JPS6226071U - - Google Patents
Info
- Publication number
- JPS6226071U JPS6226071U JP11636385U JP11636385U JPS6226071U JP S6226071 U JPS6226071 U JP S6226071U JP 11636385 U JP11636385 U JP 11636385U JP 11636385 U JP11636385 U JP 11636385U JP S6226071 U JPS6226071 U JP S6226071U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- wires
- circuit boards
- circuit board
- parallel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図〜第３図は本考案の第１実施例の展開平
面図と斜面図及び重合状態の断面図、第４図〜第
７図は第２実施例の平面図、プリント曲折状態に
おける断面図と対向させた斜面図及び接続状態の
拡大平面図、第８図と第９図は第３実施例の平面
図と接続状態の平面図、第１０図は第４実施例の
接続状態の拡大斜視図である。
１ａ，１ｂ，４ａ，４ｂ，７ａ，７ｂ……プリ
ント基板、２ａ，２ｂ，６ａ，６ｂ，８ａ，８ｂ
……錫メツキ銅線、３ａ，３ｂ……窓孔、５ａ，
５ｂ……補助基板。
Figures 1 to 3 are a developed plan view, a perspective view, and a sectional view of the first embodiment of the present invention in a superimposed state, and Figures 4 to 7 are a plan view and a cross section of the second embodiment in a printed bent state. 8 and 9 are a plan view of the third embodiment and a plan view of the connection state, and FIG. 10 is an enlarged view of the connection state of the fourth embodiment. FIG. 1a, 1b, 4a, 4b, 7a, 7b...Printed circuit board, 2a, 2b, 6a, 6b, 8a, 8b
...Tin-plated copper wire, 3a, 3b...Window hole, 5a,
5b...Auxiliary board.
Claims (1)
くとも一端をプリント基板にハンダ付けされてい
る針金を平行して、該針金の径よりも少い間隔で
、しかも両プリント基板の針金が平行となるよう
に設け、両方のプリント基板の針金を接触させて
２枚のプリント基板を接続することを特徴とする
プリント基板の接続装置。 Wires with at least one end soldered to the printed circuit board are placed parallel to each other at symmetrical positions on the two printed circuit boards, with an interval smaller than the diameter of the wires, and the wires of both printed circuit boards are parallel to each other. 1. A printed circuit board connecting device characterized in that two printed circuit boards are connected by bringing wires of both printed circuit boards into contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11636385U JPS6226071U (en) | 1985-07-31 | 1985-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11636385U JPS6226071U (en) | 1985-07-31 | 1985-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6226071U true JPS6226071U (en) | 1987-02-17 |
Family
ID=31000876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11636385U Pending JPS6226071U (en) | 1985-07-31 | 1985-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6226071U (en) |
-
1985
- 1985-07-31 JP JP11636385U patent/JPS6226071U/ja active Pending
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