CN219419016U

CN219419016U - Mounting structure and bottom plate

Info

Publication number: CN219419016U
Application number: CN202320501032.4U
Authority: CN
Inventors: 雷浩; 孙松; 赵国亮
Original assignee: Invt Electric Vehicle Drive Technology Shenzhen Co ltd
Current assignee: Invt Electric Vehicle Drive Technology Shenzhen Co ltd
Priority date: 2023-03-15
Filing date: 2023-03-15
Publication date: 2023-07-25
Anticipated expiration: 2033-03-15

Abstract

The utility model provides a mounting structure and a bottom plate, wherein the mounting structure comprises a fitting part and a fixing part; the assembly part is provided with at least one mounting plate and at least one mounting column, the mounting plate is provided with a fixing column for mounting the MOS tube, and the mounting column is used for fixing the mounting column with a bottom plate of the power equipment; one end of the fixing piece is fixed on the bottom plate, and the other end of the fixing piece is tightly pressed on the mounting plate so as to tightly press the MOS tube on the bottom plate. The utility model can avoid the pin of the MOS tube from being broken.

Description

Mounting structure and bottom plate

Technical Field

The utility model relates to the technical field of power equipment, in particular to a mounting structure and a bottom plate.

Background

The MOS tube is generally assembled on a bottom plate of the corresponding power equipment and is electrically connected with the PCB. At present, most MOS (metal oxide semiconductor) tubes are installed, the whole formed by the MOS tubes and the ceramic substrate is fixed on a bottom plate through an elastic sheet, but the ceramic substrate, the MOS tubes and the ceramic substrate are not limited and fixed, so that the ceramic substrate and the MOS tubes can deviate in some application scenes, and then pins of the MOS tubes welded on a PCB (printed circuit board) are broken.

Disclosure of Invention

The utility model provides a mounting structure and a bottom plate, which aim to solve the problem that pins of an existing MOS tube are easy to break due to offset.

In a first aspect, the present utility model provides a mounting structure comprising a fitting and a fixture; the assembly part is provided with at least one mounting plate and at least one mounting column, the mounting plate is provided with a fixing column for mounting the MOS tube, and the mounting column is used for fixing the mounting column with a bottom plate of the power equipment; one end of the fixing piece is fixed on the bottom plate, and the other end of the fixing piece is tightly pressed on the mounting plate so as to tightly press the MOS tube on the bottom plate.

Further, the MOS transistor comprises a substrate, one surface of the substrate is used for being attached to the MOS transistor, and the other surface of the substrate is fixed on the bottom plate.

Further, the fitting also comprises a mounting frame provided with at least one mounting area for mounting the mounting plate.

Further, one end of the mounting plate is used as a fixed end and is fixedly connected with the mounting frame, and the other end of the mounting plate is used as a free end and is attached to the fixing piece.

Further, the fixed end is provided with a baffle, and a plurality of grooves are formed in the baffle.

Further, at least one first fixing hole is formed in the base plate, and the base plate can be fixed on the bottom plate through the first fixing hole under the action of the limiting column.

Further, the fixing piece comprises a fixing plate and at least one elastic piece, the fixing plate is connected with the elastic piece, and the elastic piece is used for extruding the mounting plate.

Further, the fixing plate is provided with at least one limiting hole and at least one second fixing hole.

In a second aspect, the utility model also provides a floor comprising a mounting structure as claimed in any one of the preceding claims.

Further, a heat-conducting adhesive is arranged on the base plate at the position corresponding to the power assembly, and an adhesive piece is arranged at the position corresponding to the PCB.

According to the mounting structure and the bottom plate disclosed by the utility model, the MOS tube can be fixed through the assembly part, the limit of the MOS tube is completed, and the assembly part is extruded through the fixing part, so that the assembly part is tightly attached to the bottom plate, the MOS tube and the bottom plate are prevented from being displaced, and the pins of the MOS tube can be prevented from being broken.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is an overall block diagram of a mounting structure provided by an embodiment of the present utility model;

FIG. 2 is an exploded view of a mounting structure provided by an embodiment of the present utility model at a first view angle;

FIG. 3 is an exploded view of a mounting structure provided by an embodiment of the present utility model at a second view angle;

FIG. 4 is a block diagram of a fitting of a mounting structure provided by an embodiment of the present utility model;

FIG. 5 is a block diagram of a base plate provided by an embodiment of the present utility model; and

fig. 6 is a block diagram of the base plate according to the embodiment of the present utility model after the assembly is completed.

