TW420631B - Working method of cutting and carving and polishing precious stone and its device - Google Patents

Working method of cutting and carving and polishing precious stone and its device Download PDF

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Publication number
TW420631B
TW420631B TW88101528A TW88101528A TW420631B TW 420631 B TW420631 B TW 420631B TW 88101528 A TW88101528 A TW 88101528A TW 88101528 A TW88101528 A TW 88101528A TW 420631 B TW420631 B TW 420631B
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Taiwan
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cutting
grinding
patent application
gemstone
scope
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TW88101528A
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Chinese (zh)
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Jia-Shiung Guo
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Guo Jia Shiung
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Abstract

This invention relates to a working method of cutting and carving and polishing precious stone and its device, and especially relates to a working method of completely and automatically cutting and carving and polishing each facets of crown facet and pavilion facet of precious stone and its device. When a precious stone is to be cut and carved and polished, the stone which is prepared to be proceeded working is first put into a storage tank and waited for a material pickup mechanism with three-directional displacement to be positioned over to the storage tank and by way of vacuum suction to suck and pick up an embryo material of the precious stone. After then the material pickup mechanism is positioned to a cutting and carving and polishing mechanism to proceed to cut and carve and polish crown facets or pavilion facets of the precious stone, and after completion of the process the precious stone is picked up by another set of material pickup mechanism again to proceed to another cutting and carving and polishing to crown facets or pavilion facets of the precious stone. After completion of cutting and carving and polishing process to the precious stone, the carved and polished precious stone is released by the material pickup mechanism and dropped into a collection box for collection.

Description

420631 五、發明說明(1) 本發明係有關 指一種可全面自動 傳統人工切割琢磨 在過去,寶石 之代言品。但是以 裝飾品,因為有了 了真正寶石之價格 顏色的先覺條件外 石切割琢磨之技巧 切割截面所折射之 之條件。 割琢磨 琢磨寶 亦我們 者來說 石已經 人造鑽 價格的 寶石價 線入射 托出寶 加工法及 石之加工 發明動機 是一種有 成為大眾 石的問世 高低除了 格之條件 寶石後, 石之美, 一種寶石切 化加工切割 之加工法, 對一般消費 目前來說寶 人造寶石或 ’不過寶石 ’更能提昇 ’因為在光 光線如何襯 其裝置,尤 法,以解決 〇 錢及有身份 都買得起之 下,而衝擊 本身純度及 ,莫過於寶 寶石上之各 乃是最重要 截d貞石的技巧在於如何有效地將入射光線反射到其 和If為目的。寶石的材質再好,如果截割技術不妥,就無 法戴割出閃亮奪目的寶石。如第2圖所示,鑽石之 ’、 brill iant cut ’是截割鑽石最理想的方法。由冠部cr〇wn 入射的光線經亭部各截面,能有效地反射,發出耀眼的光 亡。這截割法有37至144個截面,後者是在環狀帶也施以 截割的方法。