JPH0445253Y2 - - Google Patents
Info
- Publication number
- JPH0445253Y2 JPH0445253Y2 JP15971586U JP15971586U JPH0445253Y2 JP H0445253 Y2 JPH0445253 Y2 JP H0445253Y2 JP 15971586 U JP15971586 U JP 15971586U JP 15971586 U JP15971586 U JP 15971586U JP H0445253 Y2 JPH0445253 Y2 JP H0445253Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- substrates
- circuit board
- printed circuit
- external leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 39
- 239000002184 metal Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15971586U JPH0445253Y2 (US06312121-20011106-C00033.png) | 1986-10-17 | 1986-10-17 | |
EP87114938A EP0264780B1 (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
US07/107,990 US4884125A (en) | 1986-10-15 | 1987-10-13 | Hybrid integrated circuit device capable of being inserted into socket |
DE8787114938T DE3777324D1 (de) | 1986-10-15 | 1987-10-13 | Integrierte hybridschaltungsanordnung, die in einen sockel eingesteckt werden kann. |
KR1019870011409A KR900007232B1 (ko) | 1986-10-15 | 1987-10-14 | 혼성집적회로 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15971586U JPH0445253Y2 (US06312121-20011106-C00033.png) | 1986-10-17 | 1986-10-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6365246U JPS6365246U (US06312121-20011106-C00033.png) | 1988-04-30 |
JPH0445253Y2 true JPH0445253Y2 (US06312121-20011106-C00033.png) | 1992-10-23 |
Family
ID=31084403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15971586U Expired JPH0445253Y2 (US06312121-20011106-C00033.png) | 1986-10-15 | 1986-10-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0445253Y2 (US06312121-20011106-C00033.png) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2792958B2 (ja) * | 1989-11-15 | 1998-09-03 | 三洋電機株式会社 | 混成集積回路装置 |
JP2854041B2 (ja) * | 1989-11-16 | 1999-02-03 | 三洋電機株式会社 | 混成集積回路装置 |
-
1986
- 1986-10-17 JP JP15971586U patent/JPH0445253Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6365246U (US06312121-20011106-C00033.png) | 1988-04-30 |
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