JPH0453102B2 - - Google Patents

Info

Publication number
JPH0453102B2
JPH0453102B2 JP13476787A JP13476787A JPH0453102B2 JP H0453102 B2 JPH0453102 B2 JP H0453102B2 JP 13476787 A JP13476787 A JP 13476787A JP 13476787 A JP13476787 A JP 13476787A JP H0453102 B2 JPH0453102 B2 JP H0453102B2
Authority
JP
Japan
Prior art keywords
leads
lead
carrier
integrated circuit
enclosure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13476787A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63114153A (ja
Inventor
Daburyu Haitawaa Angusu
Daburyu Sumisu Reginarudo
Daburyu Ookatsuto Jon
Emu Haadein Richaado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPS63114153A publication Critical patent/JPS63114153A/ja
Publication of JPH0453102B2 publication Critical patent/JPH0453102B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP13476787A 1981-07-27 1987-05-29 集積回路用キャリア Granted JPS63114153A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US28683381A 1981-07-27 1981-07-27
US286910 1981-07-27
US286833 1981-07-27
US286832 2001-04-25

Publications (2)

Publication Number Publication Date
JPS63114153A JPS63114153A (ja) 1988-05-19
JPH0453102B2 true JPH0453102B2 (de) 1992-08-25

Family

ID=23100361

Family Applications (2)

Application Number Title Priority Date Filing Date
JP12909982A Granted JPS5827354A (ja) 1981-07-27 1982-07-26 集積回路用キャリア
JP13476787A Granted JPS63114153A (ja) 1981-07-27 1987-05-29 集積回路用キャリア

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP12909982A Granted JPS5827354A (ja) 1981-07-27 1982-07-26 集積回路用キャリア

Country Status (1)

Country Link
JP (2) JPS5827354A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア
JPS592152U (ja) * 1982-06-28 1984-01-09 富士通株式会社 リ−ド付チツプキヤリア
US4657172A (en) * 1985-10-31 1987-04-14 American Microsystems, Inc. Apparatus and method of solder coating integrated circuit leads
JPH0644806B2 (ja) * 1987-02-18 1994-06-08 三洋電機株式会社 オ−トフオ−カス回路
KR101478616B1 (ko) * 2014-04-21 2015-01-15 케이.엘.이.에스 주식회사 반사형 금속 단열재

Also Published As

Publication number Publication date
JPS5827354A (ja) 1983-02-18
JPS63114153A (ja) 1988-05-19
JPH0345543B2 (de) 1991-07-11

Similar Documents

Publication Publication Date Title
US4465898A (en) Carrier for integrated circuit
US5446313A (en) Thin type semiconductor device and module structure using the device
US4463217A (en) Plastic surface mounted high pinout integrated circuit package
US8089141B1 (en) Semiconductor package having leadframe with exposed anchor pads
EP0090608B1 (de) Halbleiteranordnung mit Gusspackung
US20060118458A1 (en) Carrier tape for electronic components
US6555755B1 (en) Flexible interconnecting substrate and method of manufacturing the same, film carrier, tape-shaped semiconductor device, semiconductor device, circuit board, and electronic equipment
EP0645811A2 (de) Halbleiteranordnung mit einem Halbleiterchip mit Rückseitenelektrode
US4495376A (en) Carrier for integrated circuit
JPH0453102B2 (de)
US4530552A (en) Electrical connector for integrated circuit package
US5392932A (en) Boat transport for suporting semiconductor device assemblies
KR100848425B1 (ko) 전기장치용 용기
JPH0332050A (ja) Ｉｃパッケージ
US20170040289A1 (en) Semiconductor package
US6570100B1 (en) Pad structure of semiconductor package
JPH0445987B2 (de)
EP0036907B1 (de) Montagesockel vom Steckerstift-Typ für Schaltungselement
JP2961839B2 (ja) 集積回路装置
JPS61225841A (ja) 樹脂封止型半導体装置
JPS635248Y2 (de)
US5380952A (en) Integrated circuit package with stabilizer bar
JPH03248543A (ja) フィルムキャリアテープ
JPS59189662A (ja) 樹脂封止型半導体装置
JPH11261187A (ja) 基板実装部品及びその取付構造