除這種截割法之外,另有截割土耳其石、貓 眼石等半透明寳石的cal3〇ch〇n cut(將平面截面部截成圓 型)’以及截割翡翠的多角型emera Id cut,截成橢圓形的 ova 1 cut 等 〇 而上述之種磕切割琢磨方式皆是以人工切割琢磨,首 先’先將寶石貼黏於治具上,再將治具裝在夾具上,再至 切割機上作切割之動作,而在每切割一個截面,該夾具便420631 V. Description of the invention (1) The present invention refers to a type of gemstone that can be fully automated and traditional manual cutting and polishing in the past. But for the decoration, because of the real condition of the price of the color of the real gem, the condition of the refractions of the cutting section and the technique of the stone cutting and refining. For us, for us, for the gemstone, the price of the gemstone has reached the price of artificial diamond. The method of invention and the processing of the stone are motivated by the invention of a gemstone that has a high and low level of popularity. Gem cutting and cutting processing method, for general consumption, at present, artificial gemstones or 'but gems' can be improved' because of how light and light line their devices, especially law, in order to solve 0 money and have status can afford it However, the purity of the impact itself is nothing more than that of the baby stone. The most important technique for cutting zhenzhen lies in how to effectively reflect the incident light to it and If. No matter how good the material of the gem is, if the cutting technique is not proper, you can't wear it to cut and shine. As shown in Figure 2, diamond 'and brill iant cut are the most ideal methods for cutting diamonds. The light incident from the crown cr0wn can be effectively reflected through the various sections of the pavilion, emitting a dazzling light. This cutting method has 37 to 144 sections, the latter is a method in which cutting is also performed on the endless belt. In addition to this cutting method, there is also a cal300 cut (cutting the plane cross section into a circular shape) of translucent gemstones such as turquoise and opal, and a polygonal emera Id cut that cuts jadeite. Ova 1 cut, etc. cut into an oval shape, and the above-mentioned 磕 cutting and grinding methods are manual cutting and grinding, first 'stick the gem to the jig, then install the jig on the fixture, and then cut The cutting action is performed on the machine, and each time a section is cut, the fixture will

第4頁 五、發明說明(2) 要轉向一個角度,以待切割下一個截面,又待切割完成 後’再將切割完成之寶石至琢磨機上磨光重覆無數次,如 此一來,以人工切割琢磨方式’在切割琢磨過程中,一次 只能對一個寶石加工,因此在製作珠寶製品時,其上之寶 石過多時,必需花費極長的一段時間來製作,相對製作成 本也提高;爰是, 本發明之主要目的,在於解決上述之缺失,避免缺失 存在’本發明利用一可全面自動化切割琢磨寶石之加工法 及裝置,以降低切割琢磨成本,提高生產量,同時也可降 低戒指及項鍊之製作成本。 本發明之另一Haa . 多細糾穿^ Λ 曰的’在於該切割琢磨裝置内部可增設 夕,,且對寳石加工之撫接 , 本發明之再-目的,,以便於大量生產之用。 更不同角度,可讓蜜在於没有微電腦可程式控制系統可變 琢磨。 寶石作不同型狀之冠部及亭部截面切割 本發明之又一日 了可讓取料頭之吸盤:古在•器上$置有真空吸附裝置β 琢磨時也不會讓寶石、有吸取寶石胚料之吸力外,在切翁 ^ f石胚料鬆脫。 為達上述之目的,主西β 7 料儲放於儲料斗,待文疋先將待加工切割琢磨寶石乐 取料機構至儲料斗上,了向(軸)位移之機械手臂所構成4 空吸附方式,吸取曹4亚由外部真空吸附裝置所產生之I 磨機構上進行寶石々f料後,該取料機構·位移至切割驾 成寶石冠部或亭部之亭部截面之切割琢磨’待前述突 各截面之切割琢磨後,再交附由另- 42〇β3 五、發明說明(3) 組取料機構上位移至切割琢磨機構上進行寶 ^ 冠部或辜都 截面之切割琢磨;又待完成寶石冠部或亭邹戴面 磨後’取料機構即放掉切割琢磨之寶石,而 =刀割琢 落入於收集箱内收集。 几成品便 係有關本發明之詳細說明及技術内容,j目 明如下: 見配合圖式說 第1圖’係本發明之寶石切割琢磨裝置内 圖。 1 4配置示意 第2圖,係為一般寶石外觀示意圖。 第3圖,係本發明之取料機構取料之動作,_ 第4 — 1圖,係本發明之取料機構位移=意圏。 構上加工示意圖。 '多至切割琢磨機 移動作側 不圖 第4 — 2圖,係本發明之切割琢磨截面之位 示圖 第4 — 3圖,係本發明之切割琢磨截面 位移動 作側 第5圖,係本發明之二取料機構交換加 圖 工之動作示意 第6圖,係本發明之寶石加工完成取粗地祖挪 χ取料機構釋放寶石 示意圖。 請參閱「第1圖所示」,係本發明之贫 _ <貝石切割琢磨裝 置内部配置示意圖。