JPH01160099A - Substrate supporting device - Google Patents
Substrate supporting deviceInfo
- Publication number
- JPH01160099A JPH01160099A JP62319467A JP31946787A JPH01160099A JP H01160099 A JPH01160099 A JP H01160099A JP 62319467 A JP62319467 A JP 62319467A JP 31946787 A JP31946787 A JP 31946787A JP H01160099 A JPH01160099 A JP H01160099A
- Authority
- JP
- Japan
- Prior art keywords
- height
- support pin
- board
- support
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 19
- 230000008713 feedback mechanism Effects 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品をプリント基板等の所定位置に装着す
る為の基板サポート装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a board support device for mounting electronic components at predetermined positions on a printed circuit board or the like.
従来の技術
昨今リードレス電子部品が普及するにつれて、形状及び
大きさの種類も多品種になり、これらの電子部品を組合
せて電子回路を構成する装置の高速化及び信頼性が要望
されてきている。BACKGROUND OF THE INVENTION As leadless electronic components have become widespread these days, they come in a wide variety of shapes and sizes, and there is a demand for faster and more reliable devices that combine these electronic components to form electronic circuits. .
以下図面を参照しながら、従来の基板サポート装置の一
例について説明する。第４図、第６図、第６図は従来の
基板サポート装置に関するものである。第４図において
、１は回転テーブルで、周辺に等間隔に吸着ノズル２が
ついておシ吸着ポジションにて、電子部品３を吸着し、
装着ポジション捷で回転する。１３はＹ軸駆動源で、Ｙ
テーブル１１をＸ方向に移動させる。１０はＸ軸駆動源
で、Ｘテーブル４をＸ方向に移動させる。Ｘテーブル４
は、Ｙテーブル１１の上に乗っている為、３ ヘー／
Ｘ方向とＹ方向の移動をするととができる。１２は本体
ベースで、Ｙ軸駆動源１３が取付けられている。９は固
定用基板ガイドで、基板６をガイドする。６は移動用基
板ガイドで、基板６の大きさにより移動させて、基板６
をガイドする。７はサポートピンで、基板７を保持する
。８はサポートプレートで、サポートピン７を保持し、
Ｙテーブル４に設けられた上下駆動源により上下動作し
、基板６の上面に電子部品を装着する時、上昇しサポー
トピン７にて基板６を保持させる。第Ｓ図及び第６図は
、第４図の、基板サポートの駆動部である。第６図にお
いて、１６はシリンダー本体で、固定プレート１７に取
付けられている。１９はピストンロッドで、シリンダー
本体１６の駆動源によ如上下動作をする。サポートプレ
ート８は、ピストンロッドと連結して、シリンダー本体
１６の駆動源により上下動作をする。１６はスライド軸
で、サポートプレート８を保持する。１４はガイドで、
スライド軸１６をガイドする。１８は基板下面に装着さ
れた電子部品である。An example of a conventional substrate support device will be described below with reference to the drawings. 4, 6, and 6 relate to conventional substrate support devices. In Fig. 4, reference numeral 1 denotes a rotary table, with suction nozzles 2 arranged at equal intervals around the periphery, which suctions electronic components 3 at the suction position.
Rotates depending on the mounting position. 13 is a Y-axis drive source,
Move the table 11 in the X direction. Reference numeral 10 denotes an X-axis drive source that moves the X table 4 in the X direction. X table 4
Since it rests on the Y table 11, 3 He/ is created by moving in the X direction and the Y direction. Reference numeral 12 denotes a main body base, to which a Y-axis drive source 13 is attached. Reference numeral 9 denotes a fixing board guide for guiding the board 6. Reference numeral 6 denotes a board guide for moving the board 6, which can be moved depending on the size of the board 6.
to guide you. 7 is a support pin that holds the substrate 7. 8 is a support plate that holds the support pin 7;
The Y-table 4 is moved up and down by a vertical drive source provided on it, and when electronic components are mounted on the upper surface of the board 6, it rises and the support pins 7 hold the board 6. FIGS. S and 6 are the drives of the substrate support of FIG. 4. In FIG. 6, reference numeral 16 denotes a cylinder body, which is attached to a fixed plate 17. A piston rod 19 is moved up and down by the drive source of the cylinder body 16. The support plate 8 is connected to the piston rod and is moved up and down by the drive source of the cylinder body 16. A slide shaft 16 holds the support plate 8. 14 is a guide,
Guides the slide shaft 16. 18 is an electronic component mounted on the bottom surface of the board.
