JPH0451488Y2 - - Google Patents

Info

Publication number
JPH0451488Y2
JPH0451488Y2 JP1987056960U JP5696087U JPH0451488Y2 JP H0451488 Y2 JPH0451488 Y2 JP H0451488Y2 JP 1987056960 U JP1987056960 U JP 1987056960U JP 5696087 U JP5696087 U JP 5696087U JP H0451488 Y2 JPH0451488 Y2 JP H0451488Y2
Authority
JP
Japan
Prior art keywords
circuit board
wiring conductor
external
lead
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987056960U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63164245U (instruction
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987056960U priority Critical patent/JPH0451488Y2/ja
Publication of JPS63164245U publication Critical patent/JPS63164245U/ja
Application granted granted Critical
Publication of JPH0451488Y2 publication Critical patent/JPH0451488Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1987056960U 1987-04-15 1987-04-15 Expired JPH0451488Y2 (instruction)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987056960U JPH0451488Y2 (instruction) 1987-04-15 1987-04-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987056960U JPH0451488Y2 (instruction) 1987-04-15 1987-04-15

Publications (2)

Publication Number Publication Date
JPS63164245U JPS63164245U (instruction) 1988-10-26
JPH0451488Y2 true JPH0451488Y2 (instruction) 1992-12-03

Family

ID=30886237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987056960U Expired JPH0451488Y2 (instruction) 1987-04-15 1987-04-15

Country Status (1)

Country Link
JP (1) JPH0451488Y2 (instruction)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160154A (ja) * 1984-01-30 1985-08-21 Nec Kansai Ltd Ｈｉｃ

Also Published As

Publication number Publication date
JPS63164245U (instruction) 1988-10-26

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