JPH0452617B2 - - Google Patents
Info
- Publication number
- JPH0452617B2 JPH0452617B2 JP16630183A JP16630183A JPH0452617B2 JP H0452617 B2 JPH0452617 B2 JP H0452617B2 JP 16630183 A JP16630183 A JP 16630183A JP 16630183 A JP16630183 A JP 16630183A JP H0452617 B2 JPH0452617 B2 JP H0452617B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- stage
- rotation
- pellets
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 101
- 235000012431 wafers Nutrition 0.000 claims description 18
- 238000012937 correction Methods 0.000 claims description 14
- 210000000078 claw Anatomy 0.000 description 5
- 238000000605 extraction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は半導体装置の製造工程において使用さ
れるペレツトマウント装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a pellet mount device used in the manufacturing process of semiconductor devices.
半導体装置の製造においてはウエーハプロセス
及び試験が完了したウエーハをダイシングにより
1パツケージ分毎に分離してペレツトとしこれを
リードフレームに搭載する工程を有する。このペ
レツト搭載のためにペレツトマウント装置が使用
される。ウエーハ上に形成された回路は前部が良
品ではなく、不良品をかなりの割合で含んでお
り、良品ペレツトを効率良く搭載するため、従
来、次のような形式のペレツトマウント装置が用
いられている。
In the manufacture of semiconductor devices, a wafer that has undergone wafer processing and testing is separated into individual packages by dicing to form pellets, and the pellets are mounted on a lead frame. A pellet mounting device is used to load the pellets. Circuits formed on wafers do not have good parts at the front, and contain a large proportion of defective parts.In order to efficiently mount good pellets, the following types of pellet mounting equipment have traditionally been used. ing.
1つはペレツトの良品率があまり高くない場合
に使用されるものでトレイと呼ばれる容器に良品
ペレツトのみを移し替えた後、吸着ノズルを使用
してペレツトを1個ずつ取出し、ペレツト位置修
正機構部でペレツトの位置を修正し、リードフレ
ームの所定位置に移送してマウントを行うもので
ある。 The first type is used when the rate of good pellets is not very high. After transferring only good pellets to a container called a tray, the pellets are taken out one by one using a suction nozzle, and the pellet position correction mechanism is used. The position of the pellet is corrected, and the pellet is transferred to a predetermined position on the lead frame and mounted.
他の1つは第1図に示した形式のものでウエー
ハを分離したペレツト2を粘着シート3を介して
取付けたカセツトリング4が、必要に応じてXお
よびY方向に自由に移動可能なX−Yステージ5
上のカセツトリングホルダ6上に載置されたペレ
ツト取出部1と、これから吸着ノズル15によつ
て吸着されたペレツト2の位置および回転偏位を
修正するペレツト位置修正部10を有している。
ペレツト取出部1においては所望のペレツトの取
出しを容易にするためカセツトリング4下方より
突上げ針8を上下動させるアーム7を有する突上
げ機構を具備している。ペレツト位置修正部10
においては、ペレツト取出部1より取出されたペ
レツトのX方向位置偏位、Y方向位置偏位、回転
偏位を修正するための修正爪11aおよび11b
を有しておりこれらの修正爪11a,11bがペ
レツト2を挟むことにより位置修正を行う。この
修正爪は4方から挟む形式のものと第4図および
第5図に示されたようなペレツトの2辺とその挟
角を同時に位置決めする2方から挟む形式のもの
とがある。位置決めされたペレツトは別の吸着ノ
ズル16によつて吸着され、リードフレーム21
を支持するステージ20の所定位置まで運ばれ、
吸着ノズルの降下によつてペレツトがリードフレ
ーム上に搭載されることになる。 The other one is of the type shown in Fig. 1, in which a cassette ring 4 to which pellets 2 from which wafers have been separated is attached via an adhesive sheet 3 is attached to an -Y stage 5
It has a pellet take-out section 1 placed on an upper cassette ring holder 6, and a pellet position correction section 10 for correcting the position and rotational deviation of pellets 2 sucked by a suction nozzle 15.