Reference numerals: 1000. a bottom plate; 100. a mounting structure; 10. a fitting; 11. a mounting plate; 12. a mounting column; 13. fixing the column; 14. a mounting frame; 15. a mounting area; 16. a baffle; 17. a groove; 20. a substrate; 21. a first fixing hole; 30. a fixing member; 31. a fixing plate; 32. a spring plate; 33. a limiting hole; 34. a second fixing hole; 200. a MOS tube; 201. a pin; 300. a fastener; 301. positioning columns; 302. a limit column; 303. a first assembly region; 304. a second assembly region; 305. a third assembly region; 306. a fourth assembly area; 307. a mounting hole; 308. and positioning holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

In addition, directional terms such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc. as used herein refer only to the attached drawings and the direction of the product in use. Accordingly, directional terminology is used to describe and understand the utility model and is not limiting of the utility model. In addition, in the drawings, structures similar or identical to those of the drawings are denoted by the same reference numerals.

Referring to fig. 1 to 4, fig. 1 is an overall structural view of a mounting structure 100 provided in an embodiment of the present utility model; fig. 2 is an exploded view of the mounting structure 100 provided by an embodiment of the present utility model at a first view angle; FIG. 3 is an exploded view of the mounting structure 100 from a second perspective provided by an embodiment of the present utility model; fig. 4 is a block diagram of the fitting 10 of the mounting structure 100 provided by the embodiment of the present utility model. As shown in fig. 1 to 3, the mounting structure 100 provided by the present utility model includes a fitting 10 and a fixing member 30; the assembly part 10 is provided with at least one mounting plate 11 and at least one mounting column 13, the mounting plate 11 is provided with a fixing column 12 for mounting the MOS tube 200, and the mounting column 13 is used for fixing the mounting column with a bottom plate 1000 of the power equipment; one end of the fixing member 30 is fixed on the bottom plate 1000, and the other end thereof is pressed against the mounting plate 11, so as to press the MOS tube 200 against the bottom plate 1000.

The assembly 10 is used for installing the MOS tube 200 to limit and fix the MOS tube 200. The assembly 10 includes at least one mounting plate 11 and at least one mounting post 13, the number of mounting plates 11 is consistent with the number of the MOS transistors 200, and the number of the MOS transistors 200 depends on the type of the power equipment, for example, for a general power supply, four MOS transistors 200 are generally required, and accordingly four mounting plates 11 may be provided, and one mounting plate 11 is correspondingly provided with one MOS transistor 200. The mounting plates 11 are provided with the fixing columns 12, the number of the fixing columns 12 is matched with the type of the MOS tube 200, and in general, one mounting plate 11 is provided with one fixing column 12, and the fixing column 12 is used for limiting the MOS tube 200 and preventing the MOS tube 200 from displacement under special scenes. Meanwhile, the assembly 10 further includes at least one mounting post 13, and the mounting post 13 is used for being connected with the base plate 1000, and can be assembled on the base plate 1000. Through the arrangement, the assembly part 10 is used for fixing the MOS tube 200 on one hand and fixing the assembly part on the bottom plate 1000 on the other hand, so that the assembly part 10 is fixed, and the MOS tube 200 is ensured not to displace.

As a further embodiment, the semiconductor device further includes a substrate 20, one surface of the substrate 20 is used for being attached to the MOS transistor 200, and the other surface of the substrate 20 is fixed on the bottom plate 1000.

The substrate 20 may be a ceramic substrate, and may be provided with fixing holes, so as to fix the substrate 20 to the base plate 1000 through the fixing holes, thereby ensuring that the substrate 20 itself does not displace. During assembly, the substrate 20 and the bottom plate 1000 may be assembled first to fix the substrate 20, and then the assembly 10 is fixed on the bottom plate 1000, so that the MOS tube 200 is attached to the substrate 20. In addition, a heat conductive material, for example, a heat conductive paste, may be provided on both sides of the substrate 20 to improve the heat dissipation capability of the substrate 20. After the assembly of the assembly part 10 and the substrate 20 is completed, the fixing part 30 is fixed on the bottom plate 1000, and the extrusion of the assembly part 10 and the substrate 20 is realized through the fixing part 30, so that the assembly part 10 and the substrate 20 and the bottom plate 1000 can be tightly attached, displacement between the assembly part 10 and the substrate 20 is avoided, and meanwhile, the heat dissipation capability of the MOS tube 200 can be improved. As shown in fig. 2 and 3, fig. 2 and 3 are exploded views of the assembly 10 and the MOS transistor 200, and the substrate 20, the MOS transistor 200, the assembly 10 and the fixing member 30 shown in fig. 2 or 3 are assembled in this order to form the structure as shown in fig. 1.

Referring to fig. 4, as a further embodiment, the assembly 10 further comprises a mounting frame 14, the mounting frame 14 being provided with at least one mounting area 15, the mounting area 15 being for mounting the mounting plate 11.

