JP2724904B2 - Hybrid integrated circuit and heat sink - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a hybrid integrated circuit and a heat sink.

[Problems to be solved by conventional technology and invention]

When dealing with relatively large power in a hybrid integrated circuit, it is necessary to provide a heat sink. For this purpose, a method is used in which a metal plate having good thermal conductivity, for example, a copper plate, is brought into close contact with the hybrid integrated circuit, and is fixed directly with an agent. According to this method, misalignment is likely to occur, and a half-fixing operation is required until the adhesive cures, and the operation efficiency is not always high. SUMMARY OF THE INVENTION It is an object of the present invention to improve the work efficiency of mounting a heat sink of a hybrid integrated circuit.

[Means for solving the problem]

In the present invention, in order to solve the above-described problems, cuts are made from the sides facing the four corners of a copper hot plate such as a copper plate,
The present invention proposes a structure of a heat radiating plate that forms a leaf spring by bending each of the four corners at substantially right angles to provide two pairs of opposing erected parts, and further making a cut in the erected direction of the erected parts.

[Action]

The substrate of the hybrid integrated circuit is sandwiched between the leaf spring portion and the flat portion of the heat conductive plate. In this case, the upright portion serves as a guide, and can be assembled without requiring a special tool or the like. The structure of the heat radiating plate can be manufactured by punching and bending a single plate.

〔Example〕

FIG. 1 shows a first embodiment of a heat sink of a hybrid integrated circuit of a 15 W output DC-DC converter according to the present invention, FIG. 2 is a cross sectional view thereof, and FIG. 3 is a left side view thereof. And
FIG. 4 is a development view of the heat sink. First, as shown in an exploded view of FIG. 4, the heat radiating plate 1 is entirely formed of a single copper plate, and after a single punching process, at a position indicated by a dashed line as an imaginary line. It is manufactured by bending at 90 degrees. As can be understood from FIGS. 1 to 3, both ends of the target hybrid integrated circuit 5 having a length substantially equal to the length of the substrate 51 and a width slightly larger than the width of the substrate 51 are parallel to each other. A brim 4 is provided. Since the terminals 52 of the hybrid integrated circuit 5 have conductive portions on both the front and back surfaces of the substrate 51, cutouts 6 are provided at the positions of the flat plate portions 2 corresponding to the conductive portions to prevent unnecessary contact between the terminals 52 and the radiator plate 1. To prevent. The guides 3 are provided at four places in parallel with the inside of the flange 4 with the notch 41 interposed therebetween. The height of the collar 4 is selected to be slightly higher than the maximum component height of the hybrid integrated circuit 5. The guide portion 3 is bent at a right angle to the flat plate portion 2. The height of the guide portion 3 is selected to be slightly higher than the maximum component height of the hybrid integrated circuit 5 and not to exceed the height of the flange 4 as in the case of the flange 4 at the height. Next, a leaf spring portion 32, a shoulder portion 33, and a protruding portion 34 are provided at the tip of the guide portion 3 with the notch portion 31 interposed therebetween. Projecting part 34 is more substrate than shoulder part 33
It is convenient to choose a height approximately equal to the thickness of 51.

The hybrid integrated circuit 5 is mounted on the heat sink 1 configured as described above. The surface of the substrate 51 of the hybrid integrated circuit 5 on which the components are not mounted is vertically inserted from the guide portion 3 toward the back surface of the flat plate portion 2. The edges of the substrate 51 contact the four leaf spring portions 32,
Although it is pressed, when it is inserted against the elastic force of the leaf spring portion 32 and the entire heat sink 1 is slightly bent outward, the board 51
Of the hybrid integrated circuit 5 is sandwiched between the flat portion 2 and the shoulder portion 33 which is a ridgeline of the leaf spring portion 32.
At this time, the four shoulders 33 and the projections 34 support the ends of the substrate 51 with each other to prevent them from falling off. Therefore, the distance between the inner sides of the protrusions 34 is substantially equal to the length of the corresponding substrate 51. Further, since the leaf spring portion 32 separated by the notch portion 31 has a narrow width, the elastic force thereof works moderately in both the vertical direction and the horizontal direction, so that it is familiar to support the substrate 51. Thereafter, the whole or the component mounting portion of the hybrid integrated circuit 5 is resin-molded.