以上のように構成された基板サポート装置について、以
下その動作について説明する。シリンダー本体１６の駆
動源により、ピストンロッド１９を上昇させて、サポー
トプレート８を持ち上げる。The operation of the substrate support device configured as described above will be described below. The piston rod 19 is raised by the driving source of the cylinder body 16, and the support plate 8 is lifted.
そして、基板下面に装着された電子部品１８の無い所で
、サポートプレート８に取付けられたサポートピン７に
て、Ｘテーブル４に搬送された基板６を保持し、ソリの
修正及び基板高さを一定にする。その後、吸着ノズル２
にて、設定されたポジションに電子部品３を基板６の上
面に装着する。Then, in a place where there are no electronic components 18 mounted on the bottom surface of the board, the board 6 transported to the Make it constant. After that, suction nozzle 2
The electronic component 3 is mounted on the upper surface of the board 6 at the set position.
装着が完了するとサポートプレート５は下降してＸテー
ブル４から基板６は搬送される。When the mounting is completed, the support plate 5 is lowered and the substrate 6 is transported from the X table 4.
発明が解決しようとする問題点
しかしながら上記のような構成では、基板６の厚さと大
きさ及び、基板下面に装着された電子部品の位置により
、そのつど、サポートピン７の位置変更及び、サポート
ピン７の長さ変更をしなくてはならない為、機種切換時
における作業時間がかかると同時に自動化という点で欠
点があった。Problems to be Solved by the Invention However, in the above configuration, depending on the thickness and size of the board 6 and the position of the electronic components mounted on the bottom surface of the board, the position of the support pin 7 may need to be changed each time. Since the length of 7 had to be changed, it took a lot of time to change the model, and at the same time there was a drawback in terms of automation.
問題点を解決するだめの手段
６ ヘ−７
上記問題点を解決するために本発明の技術的な手段は、
装着ポジションの真下に高さが切換え可能なサポートピ
ンを設けたものである。さらにこのサポートピンと空圧
ゲージを利用して、基板上面に電子部品を装着する基板
下面高さを自動的にフィードバックする機構を設けた。Means for solving the problem 6 H-7 In order to solve the above problem, the technical means of the present invention are as follows:
A support pin whose height can be changed is provided directly below the mounting position. Furthermore, using this support pin and air pressure gauge, we installed a mechanism that automatically feeds back the height of the bottom surface of the board on which electronic components are mounted on the top surface of the board.
作 用 この技術的手段による作用は次のようになる。For production The effect of this technical means is as follows.
すなわち、装着ポジションの真下にＮＣプログラムによ
り自動的に高さが切換わるサポートピンと基板上面に電
子部品を装着する基板下面高さを自動的にフィードバッ
クする空圧ゲージにより、基板の厚さと大きさ及び基板
下面に装着された電子部品の位置をＮＣプログラムの操
作と装着する基板下面の高さをＮＣプログラムかして基
板高さ設定できるだめ、機種切換えにおける作業時間の
短縮と自動化がはかれる。In other words, there is a support pin located directly below the mounting position whose height is automatically switched by an NC program, and a pneumatic gauge that automatically feeds back the height of the bottom surface of the board on which electronic components are mounted on the top surface of the board. Since the position of electronic components mounted on the bottom surface of the board can be set by operating an NC program and the height of the bottom surface of the board to be mounted can be set by using an NC program, the work time and automation of model switching can be shortened and automated.
