JPH0442955A - Hybrid integrated circuit and heat sink - Google Patents

Abstract

PURPOSE:To make it possible to manufacture a heat sink by a punching work only from one sheet of a heat conducting plate by a method wherein the heat sink is formed by a method wherein notches are respectively cut in the four corner parts of one sheet of the heat conducting plate from the sides opposing to each other of the heat sink, the four corner parts are bent at roughly a right angle to form two pairs of standing-up parts opposing to each other and notches are respectively cut in the standing-up direction to form plate spring parts. CONSTITUTION:The whole heat sink is formed of one sheet of a copper plate and after one time of a punching process, the heat sink is provided with flanges 4, which respectively have the dimension of a length roughly equal with the length of a substrate 51 of a hybrid integrated circuit 5 and the dimension of a width slightly larger than the width of the substrate 51 and whose tips are parallel to each other. Moreover, notch parts 6 are provided at positions on a flat plate part 2. Guide parts 3 are provided at four places in parallel to the insides of the flanges 4 and in such a way as to hold the notch parts 6 between them. The height of the flanges 4 is selected slightly higher than the height of the largest component of the circuit 5. The guide parts 3 are bent at a right angle to the plate part 2. Then, plate spring parts 32, shoulder parts 33 and projecting parts 34 are respectively provided at the tips of the parts 3 in such a way as to hold notch parts 31 between the parts 32 and the parts 33 and 34 and the circuit 5 is installed on the heat sink 1.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to hybrid integrated circuits and heat sinks.

[Prior Art and Problems to be Solved by the Invention] When a hybrid integrated circuit handles a relatively large amount of power, it is necessary to provide a heat sink. To do this, a metal plate with good conductivity is required to be used in a hybrid integrated circuit.

For example, a method is used in which copper plates are brought into close contact and fixed with adhesive. This method tends to cause misalignment in the first positioning, and requires semi-fixed work until the adhesive hardens, so the efficiency of the second work is not necessarily high. SUMMARY OF THE INVENTION An object of the present invention is to improve the efficiency of attaching a heat sink to a hybrid integrated circuit.

[Means to solve the problem]

The present invention aims to solve the above-mentioned problems.

Cuts are made from opposite sides of the four corners of a heat conductive plate such as a copper plate, each of the four corners is bent at a nearly right angle to form two pairs of opposing standing parts, and further cuts are made in the direction in which the standing parts stand. In this way, the structure of the heat dissipating plate forming the leaf spring is pressed down.

[Effect]

A substrate of a hybrid integrated circuit is held between the leaf spring portion and the flat portion of the heat conductive plate. In this case, the upright portion serves as a guide, and the two can be assembled without the need for special tools. The structure of this heat sink can be manufactured by punching out a single plate and bending it.

〔Example〕

FIG. 1 shows a first embodiment of a heat sink for a hybrid integrated circuit of a 15 W output DC-DC converter according to the present invention, FIG. 2 is a cross-sectional view thereof, and FIG. 3 is a left side view thereof. FIG. 4 is a developed view of the heat sink. First of all, this heat sink 1
As shown in Figure 4, the entire structure is made of a single copper plate.

- After the punching process, it is manufactured by being bent at 90 degrees at the position shown by the dashed line as an imaginary line. As can be understood from FIGS. 1 to 3, the length of the target hybrid integrated circuit 5 is approximately equal to the length of the substrate 51, and the width of the substrate 51 is slightly larger than the width of the substrate 51. Namba 4 will be set up. Further, since the terminal 52 of the hybrid integrated circuit 5 has conductive parts on both the front and back sides of the substrate 51, a notch 6 is provided at a corresponding position in the flat plate part 2, and the terminal 52 is
This prevents unnecessary contact between 2 and the heat sink l. Guide parts 3 are provided at four locations parallel to the inside of the bar 4 with cutout parts 41 interposed therebetween. The height of the collar 4 is chosen to be slightly higher than the maximum component height of the hybrid integrated circuit 5. The guide portion 3 is bent at right angles to the flat plate portion 2. The height of the guide part 3, like the collar 4, is selected to be slightly higher than the maximum component height of the hybrid integrated circuit 5, but not to exceed the height of the collar 4. Next, a leaf spring part 32, a shoulder part 33, and a protrusion part 34 are provided at the tip of the guide part 3 with the notch part 31 in between. Conveniently, the protrusion 34 is chosen to have a height above the shoulder 33 that is approximately equal to the thickness of the substrate 51.

