CN110350332B - Electrical connector with improved contact arrangement - Google Patents
Electrical connector with improved contact arrangement Download PDFInfo
- Publication number
- CN110350332B CN110350332B CN201810289815.4A CN201810289815A CN110350332B CN 110350332 B CN110350332 B CN 110350332B CN 201810289815 A CN201810289815 A CN 201810289815A CN 110350332 B CN110350332 B CN 110350332B
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- CN
- China
- Prior art keywords
- edge
- chip module
- electrical connector
- radiating fin
- metal cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an electric connector which is used for electrically connecting a chip module, and comprises an insulating body for bearing the chip module, conductive terminals arranged on the insulating body and electrically connected with the chip module, and a metal cover body covering the insulating body, wherein the metal cover body is arranged above the insulating body, the electric connector comprises a radiating fin clamped between the chip module and the metal cover body, the radiating fin is provided with an upper surface and a lower surface which are opposite, the lower surface is contacted with the chip module, the upper surface is contacted with the metal cover body, and heat emitted by the chip module can be outwards transmitted through the radiating fin and the metal cover body contacted with the radiating fin, so that the radiating speed of the chip module is increased.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to an electrical connector, and more particularly to an electrical connector for electrically connecting a circuit board and a chip module.
[ background of the invention ]
Chinese utility model patent publication No. CN205104653U discloses an electrical connector, which comprises an insulating body and a cover body located above the insulating body, wherein an opening is provided in the center of the cover body, two side edges of the cover body are respectively provided with a pressing sheet protruding toward the opening, the pressing sheet is pressed downward against a chip module to firmly assemble the chip module on the insulating body, and meanwhile, the pressing sheet has a certain heat dissipation effect by contacting with the chip module; however, the game-type personal computer in the current market has very high requirement for the heat dissipation performance of the chip module due to the over-frequency requirement of the terminal player, the over-frequency heat dissipation requirement of the chip module cannot be met only by the traditional fan heat dissipation, the contact area between the pressing sheet of the electric connector and the chip module is very small, and the quick heat dissipation of the chip module cannot be realized.
Therefore, there is a need for a new electrical connector to overcome the above-mentioned drawbacks.
[ summary of the invention ]
The invention aims to provide an electric connector capable of accelerating the heat dissipation speed of a chip module.
The purpose of the invention is realized by the following technical scheme: an electric connector is used for electrically connecting a chip module, and comprises an insulating body for bearing the chip module, conductive terminals arranged on the insulating body and electrically connected with the chip module, and a metal cover body covering the insulating body, wherein the metal cover body is arranged above the insulating body, the electric connector comprises a radiating fin clamped between the chip module and the metal cover body, the radiating fin is provided with an upper surface and a lower surface which are opposite, the lower surface is contacted with the chip module, and the upper surface is contacted with the metal cover body.
Furthermore, the chip module comprises a substrate, a protruding part protruding upwards from the center of the substrate, and a step part surrounding the protruding part and used for heat dissipation, wherein the protruding part is higher than the step part, the heat dissipation sheet is provided with an opening penetrating through the upper surface and the lower surface, the heat dissipation sheet is lapped on the step part, the protruding part protrudes upwards and extends into the opening, and the upper surface of the protruding part is approximately flush with the upper surface of the heat dissipation sheet.
Further, the heat dissipation sheet comprises a first edge, a second edge, a third edge and a fourth edge, wherein the first edge and the second edge are arranged oppositely, the third edge and the fourth edge are connected with two ends of the first edge and the second edge respectively and are arranged oppositely, the first edge, the second edge, the third edge and the fourth edge are arranged together to form the opening, at least one edge of the heat dissipation sheet is provided with a heat conduction part which is in a tongue shape and protrudes outwards, and the metal cover body is pressed on the upper surface of the heat conduction part to form contact.
Further, the heat conduction portion protrudes outward from the first side, and the length of the heat conduction portion on the first side is equal to or greater than two-thirds of the length of the first side.
Further, the metal cover body is provided with a hollow heat dissipation opening, the heat dissipation opening and the heat dissipation sheet are correspondingly arranged so that the heat dissipation sheet is exposed to the heat dissipation opening, notches sunken towards the opening direction are formed in the second edge and the third edge of the heat dissipation sheet, a pressing sheet protruding towards the heat dissipation opening is arranged on the notch corresponding to the metal cover body, and the pressing sheet penetrates through the notches and presses the step portion of the chip module downwards.