実施例
以下、本発明の一実施例を添付図面にもとづい′て説明
する。第１図において、２ｏは回転テープ６へ一／
ルで、周辺に等間隔に吸着ノズル２１がついておシ吸着
ポジションにて、電子部品２２を吸着し、装着ポジショ
ンまで回転する。２４はＹ軸駆動源で、Ｙテーブル２６
をＹ方向に移動させる。２７はＸ軸駆動源で、Ｘテーブ
ル２３をＸ方向に移動させる。Ｘテーブル２３は、Ｙテ
ーブル２６の上に乗っている為、Ｘ方向とＹ方向の移動
をすることができる。２５は本体ベースで、Ｙ軸駆動源
２４が取付けられている。２８は固定用基板ガイドで、
基板３１をガイドする。２９は移動用基板ガイドで、基
板３１の大きさにより移動させて、基板３１をガイドす
る。３ｏはサポートピンで上下動作して、基板３１を保
持する。第２図において２９はＤＣモータである。ＮＣ
プログラムにより設定した回転数だけ回転する。３３は
ボールネジで、カップリング３６にて、ＤＣモータ３９
に直結されて回転する。３４は伝達ガイドで、ボールネ
ジ３３に連結され、ボールネジ３３が回転すると上下動
作をおこなう。３７はブラケットで、本体ベース２５に
固定されている。そして、ＤＣモータ３９７ヘー７
が取付けられている。３８は回転ガイドで、ボールネジ
３３の軸とＤＣモータ３９の軸を保持する。Embodiment Hereinafter, one embodiment of the present invention will be described with reference to the accompanying drawings. In FIG. 1, 2o is attached to the rotary tape 6, with suction nozzles 21 arranged at equal intervals around the periphery, and the electronic component 22 is suctioned at the suction position, and then rotated to the mounting position. 24 is a Y-axis drive source, and Y table 26
Move in the Y direction. 27 is an X-axis drive source that moves the X table 23 in the X direction. Since the X table 23 rests on the Y table 26, it can move in the X direction and the Y direction. Reference numeral 25 denotes a main body base, to which a Y-axis drive source 24 is attached. 28 is a fixing board guide,
Guide the substrate 31. Reference numeral 29 denotes a moving board guide, which guides the board 31 by moving it depending on the size of the board 31. 3o is a support pin that moves up and down to hold the substrate 31. In FIG. 2, 29 is a DC motor. N.C.
It rotates by the number of rotations set by the program. 33 is a ball screw, which is connected to a DC motor 39 by a coupling 36.
It is directly connected to and rotates. Reference numeral 34 denotes a transmission guide, which is connected to the ball screw 33 and moves up and down when the ball screw 33 rotates. A bracket 37 is fixed to the main body base 25. A DC motor 397H7 is attached. A rotation guide 38 holds the shaft of the ball screw 33 and the shaft of the DC motor 39.
４１はスライド軸で、伝達ガイド３４の回転止めである
。４０は上下ガイドで、伝達ガイド３４に固定され、ス
ライド軸４１とのガイドをおこなう。Reference numeral 41 denotes a slide shaft that prevents the transmission guide 34 from rotating. A vertical guide 40 is fixed to the transmission guide 34 and guides the slide shaft 41.
サポートピン３ｏは、伝達ガイド３４に固定され、ＤＣ
モータ３９の回転数により、ボールネジ３３を通じて設
定されたＮＣプログラムの数値だけ上下動作をして基板
３１を保持する。４１は真空ゲージで、ホース４０によ
りサポートピン３０に配線されている。そして、ＤＣモ
ータ３９を回転させてサポートピン３０を上昇させ、基
板３１の下面の装着部品との空気差圧によ他部品厚さを
測定しフィードバックをする。The support pin 3o is fixed to the transmission guide 34 and
Depending on the rotational speed of the motor 39, the substrate 31 is held by moving up and down by the numerical value of the NC program set through the ball screw 33. 41 is a vacuum gauge, which is wired to the support pin 30 via a hose 40. Then, the DC motor 39 is rotated to raise the support pin 30, and the thickness of other components is measured based on the air pressure difference between the component mounted on the lower surface of the board 31 and fed back.
