JPH0451485Y2 - - Google Patents

Info

Publication number
JPH0451485Y2
JPH0451485Y2 JP1988063301U JP6330188U JPH0451485Y2 JP H0451485 Y2 JPH0451485 Y2 JP H0451485Y2 JP 1988063301 U JP1988063301 U JP 1988063301U JP 6330188 U JP6330188 U JP 6330188U JP H0451485 Y2 JPH0451485 Y2 JP H0451485Y2
Authority
JP
Japan
Prior art keywords
ceramic substrate
semiconductor
rounded
width
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1988063301U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01167052U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988063301U priority Critical patent/JPH0451485Y2/ja
Publication of JPH01167052U publication Critical patent/JPH01167052U/ja
Application granted granted Critical
Publication of JPH0451485Y2 publication Critical patent/JPH0451485Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP1988063301U 1988-05-16 1988-05-16 Expired JPH0451485Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063301U JPH0451485Y2 (enExample) 1988-05-16 1988-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063301U JPH0451485Y2 (enExample) 1988-05-16 1988-05-16

Publications (2)

Publication Number Publication Date
JPH01167052U JPH01167052U (enExample) 1989-11-22
JPH0451485Y2 true JPH0451485Y2 (enExample) 1992-12-03

Family

ID=31288809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063301U Expired JPH0451485Y2 (enExample) 1988-05-16 1988-05-16

Country Status (1)

Country Link
JP (1) JPH0451485Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731549Y2 (ja) * 1988-11-11 1995-07-19 京セラ株式会社 半導体パッケージ用セラミック基板
JP5617574B2 (ja) * 2010-12-01 2014-11-05 株式会社村田製作所 セラミック多層基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5572064A (en) * 1978-11-25 1980-05-30 Kyocera Corp Ceramic substrate
JPS5750062A (en) * 1980-09-09 1982-03-24 Toshiba Corp Magnetic disk controller

Also Published As

Publication number Publication date
JPH01167052U (enExample) 1989-11-22

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