The pellet take-out section 1 is equipped with a push-up mechanism having an arm 7 that moves a push-up needle 8 up and down from below the cassette ring 4 in order to facilitate the take-out of desired pellets. Pellet position correction unit 10
In the above, correction claws 11a and 11b are used to correct the X-direction positional deviation, Y-direction positional deviation, and rotational deviation of the pellets taken out from the pellet removal section 1.
These correcting claws 11a and 11b sandwich the pellet 2 to correct the position. There are two types of correction claws: one that pinches from four sides, and the other that pinches from two sides, as shown in FIGS. 4 and 5, which simultaneously positions two sides of the pellet and their included angles. The positioned pellet is sucked by another suction nozzle 16, and the lead frame 21
is carried to a predetermined position on the stage 20 that supports the
The pellets are loaded onto the lead frame by the descent of the suction nozzle.
しかしながらこのような従来のペレツトマウン
ト装置においてはペレツト取出部のX−Yステー
ジはウエーハの大きさに対応した移動量が必要で
ある。近年生産性向上のためウエーハは拡大する
傾向があり、4インチ(101.6mm)および5イン
チ(127mm)が標準となりつつある。このように
ウエーハが大きくなるとX−Yステージの移動量
も多くなりこれに伴つて機構部は大きくなり装置
全体の大きさも拡大する他精度上も不利となる。
したがつて設備コストが上昇し製品コストの上昇
につながるという問題がある。
However, in such a conventional pellet mounting apparatus, the X-Y stage of the pellet take-out section needs to move an amount corresponding to the size of the wafer. In recent years, there has been a trend to increase the size of wafers to improve productivity, and 4-inch (101.6 mm) and 5-inch (127 mm) wafers are becoming the standard. As the wafer becomes larger in this manner, the amount of movement of the X-Y stage also increases, and accordingly, the mechanical section becomes larger, which increases the overall size of the apparatus and is disadvantageous in terms of accuracy.
Therefore, there is a problem in that the equipment cost increases, leading to an increase in product cost.
本発明は上記問題点を解決するためになされた
もので、ウエーハ径が大きくなつても装置全体の
大きさが拡大しないペレツトマウント装置を提供
することを目的とする。
The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a pellet mount device in which the overall size of the device does not increase even when the wafer diameter increases.
上記目的達成のため、本発明にかかるペレツト
マウント装置においてはペレツト取出部のX−Y
ステージに回転機構を付加してウエーハの複数に
分割した範囲を走査するようにX−Yステージの
移動範囲を縮少するとともにペレツト位置修正部
にX−Yステージの回転量を補償するようにペレ
ツトに回転を与える回転機構を付加するようにし
ており、装置の小型化を達成できるものである。
In order to achieve the above object, in the pellet mounting device according to the present invention, the X-Y
A rotation mechanism is added to the stage to reduce the movement range of the X-Y stage so that it scans a range divided into multiple parts of the wafer, and a pellet position correction unit is installed to compensate for the amount of rotation of the X-Y stage. A rotation mechanism is added to give rotation to the device, making it possible to downsize the device.
以下、第2図ないし第5図を参照しながら本発
明の一実施例を詳細に説明する。
Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 2 to 5.
第2図はペレツト取出部30を示す正面図であ
つて第1図の場合と同様にウエーハが所定形状に
ダイシングされたペレツト31は粘着テープ32
を介してカセツトリング33上に貼付けられてお
り、このカセツトリング33はX−Yステージ3
4上のカセツトリングホルダ35に取付けられて
いる。X−Yステージ34はモータ36によつて
駆動されるX方向ステージ35、モータ38によ
つて駆動されるY方向ステージ37およびモータ
41によつて歯車40を介して駆動される回転ス
テージ39より成る。この回転ステージ39の外
周端面には歯車40とかみ合う歯形が形成されて
るのでモータ41の駆動によつてカセツトリング
ホルダ35およびペレツト31を回転することが
できる。 FIG. 2 is a front view showing the pellet take-out section 30, and as in the case of FIG.
