JPH06267808A - Multiple-chamber apparatus having guide mechanism for connecting chamber - Google Patents

Abstract

PURPOSE:To provide a multiple-chamber apparatus having the guide mechanism for connecting chambers, which can facilitate the attachment and removal of process chambers so that the process chambers can be moved in the directions the X axis, the Y axis and the Z axis. CONSTITUTION:This is the multiple-chamber apparatus, which is used in the semiconductor manufacturing process, wherein the processing is performed in the integrated way. A plurality of process chambers 2-5 are connected to a wafer conveying chamber 1. Guide mechanisms 6-9 can move a plurality of these process chambers 2-5. In the guide mechanisms 6 (7-9), an X-axis- direction moving stage 12, which can be moved in the vertical direction, and a Y-axis-direction moving stage 13, which can be moved in the parallel direction, with respect to a contact surface 11 of the wafer conveying chamber 1 are provided. The process chambers 2 (3-5) are mounted on the Y-axis-direction moving stage 13 and connected to the wafer conveying chamber 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-chamber apparatus used in a semiconductor manufacturing process, and more particularly, when a plurality of process chambers are connected to a wafer transfer chamber, the process chamber can be easily attached / detached and its maintainability can be improved. The present invention relates to a technique effectively applied to a multi-chamber apparatus with a guide mechanism for connecting a chamber, which can be improved.

[0002]

2. Description of the Related Art In recent years, along with the progress of high integration of LSI and miniaturization of devices, a semiconductor manufacturing apparatus is required to have a new technology, and a multi-chamber apparatus including a plurality of processes is required. Is one of them. This multi-chamber apparatus has been proposed and manufactured by semiconductor device manufacturers in Japan and overseas since the latter half of the 1980's as one of the development forms of the semiconductor manufacturing apparatus in the future for the following reasons.

(1). Since the multi-chamber system is capable of consistently processing wafers in a vacuum or an inert gas atmosphere, contamination from the outside is prevented when forming each layer,
It is possible to improve the quality and further stabilize the quality.

(2) Since it is an integrated process in the multi-chamber system, the time required for wafer transfer can be reduced,
The process as a whole can be shortened.

(3). In the multi-chamber, the multi-chamber is constructed to cope with the new process.
Since only one process chamber is newly manufactured and the conventional wafer transfer robot unit, load lock chamber and the like can be used as they are, the device cost for semiconductor manufacturing can be reduced.

[0006] Next, an outline of the multi-chamber apparatus will be described. For example, the multi-chamber apparatus that has been manufactured up to now has a plurality of process processing apparatuses connected to a wafer transfer apparatus to perform integrated processing of a part of the process processing. It is intended.

The basic structure of the multi-chamber is a wafer transfer chamber, which is the backbone of the multi-chamber, and a process chamber and a load-lock chamber connected to the periphery of the wafer transfer chamber. If so, it is possible to perform consistent continuous processing from pretreatment to thin film depot.

[0008]

However, the above-mentioned conventional techniques have the following problems.

(1). Since the process chamber does not have a fine movement mechanism with respect to the wafer transfer chamber, when connecting the process chamber to the basic wafer transfer chamber,
It is difficult to fit the connection surface correctly.

(2). When it becomes necessary to connect the process chambers to the basic wafer transfer chamber at different connection timings, the existing process chambers are adjacent to each other. There is no space and connection work cannot be done.

(3) It is difficult to access the process chamber because the working space is narrow even when the apparatus is maintained.

As described above, the conventional multi-chamber apparatus has an extremely troublesome structure when connecting process chambers and when performing further maintenance.

Therefore, an object of the present invention is to make at least the process chamber movable in the X-axis direction, the Y-axis direction and the Z-axis direction so that the process chamber can be easily attached and detached and the maintainability can be improved. An object is to provide a multi-chamber device with a guide mechanism for connecting chambers.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0015]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, in the multi-chamber apparatus with the guide mechanism for connecting chambers of the present invention, at least a plurality of process chambers are connected to the wafer transfer chamber, and wafers are sequentially inserted into the plurality of process chambers to perform consistent process processing. A multi-chamber apparatus used in a semiconductor manufacturing process performed subsequently, which is provided with a guide mechanism capable of moving a process chamber.

