JPH0517269B2 - - Google Patents

Info

Publication number
JPH0517269B2
JPH0517269B2 JP63203829A JP20382988A JPH0517269B2 JP H0517269 B2 JPH0517269 B2 JP H0517269B2 JP 63203829 A JP63203829 A JP 63203829A JP 20382988 A JP20382988 A JP 20382988A JP H0517269 B2 JPH0517269 B2 JP H0517269B2
Authority
JP
Japan
Prior art keywords
printed circuit
epoxy resin
adhesive
circuit board
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63203829A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6485271A (en
Inventor
Toshikazu Furuhata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57196782A external-priority patent/JPS5989380A/ja
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP20382988A priority Critical patent/JPS6485271A/ja
Publication of JPS6485271A publication Critical patent/JPS6485271A/ja
Publication of JPH0517269B2 publication Critical patent/JPH0517269B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP20382988A 1982-11-11 1988-08-18 Printed board Granted JPS6485271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20382988A JPS6485271A (en) 1982-11-11 1988-08-18 Printed board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57196782A JPS5989380A (ja) 1982-11-11 1982-11-11 接着剤組成物
JP20382988A JPS6485271A (en) 1982-11-11 1988-08-18 Printed board

Publications (2)

Publication Number Publication Date
JPS6485271A JPS6485271A (en) 1989-03-30
JPH0517269B2 true JPH0517269B2 (cs) 1993-03-08

Family

ID=26509975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20382988A Granted JPS6485271A (en) 1982-11-11 1988-08-18 Printed board

Country Status (1)

Country Link
JP (1) JPS6485271A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105622548A (zh) * 2016-01-29 2016-06-01 合肥工业大学 一种耐高温缩水甘油胺型多官能环氧树脂及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054509A (en) * 1997-08-28 2000-04-25 Shin-Etsu Chemical Co., Ltd. Adhesive of epoxy resin, nitrile rubbers and curing agent

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649780A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Resin molded bondable article
JPS56135579A (en) * 1980-03-26 1981-10-23 Nitto Electric Ind Co Ltd Bondable resin molded article

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105622548A (zh) * 2016-01-29 2016-06-01 合肥工业大学 一种耐高温缩水甘油胺型多官能环氧树脂及其制备方法

Also Published As

Publication number Publication date
JPS6485271A (en) 1989-03-30

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