Furthermore, the lower surface of the radiating fin is provided with a fixing block protruding downwards, and the fixing block is lapped on the substrate of the chip module.
Furtherly, the fixed block includes first fixed block, second fixed block and third fixed block, first fixed block certainly the first edge downwardly protruding of fin is stretched, first fixed block be rectangular shape setting and with first edge parallel extension, second, third fixed block are the symmetry and set up and do respectively the fourth edge is stretched with the third edge downwardly protruding.
Further, the upper surface of fin is equipped with the fin of bar.
Further, the convex ribs are arranged on the first edge and the second edge.
Furthermore, the material of the heat sink is aluminum or copper.
Compared with the prior art, the invention has the following beneficial effects: the electric connector provided by the invention has the advantages that the radiating speed of the chip module is increased by arranging the radiating fins which are simultaneously contacted with the chip module and the metal cover body, the heat emitted by the chip module can be outwards transmitted through the radiating fins and the metal cover body, and the arrangement of multiple radiating channels is favorable for the quick radiation of the chip module.
[ description of the drawings ]
Fig. 1 is a perspective view of the electrical connector of the present invention mounted to a circuit board.
Fig. 2 is a partially exploded view of the electrical connector shown in fig. 1.
Fig. 3 is a perspective view of the heat sink and the chip module shown in fig. 2.
Fig. 4 is a perspective view of the heat sink and the chip module shown in fig. 3 assembled together.
Fig. 5 is a perspective view of fig. 4 from another angle.
Fig. 6 is a sectional view taken along line a-a of fig. 1.
Fig. 7 is a sectional view taken along line B-B in fig. 1.
[ description of main element symbols ]
Fixing block 47 of metal cover 3
Fixing member 51 of pivot 33
Locking part 6 of heat sink 4
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
[ detailed description ] A
Hereinafter, an embodiment of the electrical connector of the present invention will be described with reference to fig. 1 to 7.
As shown in fig. 1 to 7, the present invention is an electrical connector 100 for electrically connecting a circuit board 300 and a chip module 200, wherein the electrical connector 100 includes an insulating body 1 for carrying the chip module 200, conductive terminals 2 disposed on the insulating body 1 for electrically connecting with the chip module 200, a metal cover 3 covering the insulating body 1, and a connecting member 5 disposed beside the insulating body 1, wherein the metal cover 3 is pivotally connected to the connecting member 5 to rotate between an open position and a closed position. The electrical connector 100 further includes a heat sink 4 sandwiched between the chip module 200 and the metal cover 3, wherein the heat sink 4 is made of a metal material with good thermal conductivity, such as aluminum or copper. The heat sink 4 has an upper surface 401 and a lower surface 402 opposite to each other, wherein the lower surface 402 is in contact with the chip module 200, and the upper surface 401 is in contact with the metal cover 3. Referring to fig. 2 and 6, the chip module 200 includes a substrate 201, a protrusion 202 protruding upward from the center of the substrate 201, and a step 203 surrounding the protrusion 202 for dissipating heat. The protruding part 202 is higher than the step part 203, the heat sink 4 has an opening 40 penetrating through the upper and lower surfaces 401, 402, the heat sink 4 is lapped on the step part 203, the protruding part 202 protrudes upward into the opening 40, and the upper surface 2021 of the protruding part 202 is substantially flush with the upper surface 401 of the heat sink 4.