The facing width of the flange 4 can be freely selected as long as it is equal to or larger than the width of the guide portion 3. If the width is increased, the heat dissipation capability of the heat sink 1 is increased.

FIG. 5 shows a second embodiment of the present invention, which is manufactured with the same technical concept as the embodiment shown in FIG. In FIG. 5, the rear half of the heat sink 1 is symmetric with the front half.
The illustration is omitted. In the structure, the substrate 51 of the hybrid integrated circuit 5 includes the flat plate portion 2 of the heat sink 1 and the four
It is sandwiched between the shoulders 33 at the locations and is fixed by being surrounded by four guides 35. Also, fixing legs 7 for inserting and fixing the entire hybrid integrated circuit 5 including the heat sink 1 to a printed board (not shown) or the like are provided at four places. If the fixed legs 7 are grounded by the wiring of the printed board, the heat sink 1 is at the ground potential, and the hybrid integrated circuit 5 is electrically shielded.

FIG. 6 shows a third embodiment of the present invention, which is manufactured with the same technical concept as the embodiment shown in FIG. Figure 6 also
Since the rear half of the heat sink 1 is symmetrical to the front half, it is omitted in the drawing. In this structure, the substrate 51 of the hybrid integrated circuit 5 is fixed between the flat plate portion of the heat sink 1 and the four shoulder portions 33 of the leaf spring portion 32. In addition, this heat sink 1
There are provided a plurality of fixing legs 7 for inserting and fixing the entire hybrid integrated circuit 5 to a printed board or the like (not shown).

5 and 6, the outline is almost completely rectangular when compared with the embodiment of FIG. 1, so that the resin hangs in the time until the resin hardens when the resin is molded after mounting the heat sink. Icicles are less likely to occur.

The material of the heat radiating plate 1 is not limited to the copper plate, and a material having excellent heat conductivity and elasticity, for example, brass, phosphor bronze, aluminum, or a reinforced plastic having excellent heat conductivity can be used.

〔The invention's effect〕

Since the present invention has the features described above, the heat sink of the hybrid integrated circuit can be manufactured only by punching from a single plate, and the material utilization rate is high, and it is economical. Further, since the fixing method is a one-touch spring structure, as in the case of the adhesive, temporary fixing and waiting time until curing is not required, which has an effect of reducing the number of assembling steps.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of a heat sink of a hybrid integrated circuit according to the present invention, FIG. 2 is a transverse sectional view thereof, FIG. 3 is a left side view thereof, and FIG. FIG. FIG. 5 shows a second embodiment of the present invention, and FIG. 6 shows a third embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 ... Heat sink, 2 ... Flat part, 3 ... Guide part 31 ... Notch part, 32 ... Leaf spring part, 33 ... Shoulder part 34 ... Projection part, 35 ... Small guide part 4 ... Collar, 41 ... Notch 5 ... Hybrid integrated circuit 51 ... Board 52 ... Terminal 6 ... Notch, 7 ... Fixed leg

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akihiro Mitsuhashi 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation (72) Shinji Ishizuka 1-16-1 Uchisaiwaicho, Chiyoda-ku, Tokyo Japan Telegraph and Telephone Corporation (72) Inventor Hisahiko Okajima 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Corporation Examiner Hideo Kawasanada

Claims (2)

(57) [Claims] An incision is made from a side facing four corners of one heat guide plate, and each of the four corners is bent substantially at right angles to form two pairs of upright standing portions, and the upright direction of the upstanding portions A radiator plate, wherein a plate spring portion is formed by making a cut in the plate. 2. A cut is made from the side opposite to the four corners of a single heat conductive plate, and each of the four corners is bent at substantially right angles to form two pairs of upright standing portions, and the upright direction of the upstanding portions. A hybrid integrated circuit, comprising: forming a leaf spring portion by making a cut in the plate; and providing a substrate sandwiched between the leaf spring portion and the flat plate portion of the heat conducting plate.