This cassette ring 33 is attached to the X-Y stage 3 through
4 is attached to the cassette ring holder 35 on top of the cassette ring holder 35. The X-Y stage 34 consists of an X-direction stage 35 driven by a motor 36, a Y-direction stage 37 driven by a motor 38, and a rotation stage 39 driven by a motor 41 via a gear 40. . Since the outer peripheral end surface of the rotary stage 39 is formed with a tooth profile that meshes with a gear 40, the cassette ring holder 35 and the pellets 31 can be rotated by driving the motor 41.
この回転ステージを採用することによつてペレ
ツト取出し範囲を狭めることができる。すなわち
第4図に示すように、カセツトリングホルダ35
に載置されたカセツトリング33上に固着された
ペレツト31をその中心0を通るように所定の角
度例えば90°ごとに分割し、4つのペレツト群A,
B,C,Dを定めたとすれば、吸着ノズル45に
よつてこのウエーハのペレツトを取出すためにX
−Yステージが移動すべき範囲はAの領域だけを
包含するようにすればよい。領域A内のペレツト
取出しが完了した後は回転ステージを回転させ、
第5図に示すように領域Bが取出し位置に来るよ
うにする。このような4分割ではX−Yステージ
の移動範囲はX方向Y方向ともに半分にすること
ができる。 By employing this rotary stage, the pellet removal range can be narrowed. That is, as shown in FIG.
The pellets 31 fixed on the cassette ring 33 placed on the cassette ring 33 are divided into four pellet groups A, 90° each, passing through the center 0 of the pellets.
If B, C, and D are determined, then in order to take out the pellets of this wafer by the suction nozzle 45,
-The range in which the Y stage should move should include only the area A. After the pellet removal in area A is completed, rotate the rotary stage,
As shown in FIG. 5, area B is placed at the extraction position. With such four divisions, the movement range of the X-Y stage can be halved in both the X and Y directions.
なお、ペレツト取出しを容易にするために、カ
セツトリング33下方から突上げ針43を上下動
させるアーム42を有する突上げ機構を有してい
るのは従来例と同様である。 In order to facilitate taking out the pellets, a push-up mechanism is provided having an arm 42 for vertically moving a push-up needle 43 from below the cassette ring 33, as in the conventional example.
第3図は本発明にかかるペレツトマウント装置
の一部であるペレツト位置修正部50の詳細を示
す断面図であつて、支持板51に対して固定され
た爪ホルダ52aおよび52bの上にはペレツト
位置決め用の修正爪53aおよび53bが摺動す
るようになつており、ペレツト台54の上に載置
されたペレツト31の位置ずれを修正することが
できる。このペレツト台54はその中心に真空孔
55を有し、支持板51に対し軸受56を介して
回転自在に支承されておりその下部にはタイミン
グプーリ58および真空源(図示せず)に接続す
るための継手57を有している。タイミングプー
リ58は支持板51に取付けられたモータ59に
結合されたタイミングプーリ60とタイミングベ
ルト61で結合されている。これにより、ペレツ
ト台54はモータ59の回転に従つて回転するこ
とができる。この回転量は第2図において回転テ
ーブルが回転した角度と等しい。すなわち、回転
ステージ39の回転量に比例した信号は取出さ
れ、制御装置(図示せず)によつてペレツト31
がペレツト台に載置された後ペレツト位置修正部
50のモータ59に回転ステージ39の回転量を
補償するような逆回転が与えられる。これにより
ペレツトは回転ステージの回転量の影響を受ける
ことなく通常と同様のペレツト位置修正を行うこ
とができる。 FIG. 3 is a sectional view showing the details of the pellet position correcting unit 50 which is a part of the pellet mounting device according to the present invention. Correcting claws 53a and 53b for pellet positioning are adapted to slide, and the positional deviation of the pellet 31 placed on the pellet table 54 can be corrected. This pellet table 54 has a vacuum hole 55 at its center, is rotatably supported on the support plate 51 via a bearing 56, and is connected to a timing pulley 58 and a vacuum source (not shown) at the bottom thereof. It has a joint 57 for this purpose. The timing pulley 58 is connected by a timing belt 61 to a timing pulley 60 which is connected to a motor 59 attached to the support plate 51. Thereby, the pellet table 54 can be rotated in accordance with the rotation of the motor 59. This amount of rotation is equal to the angle through which the rotary table was rotated in FIG. That is, a signal proportional to the amount of rotation of the rotation stage 39 is extracted, and a control device (not shown) controls the pellet 31.