Referring to fig. 2 to 7, the heat sink 4 includes a first side 41, a second side 42, and a third side 43 and a fourth side 44 respectively connected to two ends of the first side 41 and the second side 42 and disposed oppositely, the first side 41, the second side 42, the third side 43, and the fourth side 44 together enclose the opening 40, at least one side of the heat sink 4 is provided with a heat conducting portion 45 protruding outward in a tongue-like shape, and the metal cover 3 presses against an upper surface 451 of the heat conducting portion 45 to form a contact. In the present embodiment, the heat conducting portion 45 protrudes outward from the first side 41, and generally, in order to increase an effective heat conducting area, the length of the heat conducting portion 45 corresponding to the first side 41 is equal to or greater than two thirds of the length of the first side 41. The metal cover 3 has a hollow heat dissipation opening 30, the heat dissipation opening 30 is disposed corresponding to the heat dissipation plate 4 so that the heat dissipation plate 4 is exposed to the heat dissipation opening 30, the second and third edges 42 and 43 of the heat dissipation plate 4 are provided with notches 46 recessed toward the opening 40, the metal cover 3 is provided with pressing pieces 31 protruding toward the heat dissipation opening 30 corresponding to the notches 46, the pressing pieces 31 slightly extend obliquely toward the chip module 200, and the pressing pieces 31 penetrate through the notches 46 to press the step 203 of the chip module 200 downward, so that the heat of the chip module 200 is directly transmitted to the metal cover 3 through the pressing pieces 31 to further accelerate the heat dissipation thereof. The metal lid 3 includes a frame 32 surrounding the heat dissipation opening 30, in this embodiment, the upper surface 401 of the heat dissipation plate 4 is substantially flush with the upper surface 321 of the frame 32, the upper surface 451 of the heat conduction portion 45 is lower than the upper surface 401 of the heat dissipation plate 4, and the upper surface 451 of the heat conduction portion 45 is in contact with the lower surface 322 of the frame 32.
As shown in fig. 3 and 6, the lower surface 402 of the heat sink 4 is provided with a fixing block 47 protruding downward, and the fixing block 47 is attached to the substrate 201 of the chip module 200. Set up the fixed block 47 can strengthen the fin 4 place in stability on the chip module 200, simultaneously the fixed block 47 also can be to a certain extent with the heat conduction of chip module 200 extremely the fin 4 is favorable to accelerating the radiating rate of chip module 200. In this embodiment, the fixing block 47 includes a first fixing block 471, a second fixing block 472, and a third fixing block 473, the first fixing block 471 protrudes downward from the first edge 41 of the heat sink 4, the first fixing block 471 is disposed in a strip shape and extends parallel to the first edge 41, and the second and third fixing blocks 472, 473 are symmetrically disposed and protrude downward from the fourth edge 44 and the third edge 43, respectively. The first fixing block 41, the second fixing block 42 and the third fixing block 43 are arranged in a triangular stable structure, which is beneficial to the realization of stress balance of the heat sink 4 placed on the substrate 201.
Referring to fig. 1 to 4, the upper surface 401 of the heat sink 4 is provided with a strip-shaped rib 48, and in the present embodiment, the rib 48 is disposed on the first side 41 and the second side 42. The ribs 48 may increase the surface area of the heat sink 4, which is beneficial to increase the heat dissipation speed of the heat sink 4 itself, thereby achieving the rapid heat dissipation of the chip module 200.
As shown in fig. 1 and fig. 2, the connecting member 5 includes a fixing member 51 disposed on one side of the insulating body 1 and a connecting rod 52 pivotally connected to the fixing member 51, the metal cover 3 has a pivot portion 33 disposed corresponding to the fixing member 51 and a movable portion 34 disposed opposite to the pivot portion 33, and the pivot portion 33 is pivotally connected to the fixing member 51 through the connecting rod 52 to rotate between the open position and the closed position. The electrical connector 100 further includes a locking member 6 disposed opposite to the connecting member 5, as shown in fig. 1, when the metal cover 3 is located at the closed position, the movable portion 34 is fixed by the locking member 6, and the locking member 6 has a pressing effect on the metal cover 3, so that the metal cover 3 is firmly covered on the heat sink 4, which is beneficial to tightly attaching the heat conducting portion 45 to the frame 32 of the metal cover 3, and thus, heat dissipation is accelerated.
The electrical connector 100 of the present invention increases the heat dissipation speed of the chip module 200 by providing the heat sink 4 contacting the chip module 200 and the metal cover 3 at the same time, the heat sink 4 contacts the metal cover 3 through the heat conduction portion 45 with a large heat transfer area, and the chip module 200 also directly contacts the metal cover 3 through the pressing sheet 31, so that the heat dissipated by the chip module 200 can be transferred to the outside through the heat sink 4 itself and also can be transferred to the outside through the metal cover 3, and the multiple heat dissipation channels provided in this way are favorable for realizing the rapid heat dissipation of the chip module 200.
The above description is only a part of the embodiments of the present invention, and not all embodiments, and any equivalent variations of the technical solutions of the present invention, which are made by those skilled in the art through reading the present specification, are covered by the claims of the present invention.