The assembly 10 may include a mounting frame 14, where the mounting frame 14 may be provided with a plurality of mounting areas 15, and each mounting area 15 is provided with a mounting plate 11, as shown in fig. 1, one end of the mounting plate 11 is integrally formed with the mounting frame 14, a fixing column 12 is disposed on the mounting plate 11, and the size of the mounting plate 11 is matched with the size of the MOS transistor 200.

As a further embodiment, one end of the mounting plate 11 is fixedly connected to the mounting frame 14 as a fixed end, and the other end of the mounting plate 11 is attached to the fixing member 30 as a free end.

Wherein, as shown in fig. 4, the end of the mounting plate 11 away from the mounting post 13 is a fixed end, and the mounting plate 11 is connected with the mounting frame 14 through the fixed end. The mounting plate 11 is near the mounting post 13 one end be the free end, and this free end is not connected with the mounting frame 14, and mounting plate 11 is near free end department is equipped with fixed column 12, and fixed column 12 is used for fixed MOS pipe 200. The free end can move up and down relative to the fixed end under the action of external force, so that the mounting plate 11 has certain elasticity. As shown in fig. 2, when the fixing member 30 is assembled with the mounting plate 11, the fixing member 30 is pressed against the free end of the mounting plate 11, and the free end is also close to the MOS tube 200, and since the free end can move relative to the fixed end, it is ensured that the mounting plate 11 can be close to the MOS tube 200 at any time even if the fixing member 30 is displaced.

As a further embodiment, the fixed end is provided with a baffle 16, and a plurality of grooves 17 are formed on the baffle 16.

As shown in fig. 3, a baffle 16 is disposed at a fixed end of the mounting plate 11, a plurality of grooves 17 are formed in the baffle 16, each mounting plate 11 corresponds to a plurality of grooves 17, and the number of the grooves 17 is matched with the number of pins 201 of the MOS transistor 200. For example, if three pins 201 are provided for a general MOS transistor 200, each mounting plate 11 corresponds to three grooves 17, and if there are four MOS transistors 200, four mounting areas 15, four mounting plates 11 and twelve grooves 17 may be provided, one mounting plate 11 is provided in each mounting area 15, and the grooves 17 are used for being clamped with the pins 201 to further limit the MOS transistors 200. Additionally, the baffle 16 may be integrally formed with the mounting frame 14 to enhance the stability of the fitting 10.

As a further embodiment, the base plate 20 is provided with at least one first fixing hole 21, and the base plate 20 may be fixed on the bottom plate 1000 through the first fixing hole 21 under the action of the limiting post 302.

As shown in fig. 2 and 3, at least one first fixing hole 21, for example, two first fixing holes 21 are provided on the substrate 20, and the substrate 20 may be fixedly connected to the base plate 1000 through the first fixing holes 21. For example, holes matching the first fixing holes 21 may be formed in the corresponding region of the base plate 1000, and the fixing and mounting of the substrate 20 may be achieved through a limiting post 302.

As a further embodiment, the fixing member 30 includes a fixing plate 31 and at least one elastic piece 32, the fixing plate 31 is connected to the elastic piece 32, and the elastic piece 32 is used for pressing the mounting plate 11.

As shown in fig. 2, the fixing member 30 includes a fixing plate 31 and at least one elastic sheet 32, and the number of the elastic sheets 32 is consistent with the number of the MOS transistors 200, for example, four elastic sheets 32 may be included. During assembly, each elastic piece 32 is attached to one mounting plate 11, and when the fixing piece 30 is fixed to the bottom plate 1000, the elastic pieces 32 correspondingly press the mounting plate 11 so that the mounting plate 11 compresses the MOS tube 200 on the substrate 20.

As a further embodiment, the fixing plate 31 is provided with at least one limiting hole 33 and at least one second fixing hole 34.

Wherein, fixed plate 31 can be equipped with at least one spacing hole 33 and at least one second fixed orifices 34, and spacing hole 33 is used for realizing spacing to fixed plate 31, improves the efficiency when installing. The second fixing hole 34 is used for fixing the fixing plate 31, and can be fixedly connected with the bottom plate 1000 under the action of a fastener 300. The fastener 300 may be a screw, and as the screw rotates, the fixing plate 31 presses the base plate 1000, and at the same time, the elastic piece 32 presses the mounting plate 11.

