JPH03160793A - Board supporting apparatus - Google Patents

Abstract

PURPOSE:To cope with variation in the thickness of a board without varying the length of a backup pin by providing a level difference maintaining function for performing a function to hold a height level difference between a backup pin base at a time point when the upper surface of the board is brought into contact with a stopper and a board guide constant. CONSTITUTION:A level difference maintaining mechanism 35 for eliminating contraction of a height level difference between a board guide 26 and a backup pin base 51 at a predetermined value or more is composed of a block 36 secured to the lower part of a roller base 27. When a board 12 is conveyed to a home position of the guide 26, the base 51 approaches stoppers 8, 11, the guide 26 approaches the stoppers 8, 11 together with the base 51, and the guide 26 presses the upper surface of the board 12 into contact with the stoppers 8, 11. Simultaneously, the upper end of the pin 52 is brought into contact with the lower surface of the board 12, but the pin 52 does not pressurize the board 12 more than that by the operation of the mechanism 35. Thus, it can cope with variation in the thickness of the board without varying the length of the pin 52.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to an apparatus for supporting a board without bending when performing various processing on the upper surface of a horizontally placed board using an electronic component mounting machine or the like. Regarding.

(B) Conventional technology As a device for regulating the deflection of a board when a component mounting machine mounts an electronic component on a board, many devices that support the back wall of the board with backup pins have been put into practical use. The reason why the bottle-shaped member is used to support the board is that it can avoid parts mounted on the back side of the board. It can be seen in the official bulletin. This device has a table that removably supports multiple backup pins fixed to an XY table, and when a board is carried along the grooves of a pair of board transport chutes placed on this table, the board is transported. The chute descends to bring backup pins into contact with the bottom of the board, supporting the board at multiple points.

(c) Problems to be solved by the invention In the above device, since the amount of descent of the substrate transport chute is constant, in order to back up substrates of different thicknesses, multiple types of backup pins of different lengths must be prepared. However, each time the thickness of the board changes, it is necessary to replace it with a backup pin of an appropriate length.

The present invention aims to provide a device that can accommodate changes in the thickness of the substrate without changing the length of the backup pin. The stop flange that hits the button on the board is extended, and the backup pin base and the board guide approach the stopper and the backup pin base is placed between the backup pin base and the board guide when the top surface of the board hits the stop flange. A level maintenance mechanism is provided that functions to maintain a constant height difference between the board guide and the board guide.

(E) When the board is carried into the fixed position of the working board guide, the backup pin base approaches the stopper.

Together with the backup pin base, the substrate guide also approaches the stopper, and the substrate guide presses the substrate against the stopper. At the same time, the upper end of the backup pin comes into contact with the lower crest of the board, but the level difference maintaining mechanism prevents the backup pin from pressing the board any further.

(f) Examples An embodiment will be described based on the drawings.

1 and 2 show the structure of a substrate support device 1 according to the present invention. On both sides of the substrate support device 1 are conveyors 2 that receive substrates from a pre-process device (not shown) and feed them into the substrate support device 1, and a conveyor 2 that receives processed substrates from the substrate support device 1 and sends them to a post-process device (not shown) for dispersion. A carry-out conveyor 3 is arranged to feed the substrates.

The substrate support device 1 has a guide support plate 5 attached to a support column 4 extending from a base (not shown). 6 is the guide support plate 5
This is a guide support plate paired with the support plate 7, which is supported by the upper end of a support column 7 that is movable on the base in a direction perpendicular to the substrate conveyance direction. A stopper 8 is identified at the upper end of the guide support plate 5.

The stopper 8 is a plate-shaped member extending along the substrate conveyance direction, and protrudes toward the inside of the substrate support device 1 like an eaves. A horizontally extending platform 9 is formed on the outer vertical surface of the guide support plate 6, and a stopper 1 paired with the stopper 8 is mounted on the upper surface of the guide support plate 6 via two sets of slide guides 10.
1 is supported. The stopper 11 is slidable in a direction perpendicular to the substrate conveyance direction. An air cylinder 15 is attached to the outer vertical peak of the guide support plate 6. A flange 14 is fixed to the rod 16 of the air cylinder 15,
Furthermore, a connecting shaft 19 is fixed to the tip thereof. Connecting shaft 1
9 passes through a connecting plate 17 that hangs down from the stopper 11.

A coil spring 18 is inserted between the head of the connecting shaft 19 and the connecting plate 17, and serves to constantly press the connecting plate 17 against the flange 14. P portions 20 are formed in the stoppers 8 and 11 at the edges facing each other. Stepped portion 20
The vertical wall serves as a guide rail and orients the substrates sent in from the carry-in conveyor 2. Stepped portion 20
The ceiling surface of the board 12 extends over both side edges of the board 12.

A vertically extending slide guide 25 is attached to the inner side of the guide support plates 5 and 6. Slide guide 2
5 supports a substrate guide 26 via a slider 28 so as to be movable up and down. A stopper 29 is fixed to the lower end of the guide support plates 5 and 6, and supports the substrate guide 26 at that position.

The substrate guide 26 is mainly composed of a roller base 27. A plurality of support rollers 34 are arranged at regular intervals on the upper edge of the inner box of the roller base 27 in the substrate transport direction. On the lower surface of the support roller 34, an endless belt 31 that moves due to the rotation of the drive pulley 30 is connected to a plurality of tension pulleys 3.
2, and when the endless belt 31 moves, the support roller 34 also rotates. When the carry-in conveyor 2 feeds the substrate 12 onto the support roller 34, the drive pulley 30
is rotated by a belt 33 connected to a motor (not shown), which also rotates a support roller 34 to transport the substrate 2 to a predetermined position.