After the pellets are placed on the pellet stand, the motor 59 of the pellet position correction section 50 is given reverse rotation to compensate for the amount of rotation of the rotary stage 39. As a result, the pellet position can be corrected in the same manner as usual without being affected by the amount of rotation of the rotary stage.
以上のようなペレツトマウント装置の動作を説
明すると、まずウエーハの中心と回転ステージの
中心とが一致するようにカセツトリング33が位
置決めされる。ウエーハを4分割したとすれば吸
着ノズル45の先端位置が第4図のAの位置を走
査するようにX−Yステージはペレツト取出しご
とにX方向およびY方向に移動する。吸着ノズル
45は同じ取出し位置で降下してペレツトを吸着
しこれを引上げてペレツト位置修正部50へ移送
し、降下してペレツト台54にペレツトを吸着さ
せる。なおペレツトを取出す際には下方よりペレ
ツト突上げ針がペレツトを突上げるので取出しが
容易化される。 To explain the operation of the pellet mount apparatus as described above, first, the cassette ring 33 is positioned so that the center of the wafer and the center of the rotation stage coincide. If the wafer is divided into four parts, the X-Y stage moves in the X and Y directions each time a pellet is taken out so that the tip position of the suction nozzle 45 scans the position A in FIG. At the same take-out position, the suction nozzle 45 descends to adsorb the pellet, pulls it up and transfers it to the pellet position correction section 50, and descends to adsorb the pellet onto the pellet stand 54. Note that when taking out the pellets, the pellet pushing up needle pushes up the pellets from below, making it easy to take out the pellets.
ペレツトを吸着したペレツト台54は回転ステ
ージ39の回転量に対応した信号を制御装置から
受けたモータ59の回転によりタイミングプーリ
60、タイミングベルト61、タイミングプーリ
58を介して回転ステージ39の回転量分の角度
だけ逆回転する。例えば第5図に示すように回転
ステージを基準位置に対して90°回転した状態で
B領域のペレツトを取出したときは、ペレツト台
54はペレツトの吸着の都度90°逆回転してペレ
ツトの回転状態を正常化する。同様にC領域のペ
レツト取出しを行うために回転ステージを180°回
転したときはペレツト台54を180°逆回転させ、
D領域のペレツト取出しを行うために回転ステー
ジを270°回転したときはペレツト台54を270°逆
回転させればよい。 The pellet table 54 that has attracted the pellets is rotated by the rotation amount of the rotation stage 39 via the timing pulley 60, timing belt 61, and timing pulley 58 due to the rotation of the motor 59 which receives a signal corresponding to the rotation amount of the rotation stage 39 from the control device. Rotate in the opposite direction by the angle of . For example, when taking out pellets in area B with the rotary stage rotated 90 degrees with respect to the reference position as shown in FIG. Normalize the situation. Similarly, when the rotation stage is rotated 180 degrees to take out pellets in area C, the pellet table 54 is rotated 180 degrees in the opposite direction.
When the rotary stage is rotated 270 degrees to take out pellets in area D, the pellet table 54 may be rotated 270 degrees in the opposite direction.
ペレツト台の回転位置を修正後、修正爪53a
および53bが移動し正確な位置決めを行い、位
置決め完了後別の吸着ノズル46によつてリード
フレーム上に運ばれる。 After correcting the rotational position of the pellet table, the correction claw 53a
and 53b move to perform accurate positioning, and after the positioning is completed, it is carried onto the lead frame by another suction nozzle 46.