如圖所示··本發明眘r i β負石切割琢磨加工 法及其裝置,尤指一種可全面自動對寶石推,-^ 貞石進仃切割琢磨之 寶石切割琢磨裝置,該裝置包括:Page 4 V. Description of the invention (2) Turn to an angle to cut the next section, and after the cutting is completed, 'the cut gem is polished on the grinder many times, so as to "Manual cutting and polishing method" In the cutting and polishing process, only one gemstone can be processed at a time. Therefore, when there are too many precious stones on the jewelry product, it must take a very long time to make, and the relative production cost is also increased; 爰Yes, the main purpose of the present invention is to solve the above-mentioned deficiencies and to avoid the existence of the deficiencies. Cost of making a necklace. Another Haa of the present invention is how fine-grained ^ Λ is to say that the inside of the cutting and grinding device can be added, and the processing of gemstones is a re-purpose of the present invention for mass production. More different angles, can make honey lies in the variable control without a microcomputer programmable control system. Gemstones are cut in different shapes of the crown and pavilion. Another day of the present invention, the suction cup of the take-up head can be used: ancient vacuum device is equipped with a vacuum adsorption device. In addition to the suction power of the gem material, the stone material is loosened at Chevon ^ f. In order to achieve the above purpose, the main West β 7 material is stored in the storage hopper. To be processed, the material to be processed, cut, polished, and gemstone will be taken to the storage hopper. Method, after picking up the gemstone material on the I grinding mechanism produced by the external vacuum adsorption device of Cao 4ya, the reclaiming mechanism is moved to the cutting section of the pavilion section of the gem crown or pavilion. After cutting and cutting each section of the aforementioned protrusion, attach it to another-42〇β3. V. Description of the invention (3) Displacement of the reclaiming mechanism on the group to the cutting and cutting mechanism for cutting and cutting of the crown or gudu section; and After finishing the crown of the gemstone or the surface of the pavilion, the 'reclaiming mechanism will release the cut and polished gemstones, and the knife cuts and falls into the collection box for collection. The finished products are detailed descriptions and technical contents of the present invention, and the j-item is as follows: See the accompanying drawings. Figure 1 'is the internal view of the gemstone cutting and grinding device of the present invention. 1 4 Configuration diagram Figure 2 is a schematic diagram of the appearance of a general gem. Fig. 3 is the operation of the reclaiming mechanism of the present invention. Fig. 4-1 is the displacement of the reclaiming mechanism of the present invention. Schematic processing diagram. 'As many as the cutting and grinding machine moving side is not shown in Figures 4-2, which is the position of the cutting and grinding section of the present invention is shown in Figures 4-3, which is the fifth side of the cutting action of the cutting and grinding section of the present invention. The second operation of the invention of the picking mechanism is shown in Figure 6, which is a schematic diagram of the gemstone processing of the present invention when the rough processing is completed. Please refer to "shown in Fig. 1", which is a schematic diagram of the internal configuration of the < Baystone cutting and grinding device of the present invention. As shown in the figure, the present invention is a method for cutting and grinding a negative β i negative stone, especially a gemstone cutting and grinding device that can fully and automatically push a gemstone.-^ This device includes:

420631 五、發明說明(4) 一儲存 1放入待加 0便在導槽 一取料 執道2 1、 3上之取料 道 2 1、2 為但不限於 傳動方式。 1 ,該吸盤 吸附機(圖 2 4 1得以 又,該取料 盤2 4 1轉 割琢磨。前 寶石胚料1 走,以保持 一切割1 ' 3 2 所 2之表面上 之二滾筒磨 驅動後,可 琢磨之加工 一收集 待加 工切 上排 機構 2 2 頭2 2 > 齒條 另,2 4 中未 真空 頭2 向之 述之 0外 加工 琢磨 組成 具有 輪、 對取 切割 箱4 工寶石 割琢磨 列於儲 2,係'23 4所構 2 3内 傳動方 前述之 1上連 示)使 吸附方 4上具 角度, 真空吸 ,還可 裝置内 機構3 ’該二 一切割 平面磨 料機構 琢磨之 ,係配 胚料1 0 之寶石胚 料斗1之 具有X軸 及分度轉 成之機械 所配置之 式,導螺 取料頭2 接一吸器 該吸氣管 式吸取待 有一調整 以便寶石 氣管2 4 將寶石胚 部之清潔 ,係由二 滾筒磨輪 面3 1 1 盤3 1、 3送來之 工序。 置於裝置 之儲料斗1 料1 0後, 出口處1 1 • Y輪、Z抽j 軸,以及配 手臂,前述 傳動機構( 桿傳動方式 4上配置有管 2 4 2, 2 4 2產生 加工之寶石機構2 4 3 胚料1 0進 2除了讓吸 料1 0切割 ,在該儲料斗 該寶石胚料1 κ轴)位移 置於該Z轴2 之三向位移執 圖中未示)係 或齒輪,皮帶 4 藉以外部真空 吸力,使吸盤 胚料1 〇 ; ,藉以調整吸 行各截面之切 盤2 4 1吸住 豕磨之粉屑吸 滾筒磨輪、平面磨盤3 (或平面磨盤)、3 J-琢磨面3 1 2,前述 3 2受馬it (圖中未示) 寶石胚料1 之底部、與該装置之420631 V. Description of the invention (4) As soon as it is stored, it will be put into the guide slot when it is to be added. 1, the suction cup adsorption machine (Figure 2 4 1 can be turned again, the reclaiming plate 2 4 1 is cut and polished. The former gem blank 1 is walked to keep one of the rollers driven on the surface of the cutting 1 '3 2 After that, the grinding process can be collected to collect the cutting upper row mechanism 2 2 head 2 2 > rack, in addition, the vacuum head 2 in 2 4 to the outside of the 0 processing and polishing composition has wheels, counter cutting box 4 workers The gem cutting and polishing are listed in the storage 2, which is shown in the above 2 of the internal transmission side of the 23'4. The angle of the suction side 4 can be vacuumed, and the internal mechanism 3 'can be installed. The mechanism is considered by the mechanism of the gemstone hopper 1 equipped with the blank material 10, which has an X-axis and an indexing mechanism. The lead screw picking head 2 is connected to an aspirator. The suction tube type suction is to be adjusted so that Jewel trachea 2 4 The process of cleaning the jewel embryo is sent from the two-roller grinding wheel surface 3 1 1 plate 3 1 and 3. Placed in the storage hopper of the device 1 after the material 10, the exit 1 1 • Y-wheel, Z-pump j-axis, and equipped with the arm, the aforementioned transmission mechanism (the rod transmission method 4 is equipped with tubes 2 4 2, 2 4 2 production processing Gemstone mechanism 2 4 3 Ingot material 1 0 Into 2 In addition to letting suction material 10 cut, in the storage hopper the gem material material 1 κ axis) is placed in the three-dimensional displacement of the Z axis 2 (not shown in the illustration) Or gear, belt 4 uses external vacuum suction to make the suction cup blank 1 〇; to adjust the cutting discs of various sections 2 4 1 suction honing powder suction roller grinding wheel, surface grinding disc 3 (or surface grinding disc), 3 J--wrought surface 3 1 2, the aforementioned 3 2 is the horse it (it is not shown in the figure) the bottom of the gem blank 1 and the device

第7頁 4 2 0 6 3 五、發明說明(5) ,一承接加工完成寶石胚料1 〇完成品之承盤4 1,在取 =碩2 4釋放加工完成之寶石胚料1 〇後,寶石胚料丄〇 4成品掉落於承盤4 1上’而自動落入於收集箱4令。 藉上述之各部機構在外部控制箱(圖中未示)的控制下, 可控制該加工裝置對寳石胚料1 〇作自動加工切割琢磨之 加工動作。 請參閱「第2 4—1 、4 ~ 2 4 圖所 不j ,如圖所示:在說明本發明之加工法時,先闡述目前 —般寶石1 〇在經過切割琢磨後,形成具有一冠部 (Crown) 5、環狀帶(girdle) 6 及亭部(pavi 1 ion) 7,該 冠部5包括有一上斜帶狀截面(Upper-gircjie facet)5 1、斜截面(bezel facet) 5 2、星裁面(star facet) 5 3、平面截面(table facet)5 4 ,而亭部7包括有一下 帶狀載面(lower-girdle facet)7 1 、下截截面 (pavi1 ion facet) 7 2、刮尖(culet) 7 3。 而對寶石進行上述各截面切割琢磨時,先以取料機構 2党外部控制箱(圖中未示)控制時,取料機構2之γ軸 22於X軸21上前進,而z轴23由Y軸22上升,同 時’該取料頭2 4也於該Z軸2 3上作橫向位移,帶z轴2 3位移至儲料斗1上,外部之真空吸附機使該吸氣管2 $ 2產生吸附力時,该取料頭2 4上之吸盤2 4 1便將下寶 石胚料1 0取下,待該寶石胚料1 〇取下後,該Z軸2 3 順Y軸2 2下降至與切割琢磨機構3同一水平面時,該γ細 2 2於X轴2 1即形成進刀推進位移,在γ軸進刀推進切巧Page 7 4 2 0 6 3 V. Description of the invention (5): After accepting the processing of the finished gem material 10, the finished product plate 41, after taking == 24, releasing the processed gem material 10, The finished gemstone material 〇04 is dropped on the support plate 41, and automatically falls into the collection box 4 orders. Under the control of an external control box (not shown in the figure), the above-mentioned various mechanisms can be used to control the processing device to automatically process the cutting operation of the gem blank 10. Please refer to "Figures 2-4 and 4 ~ 2 4 as shown in the figure, as shown in the figure: when explaining the processing method of the present invention, first explain the current-general gemstone 1 〇 After cutting and forming, it has a crown Crown 5, girdle 6 and pavilion 7, the crown 5 includes an upper-gircjie facet 5 1. bezel facet 5 2. Star facet 5 3. Table facet 5 4, and the pavilion 7 includes a lower-girdle facet 7 1, pavi1 ion facet 7 2. Squeeze tip (culet) 7 3. When the gemstone is cut and polished in the above sections, firstly, it is controlled by the external control box (not shown) of the party 2 of the picking mechanism, and the gamma axis 22 of the picking mechanism 2 is at X The axis 21 advances, and the z-axis 23 rises from the Y-axis 22. At the same time, the 'feeding head 24' also moves laterally on the Z-axis 23, with the z-axis 23 moving to the storage hopper 1, and the external vacuum When the adsorption machine makes the suction tube 2 $ 2 produce an adsorption force, the sucker 2 4 1 on the material taking head 24 removes the lower gem blank 10, and after the gem blank 10 is removed, the Z axis 2 3 When the y-axis 2 2 descends to the same level as the cutting and grinding mechanism 3, the γ fine 2 2 forms an advance advancing displacement on the X axis 2 1, and the infeed advances in the γ-axis.

第8頁 Μ 42〇β3 五、發明說明⑹ 琢磨同一時間 )位移,而取 ,2 4即在切 可定成冠部5 待,上述 2 4上之調整 遑取料機構2 狀戴面5 1 、 又待,寶石胚 星戴面5 3、 適當位置時, 2 3上升後, 2 —也隨之前 1 0便交換至 亭部7之加工 述之取料機構 再待,取 另一取料機構 取待加工之寳 割琢磨後,同 取料機構2 一 石胚料1 0即 進一步, 1、取料機構 裡’該Ζ軸2 3於y軸2 2上作上升(或下降 料頭2 4則於Z軸2 3作橫向位移,使取料 割琢磨機構3形成一斜對角之行程位移,即 之平面截面54加工; 之平面截面5 4切割琢磨完成後,該取料頭 機構2 4 3依序轉向不同角度後,再依循上 加工工序,即可對寶石胚料1 〇進行上斜帶 斜截面5 2、星截面5 3等之切割琢磨; 料1 0之上斜帶狀截面5 1 、斜截面52、 平面載面5 4加工後,該γ軸2 2先退後至 在同一時間裡’ Z軸2 3再度上升,在該Z軸 該Y軸2 2前進’同時,另一組取料機構 進’該取料頭2 4上加工至一半之寶石胚料 令一取料機構2 -上,進行寶石胚料1 〇之 ’且該取料機構2 /在加工之位移動作與前 2之加工位移動作相同。 料機構2將加工至一半之寶石胚料1〇交至 2後’該取料機構2又位移至儲料斗1上 胚料1 〇 D而在上述寶石胚料1〇加工切 時該寶石1 0上之環狀帶6也-併完成,該 ί寶石胚料1 0之吸附解除’該加工後之寶 洛入於收集箱4令。 f於該切割琢磨裝置内部所配置之儲料斗 切割琢磨機構3 ,可多組增設,可同時Page 8 Μ 42〇 β3 V. Description of the invention ⑹ Calculate the same time) displacement, and take, 2 4 will be cut into the crown 5 to wait, the adjustment on the above 2 4 遑 feeding mechanism 2 shape wearing surface 5 1 , And wait, the gemstone star wears the face 5 3. When it is in position, 2 3 rises, 2 — also exchanges to the reclaiming mechanism described in the processing of the pavilion 7 as before 10, and then waits for another reclaiming mechanism After taking the treasure to be processed, it is the same as the reclaiming mechanism 2-the stone blank 10 is further. 1. In the reclaiming mechanism, the "Z axis 2 3" is raised on the y axis 2 2 (or the material head 2 4 is lowered). Make a lateral displacement on the Z axis 2 3 to make the cutting and cutting mechanism 3 take an oblique diagonal stroke displacement, that is, the plane section 54 processing; the plane section 5 4 After the cutting and milling is completed, the extraction head mechanism 2 4 3 After turning to different angles in sequence, and then following the upper processing procedure, the gem blank 10 can be cut and polished with an oblique cross-section 5 2, a star cross-section 5 3, etc .; an oblique cross-section 5 1 above the material 10 , Oblique section 52, plane load surface 5 4 After processing, the γ axis 2 2 first retracts to the same time 'Z axis 2 3 rises again, at this Z The Y axis 2 2 advances, and at the same time, another set of reclaiming mechanism advances into 'the reclaiming head 24 is processed to half of the gem blanks, and a reclaiming mechanism 2-is up, and the gem blanks 10 are processed' and the Retrieving mechanism 2 / The displacement action during processing is the same as the first two. The material mechanism 2 transfers half of the gem blank 10 processed to 2 and the 'removing mechanism 2 moves to the upper hopper of the storage hopper 1 again. Material 10D, and when the above-mentioned gem blank 10 is processed and cut, the endless belt 6 on the gemstone 10 is also completed, and the adsorption of the tiling gem blank 10 is released. Box of 4 reams. F Storage hopper cutting and grinding mechanism 3 configured inside the cutting and grinding device, which can be added in multiple groups and can be simultaneously

420631 五、發明說明(7) 作同步控制,以達大量生產之目的。 惟以上所述者,僅為本發明之一較佳實施例而已,並 非用來限定本發明實施之範圍 即凡依本發明申請專利範 圍所做的均等變化與修飾,皆為本發明專利範圍所涵蓋。 【圖式之標號說明】 儲料斗..............1 出口處.............11 Χ、Υ、Ζ|ά.....21、22、23 取料機構..........2、2 一 取料頭.............·2 4 調整機構...........243 2 4 1 2 4 2 • · 3 、3 2 3 11 3 12 • · 4 • 4 1 *10 吸盤....... 吸氣管...... 切割琢磨機構·· · 滾筒磨輪或平面磨盤 切割面...... 琢磨面...... 收集箱...... 承盤··..... 寶石....... 冠部...............5 環狀帶..............6 亭部(或下截面).........7 上斜帶狀截面..........51420631 V. Description of the invention (7) Synchronous control to achieve the purpose of mass production. However, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, all equivalent changes and modifications made in accordance with the scope of patent application for the present invention are within the scope of the present invention patent. Covered. [Explanation of Labels in the Drawings] Storage Hopper .............. 1 Exit ............. 11 Χ 、 Χ 、 Z | ά ... .. 21, 22, 23 Reclaiming mechanism ......... 2, 2 Retracting head ......... 2 4 Adjustment mechanism ... ... 243 2 4 1 2 4 2 • · 3, 3 2 3 11 3 12 • · 4 • 4 1 * 10 Suction cup ... Suction tube ... Mechanism ... Cutting surface of the roller grinding wheel or flat grinding disc ... Surface ... Collecting box ... Shell ......... Crown ............... 5 Endless belt .............. 6 Pavilion (or lower section) ....... ..7 Upslope ribbon section ......... 51

第10頁 420631 五 '發明說明(8) 斜截面._ . · 星截面...· 平面截面.* * 下帶狀截面· _ 下截載面·· · 刮尖..... 2 3 4 1 2 3 5 5 5 7 7 7Page 10 420631 Five 'invention description (8) Oblique section _. · Star section ... · Plane section. * * Lower strip section · _ Lower section surface · · · Scraping tip ... 2 3 4 1 2 3 5 5 5 7 7 7

Claims (1)

W0631W0631 六、申請專利範圍 a).先琢磨加工法’其加工法步驟包括: =將未加琢磨之寶石胚料儲玫於儲料斗; 石立移之取料機構’位移至儲料斗上取下寶 切割琢磨;w割琢磨機構上進行寶石冠部或亭部截面之 C)待上述(b)步驟完成寶石冠部戋真部截面之各截 面之切割琢磨後,再交 丨次T邛戴面之各戴 琢磨機構上進行寶石3邱4龙,'且取料機構,位移至切割 d) ·又in 或亭部截面之切割琢磨;及’ 磨後即id 寶石冠部或亭部截面之切割琢 2 ;:==之寶石,@落入於收集箱内收集 法利範圍第1項所述之寶石切割琢磨加工 法,其中,該取料機構係為三貝力I 手臂及分度旋轉軸。 .YZ軸)位移之機械 3、 如申請專利範圍第2頊~ 法,其中,該機械手臂係以之寶石切割琢磨加工 之寶石。 具二吸附之方式取下儲料斗中 4、 如申請專利範圍第2 法,其中’該機械手臂係受外 击]之寶石切琢磨加工 行程及轉角度之方式,進行寶°卩控制,以直向或斜向位移 5、 如申請專利範圍第冠部或亭部之切割琢磨。 法,其中’該切割琢磨機構係滾口 ^寶石切:琢磨加工 對寶石同時進行切割及琢磨之工^磨輪或平面磨盤方式, 6、 如申請專利範圍第丄 法’其令’該滾筒磨輪或平】;2石切:琢磨加工 您i ir、具有一切割面及—琢6. The scope of the patent application a). The first processing method includes the steps of: = storing the unpolished gem blanks in a storage hopper; the material removal mechanism of the stone mover is moved to the storage hopper to remove the treasure cutting Grinding; w cut the grinding mechanism on the crown or pavilion cross section C) after the completion of step (b) of the gem crown 戋 true section of the cross-section cutting and grinding, and then 丨 T 邛 wearing surface each The gemstones are worn on the wear-sharpening mechanism. 3 Qiu 4 dragons, and the material removal mechanism is shifted to cutting d) · In or the cut and cut of the cross section of the pavilion; and 'After grinding, the cut of the crown or pavilion of the id 2 ;: == a gemstone, @falling into the collection box, the gemstone cutting and grinding processing method described in item 1 above, wherein the reclaiming mechanism is a three-beam I arm and an indexing rotation axis. .YZ axis) Displacement machinery 3. For example, the patent application scope No. 2 ~~ method, in which the robot arm is used for gem cutting and grinding. Take off the storage hopper with two adsorption methods. 4. If the second method of the patent application is applied, in which the “the robot arm is subject to external strikes”, the gem cutting process and the rotation angle of the gemstones are controlled by Po ° 直Displacement to the oblique or oblique direction 5, such as cutting and polishing of the crown or pavilion in the scope of patent application. Method, where 'the cutting and grinding mechanism is a roll ^ gemstone cutting: the method of cutting and grinding the gemstone at the same time ^ grinding wheel or surface grinding disc method; 6, such as the method of the scope of patent application' its order 'the roller grinding wheel or Ping]; 2 stone cut: cut your i ir, have a cutting surface and-cut 第12頁 42063)(Page 12 42063) 7、一種寶石切割琢磨裝置,包括: 至少一組儲放加工前未切割琢磨寶石胚料之 至少一組以上之切割琢磨機構; -〆斗; 至少二組以上可位移至儲料上取料,並位 磨機構加工之取料機構。 刀割琢 六、申請專利範圍 磨面。 番,L如中請專利範圍第7項所述之f石切割琢磨F 置,^中,該切割琢磨機構係具有二部分別可對 二 或亭部戴面加工切割琢磨之滾筒磨輪或平面磨盤。冠# 9、如申請專利範圍第7或8項所述之寶石切 裝置,其中,該切割琢磨機構之滾筒磨輪或平面磨盤 有一切割面及一琢磨面。 现’、 1 0、如申請專利範圍第7項所述之寶石切割琢磨 置’其中’該取料機構係由X、γ、Z軸三向以上位 所構成之機械手臂。 ^ 1 1、如申請專利範圍第1 0項所述之寶石切割琢磨 裝置’其中’該取料機構之三向以上位移軌道内配置之傳 動機構係為但不限於齒條傳動方式,導螺桿傳動方. 輪,皮帶傳動方式。 ~ 1 2、如申凊專利範圍第7 ' 1 0或1 1項所述之寶 石切割琢磨裝置’其中,該取料機構之Z軸上配置有一取 料頭。 1 3 、如申请專利範圍第1 2項所述之寶石切割琢磨 裝置’其中’該取料頭上配置有一吸盤,該吸盤上連接一7. A gem cutting and grinding device, comprising: at least one cutting and grinding mechanism for at least one group of uncut gem stones before storage and processing;-bucket; at least two or more groups can be moved to the storage material for reclaiming, Reclaiming mechanism for parallel grinding mechanism processing. Knife cutting 6. Scope of patent application Grinding surface. Fan, L is as described in item 7 of the patent scope of the stone cutting and grinding F set, ^, the cutting and grinding mechanism has two roller grinding wheels or plane grinding discs that can face the cutting or grinding of the two or pavilion, respectively . Crown # 9. The gemstone cutting device according to item 7 or 8 of the patent application scope, wherein the roller grinding wheel or the flat grinding disc of the cutting and grinding mechanism has a cutting surface and a grinding surface. Now, '10, the gem cutting and cutting device as described in item 7 of the scope of patent application ', wherein' the picking mechanism is a robot arm composed of three directions of X, γ, and Z axes. ^ 1 1. According to the gemstone cutting and grinding device described in item 10 of the scope of the patent application, where the transmission mechanism in the three-way or more displacement track of the picking mechanism is, but not limited to, a rack drive mode, a lead screw drive Square. Wheel, belt drive. ~ 1 2. According to the 7'10 or 11 item in the scope of the patent application for Shenbao, the gemstone cutting and grinding device 'is provided with a picking head on the Z axis of the picking mechanism. 1 3, The gem cutting and grinding device described in item 12 of the scope of patent application, wherein the suction head is provided with a suction cup, and the suction cup is connected with a suction cup. 42063' 六、申請專利範園 吸器管,藉以吸氣管產生吸力,使吸盤得以真空吸附方式 吸取待加工之寶石胚料。 1 4、如申請專利範圍第1 2項所述之寶石切割琢磨 裝置,其中,該取料頭上具有一調整機構,藉以調整吸盤 轉向之角度,以便寶石進行各截面之切割琢磨。 1 5 、如申請專利範圍第1 2項所述之寶石切割琢磨 裝置,其中,該切割琢磨裝置内配置有一收集切割琢磨完 成寶石品收集箱。42063 'VI. Patent application Fanyuan Suction tube, by which the suction pipe generates suction, so that the suction cup can vacuum-suck the gem blank to be processed. 14. The gemstone cutting and grinding device as described in Item 12 of the scope of patent application, wherein the picking head has an adjustment mechanism to adjust the angle of rotation of the suction cup, so that the gemstone can be cut and ground in various sections. 15. The gemstone cutting and grinding device according to item 12 of the scope of patent application, wherein the cutting and grinding device is provided with a gemstone collection box for collecting, cutting and grinding. 第14頁Page 14
TW88101528A 1999-02-02 1999-02-02 Working method of cutting and carving and polishing precious stone and its device TW420631B (en)

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