JPH0297715U - - Google Patents
Info
- Publication number
- JPH0297715U JPH0297715U JP437589U JP437589U JPH0297715U JP H0297715 U JPH0297715 U JP H0297715U JP 437589 U JP437589 U JP 437589U JP 437589 U JP437589 U JP 437589U JP H0297715 U JPH0297715 U JP H0297715U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- coated
- flux
- wire
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案実施例の斜視図、第２図は同側
面断面図、第３図は本考案ジヤンパー線ではんだ
付けした後の導線とスルーホールとの接合状態を
説明する図、第４図は従来のジヤンパー線をクリ
ームはんだで接続する時の断面図、第５図は同平
面図、第６，７図は従来のジヤンパー線でスルー
ホールのはんだ付けを行つた時の状態を説明する
図である。
１…多層基板、２…スルーホール、３…ラウン
ド、５…従来のジヤンパー線、１０…導線、１１
…はんだ、１２…フラツクス。
Fig. 1 is a perspective view of the embodiment of the present invention, Fig. 2 is a side sectional view of the same, Fig. 3 is a diagram illustrating the state of connection between the conducting wire and the through hole after soldering with the jumper wire of the present invention, and Fig. 4 The figure is a cross-sectional view when connecting conventional jumper wires with cream solder, Figure 5 is a plan view of the same, and Figures 6 and 7 explain the state when through-hole soldering is performed using conventional jumper wires. It is a diagram. DESCRIPTION OF SYMBOLS 1...Multilayer board, 2...Through hole, 3...Round, 5...Conventional jumper wire, 10...Conductor wire, 11
...Solder, 12...Flux.
Claims (1)
んだをさらにフラツクスで被覆したことを特徴と
するジヤンパー線。 A jumper wire characterized in that the periphery of the conductive wire is coated with solder, and the solder is further coated with flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP437589U JPH0297715U (en) | 1989-01-20 | 1989-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP437589U JPH0297715U (en) | 1989-01-20 | 1989-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0297715U true JPH0297715U (en) | 1990-08-03 |
Family
ID=31206837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP437589U Pending JPH0297715U (en) | 1989-01-20 | 1989-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0297715U (en) |
-
1989
- 1989-01-20 JP JP437589U patent/JPH0297715U/ja active Pending