JPH0446992B2 - - Google Patents
Info
- Publication number
- JPH0446992B2 JPH0446992B2 JP14802888A JP14802888A JPH0446992B2 JP H0446992 B2 JPH0446992 B2 JP H0446992B2 JP 14802888 A JP14802888 A JP 14802888A JP 14802888 A JP14802888 A JP 14802888A JP H0446992 B2 JPH0446992 B2 JP H0446992B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- printed circuit
- epoxy resin
- type epoxy
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14802888A JPS6426690A (en) | 1988-06-17 | 1988-06-17 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14802888A JPS6426690A (en) | 1988-06-17 | 1988-06-17 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6426690A JPS6426690A (en) | 1989-01-27 |
| JPH0446992B2 true JPH0446992B2 (cs) | 1992-07-31 |
Family
ID=15443498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14802888A Granted JPS6426690A (en) | 1988-06-17 | 1988-06-17 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426690A (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0338328A (ja) * | 1989-07-05 | 1991-02-19 | Toagosei Chem Ind Co Ltd | 建築用ハニカムパネル |
| JP3290295B2 (ja) * | 1994-05-13 | 2002-06-10 | 太陽インキ製造株式会社 | 硬化性樹脂組成物並びに該組成物を用いた多層プリント配線板及びその製造方法 |
-
1988
- 1988-06-17 JP JP14802888A patent/JPS6426690A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6426690A (en) | 1989-01-27 |
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