In this case, the guide mechanism includes an X-axis direction moving stage that can move vertically and a Y-axis direction moving stage that can move parallel to the connection surface of the wafer transfer chamber. It was done like this.

Further, as the guide mechanism, a Z-axis direction moving mechanism capable of adjusting the position of the process chamber in the height direction is added.

Further, the wafer transfer chamber can be moved in the X-axis direction, the Y-axis direction and the Z-axis direction.

[0020]

According to the multi-chamber apparatus with the guide mechanism for connecting the chambers described above, the guide mechanism including the X-axis direction moving stage and the Y-axis direction moving stage is provided on the connection surface of the wafer transfer chamber, so that the X-axis moving stage is provided. The process chamber may be mounted on the directional movement stage or the Y-axis direction movement stage, and the X-axis direction movement stage and the Y-axis direction movement stage may be relatively moved to connect the process chamber to the wafer transfer chamber.

With this, the process chamber can be easily moved independently in the direction parallel to the connection surface of the wafer transfer chamber and in the direction parallel to the connection surface, so that the process chamber can be easily positioned at a predetermined position on the connection surface of the wafer transfer chamber. However, the wafer transfer chamber and the process chamber can be easily connected, and similarly, the process chamber can be easily removed from the wafer transfer chamber.

Further, since the Z-axis direction moving mechanism is added, the position of the process chamber in the height direction can be adjusted, so that the process chamber can be finely adjusted to be connected to the wafer transfer chamber. be able to.

Further, since the wafer transfer chamber can be moved in the X-axis direction, the Y-axis direction and the Z-axis direction, the wafer transfer chamber can be easily moved in addition to the process chamber. The connection with the process chamber can be relatively possible.

[0024]

FIG. 1 is a plan view showing a multi-chamber apparatus with a guide mechanism for connecting chambers according to an embodiment of the present invention, and FIG. 2 is a partial sectional side view showing the multi-chamber apparatus with a guide mechanism for connecting chambers of this embodiment. It is a figure.

First, the structure of the multi-chamber apparatus with a chamber connecting guide mechanism of this embodiment will be described with reference to FIG.

The multi-chamber apparatus with a guide mechanism for connecting a chamber of the present embodiment is a multi-chamber apparatus used in a semiconductor manufacturing process in which wafers are sequentially inserted into a plurality of process chambers and the process processing is performed consistently. , Four process chambers 2 to 5 are connected to the wafer transfer chamber 1, and guide mechanisms 6 to 9 are provided that allow the process chambers 2 to 5 to move. The guide mechanisms 6 to 9 allow the process chambers to move. 2 to
5 is moved and connected to the wafer transfer chamber 1.

The wafer transfer chamber 1 is arranged at the center of the apparatus via a pedestal 10, and four process chambers 2 to 5 are connected to the periphery thereof. The process chambers 2 to 5 are mounted on the guide mechanisms 6 to 9, respectively.

The guide mechanism 6 (7 to 9) includes, for example, as shown in FIG. 2, an X-axis direction moving stage 12 which is movable in the vertical direction with respect to the connection surface 11 of the wafer transfer chamber 1. A Y-axis direction moving stage 13 that is movable in a parallel direction is provided, and the process chamber 2 (3 to
5) is placed.

The X-axis direction moving stage 12 includes a guide rail 15 perpendicular to the connecting surface 11 of the wafer transfer chamber 1.
And the Y-axis direction moving stage 13 moves in the X direction.
On the axial movement stage 12, the X-axis movement stage 12 is mounted via a guide rail 16 parallel to the connection surface 11 of the wafer transfer chamber 1.

