JPH0447983Y2 - - Google Patents
Info
- Publication number
- JPH0447983Y2 JPH0447983Y2 JP1986170419U JP17041986U JPH0447983Y2 JP H0447983 Y2 JPH0447983 Y2 JP H0447983Y2 JP 1986170419 U JP1986170419 U JP 1986170419U JP 17041986 U JP17041986 U JP 17041986U JP H0447983 Y2 JPH0447983 Y2 JP H0447983Y2
- Authority
- JP
- Japan
- Prior art keywords
- fiber
- semiconductor substrate
- fiber holder
- laser diode
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986170419U JPH0447983Y2 (enExample) | 1986-11-06 | 1986-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986170419U JPH0447983Y2 (enExample) | 1986-11-06 | 1986-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6375063U JPS6375063U (enExample) | 1988-05-19 |
| JPH0447983Y2 true JPH0447983Y2 (enExample) | 1992-11-12 |
Family
ID=31105133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986170419U Expired JPH0447983Y2 (enExample) | 1986-11-06 | 1986-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447983Y2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0860720A4 (en) | 1995-10-27 | 2000-11-02 | Hoya Corp | OPTICAL FIBER FIXING MEMBER AND MANUFACTURING METHOD |
| JP5847473B2 (ja) * | 2011-07-21 | 2016-01-20 | シチズンホールディングス株式会社 | 光モジュール |
-
1986
- 1986-11-06 JP JP1986170419U patent/JPH0447983Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6375063U (enExample) | 1988-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6491447B2 (en) | Optical device module | |
| EP0664585B1 (de) | Sende- und Empfangsmodul für eine bidirektionale optische Nachrichten- und Signalübertragung | |
| US5909523A (en) | Optical module and method of fabricating optical module | |
| US20050062117A1 (en) | Optical receiver package | |
| JP2645862B2 (ja) | 半導体発光装置およびその応用製品 | |
| JP2000206376A (ja) | 受発光素子モジュ―ルおよびその作製方法 | |
| KR19980030121A (ko) | 브이홈에 정렬된 렌즈를 가진 광모듈 및 그 제작방법 | |
| GB2283129A (en) | Semiconductor laser module and method of assembly | |
| US6524017B2 (en) | Arrangement consisting of a photodiode and an optical fiber | |
| EP0466975A1 (en) | Semiconductor light-emitting device | |
| JP2004212847A (ja) | 光結合器 | |
| CN101846777B (zh) | 光器件 | |
| JPH1123914A (ja) | 光素子と光ファイバとの固定構造 | |
| JPH08264748A (ja) | 光導波路集積回路装置及びその製造方法 | |
| US4741595A (en) | Optical transmission device | |
| HK1201931A1 (en) | Optical subassembly and method of manufacturing the same | |
| JPH0447983Y2 (enExample) | ||
| EP0218624A1 (en) | IMPROVEMENTS REGARDING OPTICAL CONNECTION DEVICES. | |
| JP3042453B2 (ja) | 受光モジュール | |
| JPH11194237A (ja) | 光導波路とその製造方法及び光導波路と受光素子の結合構造 | |
| JP3295327B2 (ja) | 双方向光モジュール | |
| JP2000156510A (ja) | 光半導体素子および光半導体素子の製造方法ならびに光電子装置 | |
| JP4113577B2 (ja) | 複合光学素子および複合光学部品 | |
| JPH0496390A (ja) | 光通信用パッケージ | |
| KR100816063B1 (ko) | 수동 정렬된 광결합 장치 및 그 제작방법 |