この基板サポートピンの高さ切換え装置の構造を第１図
〜第３図にもとづいて、詳しく説明する。The structure of this substrate support pin height switching device will be explained in detail with reference to FIGS. 1 to 3.
第１図は、電子部品装着の全体図で、第２図は、基板サ
ポートピンの高さ切換え装置の正面図で、第３図は、基
板サポートピンの高さ切換え装置においての動作図であ
る。これらの図において、最初の工程は、基板３１の装
着ポジションへ、Ｘ軸駆動源２７とＹ軸駆動源２４によ
り基板３１を移動させ、そのポジションでの基板下面高
さを、ＤＣモータ３９を回転させてサポートピン３０を
上昇させて、サポートビン３ｏ接触面の空気差を真空ゲ
ージ４１を通じて測定し、フィードバックをする。次の
工程として、フィードバックされた数値をサポートピン
３Ｑの高さ切換ＮＣプログラムに置きかえて、実際の装
着ポジションでのサポートピン自動高さ切換えをおこな
う。Figure 1 is an overall view of electronic component mounting, Figure 2 is a front view of the board support pin height switching device, and Figure 3 is an operational diagram of the board support pin height switching device. . In these figures, the first step is to move the board 31 to the mounting position of the board 31 using the X-axis drive source 27 and the Y-axis drive source 24, and then rotate the DC motor 39 to adjust the height of the bottom surface of the board at that position. Then, the support pin 30 is raised, and the air difference on the contact surface of the support bin 3o is measured through the vacuum gauge 41 and feedback is provided. As the next step, the fed-back value is replaced with the NC program for switching the height of the support pin 3Q, and automatic height switching of the support pin at the actual mounting position is performed.
発明の効果
以上、本発明は電子部品装置の一ユニットであって装着
ポジションにて、基板を保持するサポートピンをＮＣプ
ログラムにより自動的に高さを切換えられると同時に、
サポートピンと接触する部品との空気差圧を利用して、
基板下面の高さをフィードバックすることができるため
、機種切換えにおける作業時間の短縮と自動化ができる
。In addition to the effects of the invention, the present invention is a unit of an electronic component device, and at the mounting position, the height of the support pin that holds the board can be automatically changed by an NC program, and at the same time,
Utilizing the air pressure difference between the support pin and the parts in contact,
Since the height of the bottom surface of the board can be fed back, it is possible to shorten the work time and automate the process of switching between models.
第１図は本発明の一実施例における基板サポ−９へ−／
゛
ト装置の斜視図、第２図、第３図は同要部断面図、第４
図は従来の基板サポート装置の斜視図、第６図、第６図
は同要部断面図である。
３ｏ・・・・・・サポートピン、３１・・・・・基板、
３３・・・・・・ボールネジ、３９・・・・・・ＤＣモ
ータ、４１・・・・・・真空ゲージ。Figure 1 shows the board support 9 in one embodiment of the present invention.
A perspective view of the target device, Figures 2 and 3 are sectional views of the same main parts, Figure 4
The figure is a perspective view of a conventional substrate support device, and FIGS. 6 and 6 are sectional views of essential parts thereof. 3o... Support pin, 31... Board,
33... Ball screw, 39... DC motor, 41... Vacuum gauge.
Claims (4)
吸着ヘッドと対向する側よりサポートピンにより基板を
支持する装置であって、サポートピンを装着するポジシ
ョンごとに高さを切換え可能に構成してなる基板サポー
ト装置。(1) When mounting electronic components on a board using a suction head,
A substrate support device that supports a substrate with support pins from a side facing a suction head, and is configured such that the height can be changed for each position where the support pins are attached.
トピンを設けた支持部とこの支持部を上下動させる駆動
部とからなる特許請求の範囲第１項記載の基板サポート
装置。(2) The substrate support device according to claim 1, which comprises a support section provided with support pins and a drive section that moves the support section up and down so that the height of the support pins can be changed.