以上の実施例においてはペレツト取出領域をウ
エーハの1/4の部分とし、回転ステージおよびペ
レツト台を90°の整数倍だけ回転および逆回転す
るようにしているが、これに限られることなく任
意の複数領域に分割することが可能である。ただ
し4つ以上に分割してもX−Yステージの移動量
はそれほど減少しないので4分割の場合が最も効
果が大きい。 In the above embodiments, the pellet take-out area is set to 1/4 of the wafer, and the rotation stage and pellet table are rotated and reversed by an integral multiple of 90 degrees, but the pellet extraction area is not limited to this, and any arbitrary It is possible to divide into multiple areas. However, even if the stage is divided into four or more parts, the amount of movement of the X-Y stage does not decrease much, so the case of dividing into four parts has the greatest effect.
また、回転ステージおよびペレツト台の回転駆
動については実施例の方法に限られることなく、
あらゆる回転駆動方法を採用することができる。 Furthermore, the rotational drive of the rotation stage and pellet table is not limited to the method of the embodiment.
Any rotational drive method can be employed.
さらにペレツト取出部における回転ステージの
回転量を補償するには実施例のように同じ角度分
だけ逆回転させてもよいし、回転ステージの回転
角度をαとして(360°−α)だけ同一方向へ回転
させてもよい。 Furthermore, in order to compensate for the amount of rotation of the rotary stage in the pellet extraction section, it is possible to rotate the rotary stage in the opposite direction by the same angle as in the example, or to rotate the rotary stage in the same direction by (360° - α) with the rotation angle of α being α. You can also rotate it.
以上のような本発明にかかるペレツトマウント
装置によれば、ペレツト取出部において分離した
ペレツトを載置するカセツトリングをウエーハ中
心を含んで等角度に分割した角度ごとに回転させ
る回転ステージと、この複数分割した範囲内でX
方向およびY方向に移動可能なX−Yステージと
を具備し、ペレツト位置修正部においてペレツト
取出時の回転ステージの回転量分だけペレツトを
逆回転させる回転機構を具備しているのでX−Y
ステージの移動範囲を小さくすることができ、し
たがつて大口径ウエーハを使用した場合にも装置
全体の大きさを縮小することができ、設備コスト
の上昇を押えひいては製品コストの低減を図るこ
とができる。
According to the pellet mounting device according to the present invention as described above, the cassette ring on which separated pellets are placed in the pellet take-out section is rotated by angles divided into equal angles including the center of the wafer; X within the range of multiple divisions
It is equipped with an X-Y stage that can move in both the X-Y direction and the Y-direction, and the pellet position correction section is equipped with a rotation mechanism that reversely rotates the pellet by the amount of rotation of the rotation stage when taking out the pellet.
The range of movement of the stage can be reduced, and therefore the overall size of the equipment can be reduced even when large-diameter wafers are used, thereby suppressing increases in equipment costs and ultimately reducing product costs. can.
第1図は従来のペレツトマウント装置の概要を
示す概略構成図、第2図は本発明にかかるペレツ
トマウント装置におけるペレツト取出部を示す正
面図、第3図はペレツト位置修正部の構造を示す
部分断面図、第4図および第5図はペレツト取出
部におけるペレツト取出しを示す平面図である。
30……ペレツト取出部、31……ペレツト、
33……カセツトリング、34……X−Yステー
ジ、39……回転ステージ、36,38,41,
59……モータ、50……ペレツト位置修正部、
54……ペレツト台、58,60……タイミング
プーリ、61……タイミングベルト。
Fig. 1 is a schematic configuration diagram showing an outline of a conventional pellet mount device, Fig. 2 is a front view showing a pellet take-out section in a pellet mount device according to the present invention, and Fig. 3 shows the structure of a pellet position correction section. The partially sectional view shown, and FIGS. 4 and 5 are plan views showing pellet removal in the pellet removal section. 30... Pellet removal section, 31... Pellet,
33... Cassette ring, 34... X-Y stage, 39... Rotating stage, 36, 38, 41,
59...Motor, 50...Pellet position correction unit,
54...Pellet stand, 58, 60...Timing pulley, 61...Timing belt.