The X-axis direction moving stage 12 and the Y-axis direction moving stage 13 are respectively provided with the guide rail 1.
5 and 16, the process chambers 2 (3 to 5) are moved to the wafer transfer port 17 of the wafer transfer chamber 1 while the process chambers 2 (3 to 5) are positionally adjusted in the X-axis direction and the Y-axis direction. The wafer transfer port 18 of 5) is connected.

Next, the operation of this embodiment will be described for the case where the process chambers 2 to 5 are actually connected to the wafer transfer chamber 1.

First, the process chamber 2 is installed on the Y-axis direction moving stage 13 on the X-axis direction moving stage 12. Then, the process chamber 2 is moved in a direction parallel to the connection surface 11 of the wafer transfer chamber 1 along the guide rail 15 of the X-axis direction moving stage 12, and then the guide rail 1 of the Y-axis direction moving stage 13 is moved.
Move along 6 vertically.

Thus, the process chamber 2 can be easily connected to the wafer transfer chamber 1 by independently moving in the parallel and vertical directions. Similarly, the remaining process chambers 3 to 5 can be easily connected in order by moving in the parallel direction and the vertical direction by the X-axis direction moving stage 12 and the Y-axis direction moving stage 13.

Further, when the process chambers 2 to 5 are removed from the wafer transfer chamber 1, the functions of the X-axis direction moving stage 12 and the Y-axis direction moving stage 13 can be utilized. The process chamber 2 can be easily removed by moving it in the direction perpendicular to the connection surface 11 of the wafer transfer chamber 1 via the axial movement stage 12.

Therefore, according to the multi-chamber apparatus with the chamber connecting guide mechanism of the present embodiment, the X-axis direction moving stage 12 that is movable in the vertical direction is parallel to the connecting surface 11 of the wafer transfer chamber 1. Guide mechanism 6 to 9 by the Y-axis direction moving stage 13 that is movable in the direction
By providing the process chambers 2 to 5 adjacent to each other and the work space is narrow, the process chamber 2
˜5 are independently moved in the vertical direction and the parallel direction by the guide mechanisms 6 to 9, and the wafer transfer port 1 of the wafer transfer chamber 1 is moved.
7, the wafer transfer port 1 of the process chambers 2-5
8 can be easily aligned and easily connected.

Although the invention made by the present inventor has been concretely described above based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, with respect to the multi-chamber apparatus with the guide mechanism for connecting the chambers of the present embodiment, the case where the process chambers 2 to 5 are moved in the direction parallel to the vertical direction has been described, but the present invention is not limited to the embodiment. However, the present invention can be widely applied to the case where a Z-axis direction moving mechanism that enables position adjustment of the process chamber in the height direction is added. In this case, since the alignment of the process chamber can be finely adjusted, the wafer transfer chamber and the process chamber can be connected more easily.

Further, in the present embodiment, the case where the wafer transfer chamber 1 is simply arranged via the pedestal 10 has been described, but, for example, like the process chamber, in the X-axis direction,
It is also possible to move in the Y-axis direction and the Z-axis direction, and in this case, positioning can be performed by relative movement between the wafer transfer chamber and the process chamber.

Further, regarding the guide mechanisms 6 to 9 of this embodiment, the X-axis direction moving stage 12 and the Y-axis direction moving stage 13 which move along the guide rails 15 and 16 are provided.
However, the present invention is not limited to the above case, and is applicable to the case where a gear mechanism such as a rack and pinion is used.

Regarding the shape of the wafer transfer chamber 1 and the quantity of the process chambers 2 to 5, six process chambers are connected to the hexagonal wafer transfer chamber in accordance with the process of the semiconductor manufacturing process. In this case, it can be widely applied to a configuration in which more or less process chambers are connected.

Further, in addition to the process chamber, the wafer transfer chamber 1 is connected with a wafer loader chamber for supplying a wafer and a wafer unloader chamber for discharging a wafer, and when these are similarly connected by the guide mechanism, further. It is needless to say that the present invention can be applied to various connection configurations such as a configuration in which another wafer transfer chamber connected to another process chamber is connected.