支持部を回転防止なよう設けられた特許請求の範囲第１
項記載の基板サポート装置。(3) The drive section is composed of a ball screw and a motor, and is provided to prevent the support section from rotating.
Board support device as described in Section.
、保持する下部の高さを、空圧の差により高さ設定でき
るよう構成した特許請求の範囲第１項記載の基板サポー
ト装置。(4) The substrate support device according to claim 1, wherein the pins for supporting the substrate are formed of pneumatic pressure gauges, and the height of the lower part of the substrate to be held can be set by a difference in air pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62319467A JP2636285B2 (en) | 1987-12-17 | 1987-12-17 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62319467A JP2636285B2 (en) | 1987-12-17 | 1987-12-17 | Electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01160099A true JPH01160099A (en) | 1989-06-22 |
| JP2636285B2 JP2636285B2 (en) | 1997-07-30 |
Family
ID=18110527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62319467A Expired - Lifetime JP2636285B2 (en) | 1987-12-17 | 1987-12-17 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2636285B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03120798A (en) * | 1989-10-03 | 1991-05-22 | Matsushita Electric Ind Co Ltd | Device for automatically switching printed circuit board support and component mounting machine |
| JPH03160793A (en) * | 1989-11-17 | 1991-07-10 | Sanyo Electric Co Ltd | Board supporting apparatus |
| JPH0452800U (en) * | 1990-09-11 | 1992-05-06 | ||
| CN100359428C (en) * | 2005-01-06 | 2008-01-02 | 大同股份有限公司 | Dual-purpose fixing post |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593300A (en) * | 1979-01-08 | 1980-07-15 | Hitachi Ltd | Device for assembling and inspecting part to substrate |
| JPS5822766U (en) * | 1981-08-05 | 1983-02-12 | 上村工業株式会社 | Printed circuit board suction device |
| JPS5929492A (en) * | 1982-08-10 | 1984-02-16 | 三洋電機株式会社 | Substrate backup device for automatic electronic part mounting machine |
| JPS61121400A (en) * | 1984-11-16 | 1986-06-09 | 松下電器産業株式会社 | Supporter for circuit substrate |
| JPS62196895A (en) * | 1986-02-24 | 1987-08-31 | 三洋電機株式会社 | Controller for electronic parts attraction |
| JPS6391334U (en) * | 1986-12-04 | 1988-06-13 |
-
1987
- 1987-12-17 JP JP62319467A patent/JP2636285B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5593300A (en) * | 1979-01-08 | 1980-07-15 | Hitachi Ltd | Device for assembling and inspecting part to substrate |
| JPS5822766U (en) * | 1981-08-05 | 1983-02-12 | 上村工業株式会社 | Printed circuit board suction device |
| JPS5929492A (en) * | 1982-08-10 | 1984-02-16 | 三洋電機株式会社 | Substrate backup device for automatic electronic part mounting machine |
| JPS61121400A (en) * | 1984-11-16 | 1986-06-09 | 松下電器産業株式会社 | Supporter for circuit substrate |
| JPS62196895A (en) * | 1986-02-24 | 1987-08-31 | 三洋電機株式会社 | Controller for electronic parts attraction |
| JPS6391334U (en) * | 1986-12-04 | 1988-06-13 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03120798A (en) * | 1989-10-03 | 1991-05-22 | Matsushita Electric Ind Co Ltd | Device for automatically switching printed circuit board support and component mounting machine |
| JPH03160793A (en) * | 1989-11-17 | 1991-07-10 | Sanyo Electric Co Ltd | Board supporting apparatus |
| JPH0452800U (en) * | 1990-09-11 | 1992-05-06 | ||
| CN100359428C (en) * | 2005-01-06 | 2008-01-02 | 大同股份有限公司 | Dual-purpose fixing post |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2636285B2 (en) | 1997-07-30 |
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