JPS62190372U - - Google Patents
Info
- Publication number
- JPS62190372U JPS62190372U JP1986077599U JP7759986U JPS62190372U JP S62190372 U JPS62190372 U JP S62190372U JP 1986077599 U JP1986077599 U JP 1986077599U JP 7759986 U JP7759986 U JP 7759986U JP S62190372 U JPS62190372 U JP S62190372U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- wiring board
- wire connection
- hole
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 3
Description
第１図は、半田を想像線で示した本考案の実施
例を示す斜視図、第２図は、第１図のＡ―Ａ線断
面図、第３図は、半田を想像線で示した他の実施
例を示す斜視図、第４図は、配線基板のリード線
の接続部の従来例を示す斜視図、第５図は、第４
図のＢ―Ｂ線断面図である。
１１……配線基板、１２……端子電極、１３…
…リード線、１４……リードの先端部、１５……
先端部の通孔、１６……半田。
Fig. 1 is a perspective view showing an embodiment of the present invention with solder shown in imaginary lines, Fig. 2 is a sectional view taken along line AA in Fig. 1, and Fig. 3 is a sectional view showing solder in imaginary lines. FIG. 4 is a perspective view showing a conventional example of a lead wire connection portion of a wiring board; FIG. 5 is a perspective view showing another embodiment; FIG.
It is a sectional view taken along the line BB in the figure. 11... Wiring board, 12... Terminal electrode, 13...
...Lead wire, 14...Tip of lead, 15...
Through hole at the tip, 16...solder.
Claims (1)
、幅広に形成されたリード線１３の端末部１４を
半田付した配線基板のリード線接続部において、
リード線１３の先端部１４に、その厚み方向に貫
通する通孔１５を開設したことを特徴とする配線
基板のリード線接続部。 In the lead wire connection part of the wiring board, the terminal part 14 of the lead wire 13 formed wide is soldered to the terminal electrode 12 provided on the wiring board 11.
A lead wire connection portion for a wiring board, characterized in that a through hole 15 is formed in a tip end portion 14 of a lead wire 13, penetrating in the thickness direction thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986077599U JPS62190372U (en) | 1986-05-23 | 1986-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986077599U JPS62190372U (en) | 1986-05-23 | 1986-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62190372U true JPS62190372U (en) | 1987-12-03 |
Family
ID=30925754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986077599U Pending JPS62190372U (en) | 1986-05-23 | 1986-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62190372U (en) |
-
1986
- 1986-05-23 JP JP1986077599U patent/JPS62190372U/ja active Pending