[0042]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1) As a guide mechanism for moving a process chamber connected to the wafer transfer chamber, for example, an X-axis direction moving stage and a parallel stage that can move in a vertical direction with respect to a connection surface of the wafer transfer chamber. By including a Y-axis direction moving stage that is movable in the direction, the process chamber is placed on the X-axis direction moving stage or the Y-axis direction moving stage, and the X-axis direction moving stage and the Y-axis direction moving stage are moved relative to each other. It is possible to position the process chamber at a predetermined position on the connection surface of the wafer transfer chamber and to easily connect the wafer transfer chamber and the process chamber.

(2). As a guide mechanism, by adding a Z-axis direction moving mechanism that enables position adjustment of the process chamber in the height direction, position adjustment can be performed by adding movement in the height direction of the process chamber. Therefore, the connection can be made by fine adjustment in the X-axis direction, the Y-axis direction, and the Z-axis direction.

(3). Set the wafer transfer chamber in the X-axis direction, Y
Since the wafer transfer chamber can be easily moved in addition to the process chamber by being movable in the axial direction and the Z-axis direction, the wafer transfer chamber and the process chamber can be relatively connected to each other.

(4) According to the above (1) to (3), especially when a plurality of process chambers are connected to the wafer transfer chamber, the wafer transfer chamber and the process chamber can be easily connected, In addition, since the removal can be performed easily as well, it is possible to obtain the multi-chamber apparatus that can facilitate the attachment / detachment of the process chamber and improve the maintainability.

[Brief description of drawings]

FIG. 1 is a plan view showing a multi-chamber apparatus with a chamber connecting guide mechanism according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional side view showing a multi-chamber apparatus with a chamber connecting guide mechanism of the present embodiment.

[Explanation of symbols]

 1 Wafer Transfer Chamber 2-5 Process Chamber 6-9 Guide Mechanism 10 Stand 11 Connection Surface 12 X-Axis Direction Moving Stage 13 Y-Axis Direction Moving Stage 14 Stand 15 Guide Rail 16 Guide Rail 17 Wafer Transfer Port 18 Wafer Transfer Port

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuhide Mitsutake 2326 Imai, Ome City, Tokyo, Hitachi Device Development Center (72) Inventor Toru Miyazaki 2326 Imai, Ome City, Tokyo Hitachi, Ltd. Device Development In the center

Claims (4)

[Claims] 1. A multi-chamber apparatus for use in a semiconductor manufacturing process in which at least a plurality of process chambers are connected to a wafer transfer chamber, and wafers are sequentially inserted into the plurality of process chambers to perform process processing consistently. A multi-chamber apparatus with a guide mechanism for chamber connection, comprising a guide mechanism for moving the process chamber, and moving the process chamber by the guide mechanism to connect to the wafer transfer chamber. 2. The guide mechanism includes an X-axis direction moving stage movable in a vertical direction and a Y-axis direction moving stage movable in a parallel direction with respect to a connection surface of the wafer transfer chamber, The process chamber is mounted on the X-axis direction moving stage or the Y-axis direction moving stage, and the X-axis direction moving stage and the Y-direction moving stage are mounted.
2. The multi-chamber apparatus with a chamber connecting guide mechanism according to claim 1, wherein the process chamber is connected to the wafer transfer chamber by relatively moving an axial movement stage. 3. The guide mechanism for connecting a chamber according to claim 1, wherein a Z-axis direction moving mechanism that enables position adjustment in the height direction of the process chamber is added as the guide mechanism. Multi-chamber device. 4. The wafer transfer chamber is arranged in the X-axis direction,
The multi-chamber device with a guide mechanism for connecting a chamber according to claim 1, wherein the multi-chamber device is movable in the Y-axis direction and the Z-axis direction.