The hybrid integrated circuit 5 is attached to the heat sink l configured in this way. The surface of the substrate 51 of the hybrid integrated circuit 5 on which components are not mounted is vertically inserted from the guide portion 3 toward the back surface of the flat plate portion 2. The edges of the board 51 come into contact with and press against the four leaf spring parts 32, but when the board 51 is inserted against the elastic force of the leaf spring parts 32 and the entire heat dissipation plate l is slightly bent outward, the edges of the board 51 finally The substrate 51 of the hybrid integrated circuit 5 rides on the shoulder portion 33 which is the ridgeline of the leaf spring portion 32, and the substrate 51 of the hybrid integrated circuit 5 is placed between it and the flat plate portion 2.
is pinched. At this time, the four shoulder parts 33 and the protrusion part 34
and support the ends of the substrate 51 to prevent it from falling off. Therefore, the distance between the opposing inner sides of the protrusions 34 is approximately equal to the length of the corresponding substrate 51. Further, since the leaf spring portions 32 separated by the notch portions 31 have a narrow width, their elastic force acts moderately in both the vertical and horizontal directions, and is suitable for supporting the board 51. Thereafter, the entire hybrid integrated circuit 5 or the component mounting portion of the hybrid integrated circuit 5 is molded with resin.

The width of the opposing ribs 4 can be freely selected as long as it is equal to or larger than the width of the guide portion 3. If the width is increased, the heat radiation ability of the heat sink l will be increased.

FIG. 5 shows a second embodiment of the present invention, which is manufactured based on the same technical concept as the embodiment shown in FIG.

In addition, in FIG. 5, the rear half of the heat sink l is symmetrical to the front half, so the illustration is omitted. Its structure is such that a hybrid integrated circuit 50 substrate 51 is sandwiched between a flat plate portion 2 of a heat sink l and four shoulder portions 33 of a leaf spring portion 32;
It is surrounded and fixed by guide portions 35 at locations. Furthermore, fixing legs 7 are provided at four locations for inserting and fixing the entire hybrid integrated circuit 5, including the heat sink l, onto a printed board (not shown) or the like.

If this fixed leg 7 is grounded using the wiring on the printed board.

The heat sink l is at ground potential, and the hybrid integrated circuit 5 is electrically shielded.

FIG. 6 shows a third embodiment of the present invention, which is manufactured based on the same technical concept as the embodiment shown in FIG.

In FIG. 6 as well, the rear half of the heat sink l is symmetrical to the front half, so the illustration is omitted. As for its structure, the substrate 51 of the hybrid integrated circuit 5 is sandwiched and fixed between the flat plate part of the heat sink l and the four shoulder parts 33 of the leaf spring part 32.

Furthermore, fixing legs 7 are provided at a plurality of locations for inserting and fixing the entire hybrid integrated circuit 5, including the heat dissipation plate, onto a printed board (not shown) or the like.

Comparing the embodiments of FIGS. 5 and 6 with that of FIG.
Both have outlines that are close to perfect rectangles.

When molding the resin after mounting the heat sink, icicles may occur due to the resin sagging during the time it takes to harden (L)
.

Note that the material of the heat sink l is not limited to a copper plate, and other materials having excellent thermal conductivity and elasticity, such as brass, phosphor bronze, aluminum, or reinforced plastic materials having excellent heat conductivity, can be used.

〔Effect of the invention〕

The present invention has the features described above.

In the heat sink of a hybrid integrated circuit, - It can be manufactured only by punching from a test plate, and the utilization rate of materials is high.

Economical. In addition, since the fixing method is a spring-touch structure, there is no need for temporary fixing or waiting time until it hardens, unlike in the case of adhesives, which has the effect of reducing the number of assembly steps.

[Brief explanation of drawings]

FIG. 1 shows a first embodiment of a heat sink for a hybrid integrated circuit according to the present invention (7, FIG. 2 is its cross-sectional view, FIG. 3 is its left side view, and FIG. 4 is its left side view). FIG. 5 shows a second embodiment of the present invention [7. FIG. 6 shows a third embodiment of the present invention. l... - heat sink, 2...~Flat plate part, 3-... Guide part 31
...~Notch part, 32... Leaf spring part, 33... Shoulder part 3
4...Protrusion part, 35...Small guide part 4...Brim, 41...Notch part 5-...Hybrid integrated circuit 51...Substrate 52...One terminal 6...Notch part, 7 ...Fixed leg patent applicant Origin Electric Co., Ltd. Nippon Telegraph and Telephone Co., Ltd. Figure 4 Figure 3

Claims (2)

[Claims] (1) Make cuts in the four corners of one heat conductive plate from opposite sides, bend each of the four corners at almost right angles to form two pairs of opposing standing parts, and cut in the direction in which the standing parts stand. A heat dissipation plate characterized in that it is formed by inserting a leaf spring into a leaf spring part. (2) Make cuts in the four corners of one heat conductive plate from opposite sides, bend each of the four corners at almost right angles to form two pairs of opposing standing parts, and cut in the direction in which the standing parts stand. What is claimed is: 1. A hybrid integrated circuit comprising: a plate spring portion formed by inserting the plate spring portion, and a substrate sandwiched between the plate spring portion and the flat plate portion of the heat conductive plate.