JPH04501685A - ダイヤモンド切断方法 - Google Patents

ダイヤモンド切断方法

Info

Publication number
JPH04501685A
JPH04501685A JP1511199A JP51119989A JPH04501685A JP H04501685 A JPH04501685 A JP H04501685A JP 1511199 A JP1511199 A JP 1511199A JP 51119989 A JP51119989 A JP 51119989A JP H04501685 A JPH04501685 A JP H04501685A
Authority
JP
Japan
Prior art keywords
diamond
cut
cutting
vertices
cutting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1511199A
Other languages
English (en)
Japanese (ja)
Inventor
セナナヤケ ダヤ ランジット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPH04501685A publication Critical patent/JPH04501685A/ja
Pending legal-status Critical Current

Links

Classifications

    • AHUMAN NECESSITIES
    • A44HABERDASHERY; JEWELLERY
    • A44CPERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C17/00Gems or the like
    • A44C17/001Faceting gems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Adornments (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP1511199A 1988-11-16 1989-11-14 ダイヤモンド切断方法 Pending JPH04501685A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
LK9954 1988-11-16
LK995488 1988-11-16

Publications (1)

Publication Number Publication Date
JPH04501685A true JPH04501685A (ja) 1992-03-26

Family

ID=19720957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1511199A Pending JPH04501685A (ja) 1988-11-16 1989-11-14 ダイヤモンド切断方法

Country Status (10)

Country Link
US (1) US5190024A (forum.php)
EP (1) EP0561770A1 (forum.php)
JP (1) JPH04501685A (forum.php)
CN (1) CN1019775B (forum.php)
AU (1) AU630124B2 (forum.php)
IL (1) IL92313A0 (forum.php)
IN (1) IN174710B (forum.php)
MY (1) MY106338A (forum.php)
WO (1) WO1990005624A1 (forum.php)
ZA (1) ZA898713B (forum.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648411U (ja) * 1992-12-15 1994-07-05 京セラ株式会社 装飾部材

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10501441A (ja) * 1995-01-27 1998-02-10 ロジャース,ジェラルド,ヴイ. 球状部のある宝石はめ込み装置
US5932119A (en) 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system
RU2133195C1 (ru) * 1998-02-11 1999-07-20 Радько Лидия Валерьевна Способ технической и художественной разметки поверхности и объема минеральных объектов (варианты)
JP2000005993A (ja) * 1998-06-17 2000-01-11 Hisatake Shudo ダイヤモンドのカット方法及びダイヤモンドのプロポーション
US6604382B2 (en) 2000-11-07 2003-08-12 Naotake Shuto New-cut diamond shape
JP3863374B2 (ja) * 2001-01-22 2006-12-27 尚丈 首藤 ダイヤモンドのカット方法及びプロポーション
US7146827B2 (en) * 2001-05-18 2006-12-12 Diamond Innovations, Llc Mixed cut gemstone
USD467833S1 (en) 2001-08-11 2002-12-31 Joseph Mardkha Mixed cut diamond
WO2003068471A1 (en) * 2002-02-13 2003-08-21 Arvindbhai Lavjibhai Patel Laser machine for examination, planning and marking raw diamond
US20040262274A1 (en) * 2002-02-21 2004-12-30 Patel Arvindbhai L Novel laser diamond sawing machine
US6786733B2 (en) * 2002-10-15 2004-09-07 Overseas Diamonds Inc. Computer-implemented method of and system for teaching an untrained observer to evaluate a gemstone
RU2296662C2 (ru) * 2003-05-30 2007-04-10 Арвиндбхай Лавджибхай ПАТЕЛ Новый лазерный станок для огранки
US7025110B1 (en) * 2003-06-12 2006-04-11 Arthur Suozzi Method and apparatus for setting odd-shaped precious stones
US7000607B2 (en) * 2003-07-11 2006-02-21 Ofer Davidi Gemstone and corresponding method of cutting
WO2005048764A1 (en) * 2003-11-05 2005-06-02 Diamscan N.V. Device and kit for visualising a cutting regime of a diamond, and a method for determining a cutting regime
US20060173738A1 (en) * 2005-02-02 2006-08-03 Dmitry Marmershteyn Method and system of marketing diamonds
IL166977A (en) * 2005-02-17 2014-03-31 Dialit Ltd A computer-guided system and method for producing polished gems
US20070062917A1 (en) * 2005-09-21 2007-03-22 Quantronix Corporation Laser cutting and sawing method and apparatus
CN101462312B (zh) * 2007-12-21 2012-06-20 广州柏志钻石有限公司 钻石加工方法
BE1018664A5 (nl) * 2009-02-20 2011-06-07 Diamscan N V Verbeterde werkwijze en verbeterd product.
US8769987B2 (en) * 2009-12-01 2014-07-08 Dimexon Diamonds Ltd. Gemstone
CN103504734A (zh) * 2012-06-27 2014-01-15 广东钻石世家国际珠宝有限公司 一种内部呈八心八箭的八边形钻石的制作方法
CN104416684B (zh) * 2013-09-02 2018-03-27 深圳市品越珠宝有限公司 一种组合心形钻石切割工艺
US9745669B2 (en) * 2013-09-27 2017-08-29 Ark Crystal, LLC Precision cut high energy crystals
US20150121960A1 (en) * 2013-11-04 2015-05-07 Rofin-Sinar Technologies Inc. Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses
AU2016401402B2 (en) * 2016-07-18 2019-03-14 Sksm Diamonds Impex Limited Process of cutting and assembling diamonds to form composite diamond having enhanced brilliance and shade
BE1024863B1 (nl) * 2016-12-27 2018-07-31 Rose D'anvers Besloten Vennootschap Met Beperkte Aansprakelijkheid Ornament.
WO2021097382A1 (en) * 2019-11-14 2021-05-20 Massachusetts Institute Of Technology Diamond rotors for mas-nmr

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US671830A (en) * 1899-05-02 1901-04-09 Ernest Loesser Diamond-cross-cutting machine.
US671831A (en) * 1900-07-26 1901-04-09 Ernest Loesser Art of working diamonds.
US694215A (en) * 1901-12-05 1902-02-25 Herman A Groen Method of cutting diamonds.
US732118A (en) * 1902-03-27 1903-06-30 Ernest G H Schenck Machine for cutting precious stones.
US732119A (en) * 1902-03-27 1903-06-30 Ernest G H Schenck Method of cutting precious stones.
GB122470A (en) * 1918-01-23 1919-01-23 Jules Groesser Improvements in Apparatus for Cutting or Dividing Diamonds.
US3527198A (en) * 1966-03-26 1970-09-08 Tokyo Shibaura Electric Co Method and apparatus for working diamonds by means of laser light beam
US4392476A (en) * 1980-12-23 1983-07-12 Lazare Kaplan & Sons, Inc. Method and apparatus for placing identifying indicia on the surface of precious stones including diamonds

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648411U (ja) * 1992-12-15 1994-07-05 京セラ株式会社 装飾部材

Also Published As

Publication number Publication date
AU4484189A (en) 1990-06-12
CN1019775B (zh) 1992-12-30
WO1990005624A1 (en) 1990-05-31
IN174710B (forum.php) 1995-02-18
CN1042685A (zh) 1990-06-06
ZA898713B (en) 1990-09-26
IL92313A0 (en) 1990-07-26
US5190024A (en) 1993-03-02
MY106338A (en) 1995-05-30
AU630124B2 (en) 1992-10-22
EP0561770A1 (en) 1993-09-29

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