JPH0453100B2 - - Google Patents
Info
- Publication number
- JPH0453100B2 JPH0453100B2 JP60175165A JP17516585A JPH0453100B2 JP H0453100 B2 JPH0453100 B2 JP H0453100B2 JP 60175165 A JP60175165 A JP 60175165A JP 17516585 A JP17516585 A JP 17516585A JP H0453100 B2 JPH0453100 B2 JP H0453100B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- plated
- copper
- plating
- resin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 42
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 27
- 229910052737 gold Inorganic materials 0.000 claims description 27
- 239000010931 gold Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000011152 fibreglass Substances 0.000 claims description 8
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 239000011148 porous material Substances 0.000 claims description 2
- 239000004840 adhesive resin Substances 0.000 claims 1
- 229920006223 adhesive resin Polymers 0.000 claims 1
- 229920000954 Polyglycolide Polymers 0.000 description 22
- 235000010409 propane-1,2-diol alginate Nutrition 0.000 description 22
- 229920003023 plastic Polymers 0.000 description 19
- 239000004033 plastic Substances 0.000 description 19
- 229910000679 solder Inorganic materials 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 1
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 1
- -1 as shown in FIG. 11 Chemical compound 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17516585A JPS6235654A (ja) | 1985-08-09 | 1985-08-09 | プリント基板用素子部品およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17516585A JPS6235654A (ja) | 1985-08-09 | 1985-08-09 | プリント基板用素子部品およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6235654A JPS6235654A (ja) | 1987-02-16 |
| JPH0453100B2 true JPH0453100B2 (ko) | 1992-08-25 |
Family
ID=15991399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17516585A Granted JPS6235654A (ja) | 1985-08-09 | 1985-08-09 | プリント基板用素子部品およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6235654A (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787221B2 (ja) * | 1987-02-27 | 1995-09-20 | イビデン株式会社 | 半導体搭載用基板 |
| JP4726043B2 (ja) * | 2005-03-23 | 2011-07-20 | リコーエレメックス株式会社 | 液体吐出用ノズル及びそれを用いたフラックス塗布装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967686A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JPS6134989A (ja) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | 電子部品搭載用基板 |
-
1985
- 1985-08-09 JP JP17516585A patent/JPS6235654A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967686A (ja) * | 1982-10-12 | 1984-04-17 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JPS6134989A (ja) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | 電子部品搭載用基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6235654A (ja) | 1987-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |