JPH04501685A - ダイヤモンド切断方法 - Google Patents
ダイヤモンド切断方法Info
- Publication number
- JPH04501685A JPH04501685A JP1511199A JP51119989A JPH04501685A JP H04501685 A JPH04501685 A JP H04501685A JP 1511199 A JP1511199 A JP 1511199A JP 51119989 A JP51119989 A JP 51119989A JP H04501685 A JPH04501685 A JP H04501685A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- cut
- cutting
- vertices
- cutting method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C17/00—Gems or the like
- A44C17/001—Faceting gems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Adornments (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LK9954 | 1988-11-16 | ||
LK995488 | 1988-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04501685A true JPH04501685A (ja) | 1992-03-26 |
Family
ID=19720957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1511199A Pending JPH04501685A (ja) | 1988-11-16 | 1989-11-14 | ダイヤモンド切断方法 |
Country Status (10)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0648411U (ja) * | 1992-12-15 | 1994-07-05 | 京セラ株式会社 | 装飾部材 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10501441A (ja) * | 1995-01-27 | 1998-02-10 | ロジャース,ジェラルド,ヴイ. | 球状部のある宝石はめ込み装置 |
US5932119A (en) | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
RU2133195C1 (ru) * | 1998-02-11 | 1999-07-20 | Радько Лидия Валерьевна | Способ технической и художественной разметки поверхности и объема минеральных объектов (варианты) |
JP2000005993A (ja) * | 1998-06-17 | 2000-01-11 | Hisatake Shudo | ダイヤモンドのカット方法及びダイヤモンドのプロポーション |
US6604382B2 (en) | 2000-11-07 | 2003-08-12 | Naotake Shuto | New-cut diamond shape |
JP3863374B2 (ja) * | 2001-01-22 | 2006-12-27 | 尚丈 首藤 | ダイヤモンドのカット方法及びプロポーション |
US7146827B2 (en) * | 2001-05-18 | 2006-12-12 | Diamond Innovations, Llc | Mixed cut gemstone |
USD467833S1 (en) | 2001-08-11 | 2002-12-31 | Joseph Mardkha | Mixed cut diamond |
WO2003068471A1 (en) * | 2002-02-13 | 2003-08-21 | Arvindbhai Lavjibhai Patel | Laser machine for examination, planning and marking raw diamond |
US20040262274A1 (en) * | 2002-02-21 | 2004-12-30 | Patel Arvindbhai L | Novel laser diamond sawing machine |
US6786733B2 (en) * | 2002-10-15 | 2004-09-07 | Overseas Diamonds Inc. | Computer-implemented method of and system for teaching an untrained observer to evaluate a gemstone |
RU2296662C2 (ru) * | 2003-05-30 | 2007-04-10 | Арвиндбхай Лавджибхай ПАТЕЛ | Новый лазерный станок для огранки |
US7025110B1 (en) * | 2003-06-12 | 2006-04-11 | Arthur Suozzi | Method and apparatus for setting odd-shaped precious stones |
US7000607B2 (en) * | 2003-07-11 | 2006-02-21 | Ofer Davidi | Gemstone and corresponding method of cutting |
WO2005048764A1 (en) * | 2003-11-05 | 2005-06-02 | Diamscan N.V. | Device and kit for visualising a cutting regime of a diamond, and a method for determining a cutting regime |
US20060173738A1 (en) * | 2005-02-02 | 2006-08-03 | Dmitry Marmershteyn | Method and system of marketing diamonds |
IL166977A (en) * | 2005-02-17 | 2014-03-31 | Dialit Ltd | A computer-guided system and method for producing polished gems |
US20070062917A1 (en) * | 2005-09-21 | 2007-03-22 | Quantronix Corporation | Laser cutting and sawing method and apparatus |
CN101462312B (zh) * | 2007-12-21 | 2012-06-20 | 广州柏志钻石有限公司 | 钻石加工方法 |
BE1018664A5 (nl) * | 2009-02-20 | 2011-06-07 | Diamscan N V | Verbeterde werkwijze en verbeterd product. |
US8769987B2 (en) * | 2009-12-01 | 2014-07-08 | Dimexon Diamonds Ltd. | Gemstone |
CN103504734A (zh) * | 2012-06-27 | 2014-01-15 | 广东钻石世家国际珠宝有限公司 | 一种内部呈八心八箭的八边形钻石的制作方法 |
CN104416684B (zh) * | 2013-09-02 | 2018-03-27 | 深圳市品越珠宝有限公司 | 一种组合心形钻石切割工艺 |
US9745669B2 (en) * | 2013-09-27 | 2017-08-29 | Ark Crystal, LLC | Precision cut high energy crystals |
US20150121960A1 (en) * | 2013-11-04 | 2015-05-07 | Rofin-Sinar Technologies Inc. | Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses |
AU2016401402B2 (en) * | 2016-07-18 | 2019-03-14 | Sksm Diamonds Impex Limited | Process of cutting and assembling diamonds to form composite diamond having enhanced brilliance and shade |
BE1024863B1 (nl) * | 2016-12-27 | 2018-07-31 | Rose D'anvers Besloten Vennootschap Met Beperkte Aansprakelijkheid | Ornament. |
WO2021097382A1 (en) * | 2019-11-14 | 2021-05-20 | Massachusetts Institute Of Technology | Diamond rotors for mas-nmr |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US671830A (en) * | 1899-05-02 | 1901-04-09 | Ernest Loesser | Diamond-cross-cutting machine. |
US671831A (en) * | 1900-07-26 | 1901-04-09 | Ernest Loesser | Art of working diamonds. |
US694215A (en) * | 1901-12-05 | 1902-02-25 | Herman A Groen | Method of cutting diamonds. |
US732118A (en) * | 1902-03-27 | 1903-06-30 | Ernest G H Schenck | Machine for cutting precious stones. |
US732119A (en) * | 1902-03-27 | 1903-06-30 | Ernest G H Schenck | Method of cutting precious stones. |
GB122470A (en) * | 1918-01-23 | 1919-01-23 | Jules Groesser | Improvements in Apparatus for Cutting or Dividing Diamonds. |
US3527198A (en) * | 1966-03-26 | 1970-09-08 | Tokyo Shibaura Electric Co | Method and apparatus for working diamonds by means of laser light beam |
US4392476A (en) * | 1980-12-23 | 1983-07-12 | Lazare Kaplan & Sons, Inc. | Method and apparatus for placing identifying indicia on the surface of precious stones including diamonds |
-
1989
- 1989-11-14 WO PCT/LK1989/000002 patent/WO1990005624A1/en not_active Application Discontinuation
- 1989-11-14 US US07/689,793 patent/US5190024A/en not_active Expired - Fee Related
- 1989-11-14 JP JP1511199A patent/JPH04501685A/ja active Pending
- 1989-11-14 AU AU44841/89A patent/AU630124B2/en not_active Ceased
- 1989-11-14 EP EP89912013A patent/EP0561770A1/en not_active Ceased
- 1989-11-15 IL IL92313A patent/IL92313A0/xx unknown
- 1989-11-15 ZA ZA898713A patent/ZA898713B/xx unknown
- 1989-11-15 CN CN89108659A patent/CN1019775B/zh not_active Expired
- 1989-11-15 IN IN1055DE1989 patent/IN174710B/en unknown
- 1989-11-16 MY MYPI89001600A patent/MY106338A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0648411U (ja) * | 1992-12-15 | 1994-07-05 | 京セラ株式会社 | 装飾部材 |
Also Published As
Publication number | Publication date |
---|---|
AU4484189A (en) | 1990-06-12 |
CN1019775B (zh) | 1992-12-30 |
WO1990005624A1 (en) | 1990-05-31 |
IN174710B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1995-02-18 |
CN1042685A (zh) | 1990-06-06 |
ZA898713B (en) | 1990-09-26 |
IL92313A0 (en) | 1990-07-26 |
US5190024A (en) | 1993-03-02 |
MY106338A (en) | 1995-05-30 |
AU630124B2 (en) | 1992-10-22 |
EP0561770A1 (en) | 1993-09-29 |
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