Claims (1)
トをこれを載置するカセツトリングから順次吸着
ノズルで取出して移送するペレツト取出し部と、
移送されたペレツトの位置修正を行うペレツト位
置修正部と、この位置修正されたペレツトを他の
吸着ノズルで移送しリードフレームの所定位置に
搭載するマウント部から成るペレツトマウント装
置において、 前記ペレツト取出し部は前記カセツトリングを
前記ウエーハの中心を含んで等角度に複数分割し
た角度ごとに回転させる回転ステージと、この複
数分割した範囲内でX方向およびY方向に移動可
能なX−Yステージとを具備し、 前記ペレツト位置修正部は前記ペレツトの取出
時における前記回転ステージの回転量を補償する
ような回転を前記ペレツトに与える回転機構を具
備したことを特徴とするペレツトマウント装置。[Claims] 1. A pellet take-out section that sequentially takes out pellets separated from wafers by dicing from a cassette ring in which they are placed and transfers them using a suction nozzle;
A pellet mounting device comprising a pellet position correction section that corrects the position of the transferred pellets, and a mount section that transfers the pellets whose position has been corrected using another suction nozzle and mounts them at a predetermined position on the lead frame, The section includes a rotation stage that rotates the cassette ring at each angle divided into a plurality of equal angles including the center of the wafer, and an X-Y stage that is movable in the X direction and the Y direction within the range of the plurality of divisions. A pellet mounting device, characterized in that the pellet position correction section includes a rotation mechanism that applies a rotation to the pellet to compensate for the amount of rotation of the rotation stage when the pellet is taken out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16630183A JPS6057942A (en) | 1983-09-09 | 1983-09-09 | Mounting device for pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16630183A JPS6057942A (en) | 1983-09-09 | 1983-09-09 | Mounting device for pellet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6057942A JPS6057942A (en) | 1985-04-03 |
JPH0452617B2 true JPH0452617B2 (en) | 1992-08-24 |
Family
ID=15828806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16630183A Granted JPS6057942A (en) | 1983-09-09 | 1983-09-09 | Mounting device for pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6057942A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62295431A (en) * | 1986-06-13 | 1987-12-22 | Nichiden Mach Ltd | Work pickup apparatus |
JPS6373930U (en) * | 1986-10-30 | 1988-05-17 | ||
JPS647627A (en) * | 1987-06-30 | 1989-01-11 | Toshiba Corp | Method for mounting electronic component |
JPH01152634A (en) * | 1987-12-09 | 1989-06-15 | Rohm Co Ltd | Assembly device for semiconductor pellet |
JP2006135013A (en) * | 2004-11-04 | 2006-05-25 | Renesas Technology Corp | Mounting device and mounting method |
-
1983
- 1983-09-09 JP JP16630183A patent/JPS6057942A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6057942A (en) | 1985-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR0179385B1 (en) | Vacuum apparatus | |
JP2649519B2 (en) | Flat object transfer positioning device | |
JP2000012568A (en) | Die bonder | |
JPH0452617B2 (en) | ||
US7101141B2 (en) | System for handling microelectronic dies having a compact die ejector | |
CN111715558B (en) | Automatic detection and screening system with multiple conveying discs | |
KR102500554B1 (en) | multiple wafer transfer and wafer transfer method using the same | |
JP3687389B2 (en) | Substrate processing equipment | |
JPH06268050A (en) | Die bonding device | |
JP4298188B2 (en) | Substrate transport apparatus and substrate transport method | |
JPH09275115A (en) | Equipment for positioning board | |
JPH06267808A (en) | Multiple-chamber apparatus having guide mechanism for connecting chamber | |
EP3503172B1 (en) | Apparatus and system | |
JP7251721B1 (en) | Parts processing equipment | |
JP3375223B2 (en) | LCD panel inspection equipment | |
JPH0341468Y2 (en) | ||
JP2925670B2 (en) | Component mounting device and component mounting method | |
JPS62295431A (en) | Work pickup apparatus | |
CN216980525U (en) | Wafer alignment device | |
JPH01152634A (en) | Assembly device for semiconductor pellet | |
JP2000156391A (en) | Semiconductor wafer inspection device | |
JP2676848B2 (en) | Electronic component mounting device | |
JPS623979B2 (en) | ||
JPH01160099A (en) | Substrate supporting device | |
JP2001217302A (en) | Pellet pickup apparatus and method |