number
- JPH0160772U JPH0160772U JP15294887U JP15294887U JPH0160772U JP H0160772 U JPH0160772 U JP H0160772U JP 15294887 U JP15294887 U JP 15294887U JP 15294887 U JP15294887 U JP 15294887U JP H0160772 U JPH0160772 U JP H0160772U
- Authority
- JP
- Japan
- Prior art keywords
- dispenser device
- circuit board
- printed circuit
- cream solder
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating Apparatus (AREA)
Description
第１図は本考案の１実施例を示すデイスペンサ
装置の要部正面図、第２図は同断面図である。
１……プリント回路基板、２……クリームハン
ダ、３……ノズル、４……ストツパ。
FIG. 1 is a front view of essential parts of a dispenser device showing one embodiment of the present invention, and FIG. 2 is a sectional view thereof. 1... Printed circuit board, 2... Cream solder, 3... Nozzle, 4... Stopper.
Claims (1)
するデイスペンサ装置において、プリント回路基
板の上面とデイスペンサ装置のノズル先端との間
隔が塗布されるクリーム半田の線径よりも小とな
るように位置決めすることを特徴とするデイスペ
ンサ装置。 In a dispenser device that linearly applies cream solder to a printed circuit board, position the device so that the distance between the top surface of the printed circuit board and the nozzle tip of the dispenser device is smaller than the wire diameter of the cream solder to be applied. Characteristic dispenser device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15294887U JPH0160772U (en) | 1987-10-06 | 1987-10-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15294887U JPH0160772U (en) | 1987-10-06 | 1987-10-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160772U true JPH0160772U (en) | 1989-04-18 |
Family
ID=31428340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15294887U Pending JPH0160772U (en) | 1987-10-06 | 1987-10-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160772U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58143865A (en) * | 1982-02-19 | 1983-08-26 | Matsushita Electric Ind Co Ltd | Coater |
-
1987
- 1987-10-06 JP JP15294887U patent/JPH0160772U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58143865A (en) * | 1982-02-19 | 1983-08-26 | Matsushita Electric Ind Co Ltd | Coater |