As shown in fig. 5 and 6, the present utility model further provides a base plate 1000, the base plate 1000 including the mounting structure 100 according to any one of the above embodiments, the mounting structure 100 including the fitting 10, the base plate 20, and the fixing member 30; the assembly part 10 is provided with at least one mounting plate 11 and at least one mounting column 13, the mounting plate 11 is provided with a fixing column 12 for mounting the MOS tube 200, and the mounting column 13 is used for fixing the mounting column with a bottom plate 1000 of the power equipment; one surface of the substrate 20 is used for being attached to the MOS transistor 200, and the other surface is fixed on the bottom plate 1000; the fixing member 30 is fixed to the base plate 1000 and is fitted to the fitting 10 to press the fitting 10 so that the fitting 10 presses the base plate 20.

Where the mounting structure 100 is assembled on the base plate 1000, there may be provided a matching fixing structure, for example, a positioning column 301, a mounting hole 307, and a positioning hole 308. The mounting holes 307 may be connected to the mounting posts 13 of the mounting structure 100 to secure and retain the fitting 10 on the one hand and to secure the securing member 30 on the other hand. The locating holes 308 may cooperate with the spacing posts 302 to achieve a fixed spacing of the substrate 20, as shown in fig. 3 and 5. The present utility model provides a structure of a chassis 1000 for different power devices, in which circuit components are mounted at different positions, as shown in fig. 5, and the chassis 1000 may include a first mounting area 303, a second mounting area 304, a third mounting area 305, and a fourth mounting area 306, where the first mounting area 303 is used for mounting electrical components such as inductors and transformers, the second mounting area 304 may be used for mounting electrical components such as IGBTs, the third mounting area 305 may be used for mounting electrical components such as capacitors, and the fourth mounting area 306 may be used for mounting PCB boards.

As a further embodiment, the base plate 1000 is provided with a heat-conducting glue at a position opposite to the power component, and an adhesive piece is provided at a position opposite to the PCB.

The first assembly area 303, the second assembly area 304, and the third assembly area 305 may be coated with a heat conducting glue, so that heat dissipation performance of power components such as an inductor, a capacitor, an IGBT, and the like may be improved. An adhesive member, for example, a black glue, is coated on a part of the fourth assembly area 306 to enhance the stability of assembling the PCB, and specifically, a black glue may be coated on an edge area of the fourth assembly area 306, which is attached to the PCB, such as the fourth assembly area 306 on both sides in fig. 5. After the heat-conducting glue and the black glue are coated, the power device and the PCB board can be assembled on the bottom plate 1000, the final structure is shown in fig. 6, and through the structure, the bottom plate 1000 provided by the utility model can pass the 10-moment-level vibration test.

According to the mounting structure and the bottom plate, the MOS tube is limited and fixed through the assembly part, meanwhile, the assembly part is fixedly connected with the bottom plate, the assembly part is fixed, the substrate is fixedly connected with the bottom plate to limit the substrate, and finally, the assembly part is extruded through the fixing part, so that the limit between the MOS tube and the substrate is realized, the MOS tube and the substrate are prevented from being displaced, and the MOS tube and the substrate are prevented from being broken.

While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims

1. A mounting structure for installing MOS transistors, characterized by comprising:

the assembly part is provided with at least one mounting plate and at least one mounting column, the mounting plate is provided with a fixing column for mounting the MOS tube, and the mounting column is used for fixing the mounting column with a bottom plate of the power equipment;

and one end of the fixing piece is fixed on the bottom plate, and the other end of the fixing piece is tightly pressed on the mounting plate so as to tightly press the MOS tube on the bottom plate.

2. The mounting structure of claim 1, further comprising a substrate, one side of the substrate being adapted to be attached to the MOS transistor, the other side of the substrate being secured to the base plate.

3. The mounting structure of claim 1, wherein the fitting further comprises a mounting frame, the mounting frame being provided with at least one mounting area for mounting the mounting plate.

4. A mounting structure according to claim 3, wherein one end of the mounting plate is fixedly connected to the mounting frame as a fixed end, and the other end of the mounting plate is attached to the fixing member as a free end.

5. The mounting structure of claim 4, wherein the fixed end is provided with a baffle plate, and a plurality of grooves are formed in the baffle plate.

6. The mounting structure of claim 2, wherein the base plate is provided with at least one first fixing hole, and the base plate is fixed on the base plate through the first fixing hole under the action of the limit post.

7. The mounting structure of claim 1, wherein the fixing member includes a fixing plate and at least one spring, the fixing plate being connected to the spring, the spring being for pressing the mounting plate.

8. The mounting structure of claim 7, wherein the fixing plate is provided with at least one limiting hole and at least one second fixing hole.

9. A floor comprising the mounting structure of any one of claims 1 to 8.

10. The base plate of claim 9, wherein the base plate is provided with a heat conductive adhesive opposite the power assembly and an adhesive member opposite the PCB.