40 and 41 are stop mechanisms that determine the stop position of the substrate 12. The stop mechanism 40 engages with the front edge of the loaded substrate to determine the stopping position of the substrate 12, and serves as a so-called front reference. The stop mechanism 41 engages with the trailing edge of the loaded substrate to determine the stopping position of the substrate, and is used for a rear reference. It goes against the substrate feeding direction and hits the stop mechanism 41>. The stop mechanisms 40, 41 have a symmetrical structure. In the stop mechanisms 40 and 41, a contact plate 43 is rotatably attached to a support shaft 42 that projects horizontally from the roller base 27. A pin 44 protrudes from the top of the abutting plate 43, and one end of a coil spring 45 is connected to this pin 44. The other end of the coil spring 45 is connected to a braget 46 attached to the guide support plate 5. For the stop mechanism 40, the abutment plate 43 is rotated clockwise in FIG. 1, and for the stop mechanism 41, the abutment plate 43 is rotated counterclockwise. It is biased clockwise.

An air cylinder 47 is attached to the bracket 46 facing upward, and a pusher block 49 is attached to the tip of the rod. The pusher block 49 has a pin 5O protruding from the abutment plate 49 that is attached to a coil spring 45.
They are constantly pressed together by the urging force of. When the air cylinder 47 passes the board, it pulls in the iron, and the contact plate 4
Defeat 3.

Further, when stopping the board, the rond is pushed out and the abutting plate 43 is made to stand upright.

Below the board support ml&1 is the pack-up pin base 5.
1 is placed. A plurality of backup pins 52 are detachably attached to the upper surface of the backup pin base 51. 53 is a column 55 on the base (not shown) mentioned above.
The cylinder base is supported by Bearings 56 (only two are shown) are attached to the four corners of the cylinder base 53, and a vertical guide rod 57, one end of which is fixed to the lower surface of the backup pin base 51, is fitted therein.

An air cylinder 59 is attached to the center of the cylinder base 53. A rod 60 of the air cylinder 59 is connected to the lower surface of the pack Azzo pin base 51 via a joint 61, and the backup pin base 51 is moved up and down by taking the rod 60 in and out.

351 board guide 26 and backup pin base 51
This is a level difference maintaining mechanism that prevents the height difference between the roller base 27 and the roller base 27 from becoming smaller than a certain value, and is constituted by a block 36 fixed to the lower part of the roller base 27. The block 36 abuts the top surface of the backup pin base 51.

Next, a series of operations in which the substrate support device 1 supports a substrate will be explained based on FIGS. 2 to 4. First, the substrate 12 is sent from the carry-in conveyor 2 onto the support rollers 34 of the substrate support device 1 . At this time, the board guide 26 is in the lowered position,
The contact between Fm of the stoppers 8 and 11 and the upper surface of the support roller 34 is greater than the surface of the substrate 12. In addition, the air cylinder 15 also advances the rod 16, and the stoppers 8, 1
The vertical walls of the step portions 20 are separated from each other by a distance greater than the width of the substrate 12. By the rotation of the support roller 34, the substrate 12 is conveyed along the vertical wall of the stepped portion 20, and when the substrate stopper 40 or the support roller 34 is reversed halfway, it hits the substrate stopper 41 and is stopped. Figure 2). Next, the pack-up pin base 51 begins to rise due to the operation of the air cylinder 59. During the ascent, the pack-up pin base 51 engages with the block 36 (FIG. 3).

At the same time, the pack-up pin 52 also comes into contact with the lower surface of the base 12. When the backup pin base 51 further rises,
The backup pin base 51 and the A-plate guide 26 rise while maintaining the level difference shown in FIG. 3, and press the top surface of the board 12 against the ceiling surface of the stepped portion 20 of the stoppers 8 and 11 (FIG. 4). This determines the height of the top surface of the substrate 12. The rise of the backup pin base 51 also ends here. After this, the air cylinder 15 retracts the rod 16, slides the stopper 11, and clamps the substrate 12.

5 and 6 show how substrates 12 having different thicknesses are supported. In this device, the final height of the back-up pin base 51 changes depending on the thickness of the substrate 12, and the level difference between the upper end of the backup pin 52 and the lower surface of the stoppers 8 and 11 always matches the substrate thickness. . Therefore, the same backup pin 52 can be used for substrates of any thickness.

(G) Effects of the Invention In the present invention, the backup pin base pushes up the board guide toward the stopper that hits the top surface of the board, and when the top surface of the board hits the stopper, the backup pin base and the board guide are at a straightness level. By providing a level difference maintenance mechanism that maintains a constant level, it is now possible to perform backup according to the thickness of the board without changing the length of the backup pin.

[Brief explanation of the drawing]

Figure 1 is an oblique view showing the structure of the substrate support device, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figures 3 and 4 show a series of operations in which the substrate support device supports the substrate. The blood cut diagrams, FIGS. 5 and 6 are cross-sectional views showing how the substrate support and preparation device 1 supports substrates of different thicknesses. 12... Board, 26... Board guide, 51... Backup pin base, 52... Backup pin,
8, l1...stopper 35...level difference maintenance mechanism. Figure 3 Figure 4 j. ) 5 Figure 6 Figure 1

Claims (1)

[Claims] (1) Both sides of the board are supported by board guides, and
In the device in which the span between the board guides is supported by a backup pin planted in a backup pin base that is movable up and down, a stopper that comes into contact with the top surface of the board is protruded above the board guide, and a stopper that touches the top surface of the board is provided, and the span between the backup pin base and the board guide is A level difference maintenance mechanism is provided between the backup pin base and the board guide that functions to maintain a constant height level difference between the backup pin base and the board guide when the board guide approaches the stopper and the top surface of the board hits the stopper. A substrate support device characterized by being provided with.