Claims (9)
1. The utility model provides an electric connector for an electric connection chip module, electric connector is including bearing the insulator of chip module, locate on the insulator with chip module electric connection's conductive terminal and lid close the metal lid of insulator top, its characterized in that: the electric connector comprises a radiating fin clamped between the chip module and the metal cover body, the radiating fin is provided with an upper surface and a lower surface which are opposite, the lower surface is contacted with the chip module, the upper surface is contacted with the metal cover body, the chip module comprises a substrate, a protruding part protruding upwards from the center of the substrate and a step part surrounding the protruding part and used for radiating, the protruding part is higher than the step part, the radiating fin is provided with an opening penetrating through the upper surface and the lower surface, the radiating fin is lapped on the step part, the protruding part protrudes upwards and extends into the opening, and the upper surface of the protruding part is approximately flush with the upper surface of the radiating fin.
2. The electrical connector of claim 1, wherein: the heat dissipation sheet comprises a first edge, a second edge and a third edge and a fourth edge, wherein the first edge and the second edge are arranged oppositely, the third edge and the fourth edge are arranged oppositely, the first edge, the second edge, the third edge and the fourth edge are arranged oppositely, the opening is formed by enclosing the first edge, the second edge, the third edge and the fourth edge together, at least one edge of the heat dissipation sheet is provided with a heat conduction part which is in a tongue shape and protrudes outwards, and the metal cover body is pressed on the upper surface of the heat conduction part to form contact.
3. The electrical connector of claim 2, wherein: the heat conduction portion protrudes outward from the first edge, and the length of the heat conduction portion on the first edge is greater than or equal to two thirds of the length of the first edge.
4. The electrical connector of claim 2, wherein: the metal lid has a hollow thermovent, the thermovent with the fin corresponds the setting so that the fin exposes in the thermovent, the second of fin, third side are equipped with to the sunken breach of opening direction, the metal lid corresponds the breach is equipped with to the convex pressing blade of thermovent, the pressing blade runs through the breach is pressed down the step portion of chip module.
5. The electrical connector of claim 4, wherein: the lower surface of the radiating fin is provided with a fixing block protruding downwards, and the fixing block is lapped on the substrate of the chip module.
6. The electrical connector of claim 5, wherein: the fixed block includes first fixed block, second fixed block and third fixed block, first fixed block certainly the first edge downwardly protruding of fin is stretched, first fixed block be rectangular shape setting and with first edge parallel extension, second, third fixed block are the symmetry and set up and do respectively the fourth edge is downwardly protruding to be stretched with the third edge.
7. The electrical connector of claim 2, wherein: the upper surface of the radiating fin is provided with strip-shaped convex ribs.
8. The electrical connector of claim 7, wherein: the convex rib is arranged on the first edge and the second edge.
9. The electrical connector of any one of claims 1 to 8, wherein: the radiating fin is made of aluminum or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810289815.4A CN110350332B (en) | 2018-04-03 | 2018-04-03 | Electrical connector with improved contact arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810289815.4A CN110350332B (en) | 2018-04-03 | 2018-04-03 | Electrical connector with improved contact arrangement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110350332A CN110350332A (en) | 2019-10-18 |
| CN110350332B true CN110350332B (en) | 2022-07-26 |
Family
ID=68173387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810289815.4A Active CN110350332B (en) | 2018-04-03 | 2018-04-03 | Electrical connector with improved contact arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110350332B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201178164Y (en) * | 2008-02-29 | 2009-01-07 | 富士康(昆山)电脑接插件有限公司 | Combination of electric connector |
| CN201230115Y (en) * | 2008-06-24 | 2009-04-29 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN201966352U (en) * | 2010-11-30 | 2011-09-07 | 富士康(昆山)电脑接插件有限公司 | Electric connector assembly |
| US8966747B2 (en) * | 2011-05-11 | 2015-03-03 | Vlt, Inc. | Method of forming an electrical contact |
| CN205104653U (en) * | 2015-10-16 | 2016-03-23 | 富士康(昆山)电脑接插件有限公司 | Holder and electric connector subassembly |
-
2018
- 2018-04-03 CN CN201810289815.4A patent/CN110350332B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110350332A (en) | 2019-10-18 |
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