JPH0442939Y2 - - Google Patents
Info
- Publication number
- JPH0442939Y2 JPH0442939Y2 JP1987160138U JP16013887U JPH0442939Y2 JP H0442939 Y2 JPH0442939 Y2 JP H0442939Y2 JP 1987160138 U JP1987160138 U JP 1987160138U JP 16013887 U JP16013887 U JP 16013887U JP H0442939 Y2 JPH0442939 Y2 JP H0442939Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit boards
- external leads
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001105 regulatory effect Effects 0.000 claims description 15
- 238000010396 two-hybrid screening Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 7
- 230000003014 reinforcing effect Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Casings For Electric Apparatus (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160138U JPH0442939Y2 (pl) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987160138U JPH0442939Y2 (pl) | 1987-10-20 | 1987-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0165138U JPH0165138U (pl) | 1989-04-26 |
| JPH0442939Y2 true JPH0442939Y2 (pl) | 1992-10-12 |
Family
ID=31441943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987160138U Expired JPH0442939Y2 (pl) | 1987-10-20 | 1987-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442939Y2 (pl) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2532400Y2 (ja) * | 1991-03-22 | 1997-04-16 | 富士ゼロックス株式会社 | ハイブリットｉｃ |
-
1987
- 1987-10-20 JP JP1987160138U patent/JPH0442939Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0165138U (pl) | 1989-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3907145B2 (ja) | チップ電子部品 | |
| JP3482702B2 (ja) | プラスチックパッケージ内のヒートシンクとして機能する基台 | |
| JPH0442939Y2 (pl) | ||
| US5291372A (en) | Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure | |
| JPH0220861Y2 (pl) | ||
| JPH0126111Y2 (pl) | ||
| JPH0635476Y2 (ja) | 混成集積回路 | |
| JPH0442936Y2 (pl) | ||
| JPS6373694A (ja) | 電子回路基板 | |
| US5260602A (en) | Hybrid integrated-circuit device having an asymmetrical thermal dissipator | |
| JP2544272Y2 (ja) | 混成集積回路 | |
| JPH0442937Y2 (pl) | ||
| JPH0644110Y2 (ja) | 半導体装置 | |
| JPH01105592A (ja) | 混成集積回路の実装方法 | |
| JP2854041B2 (ja) | 混成集積回路装置 | |
| JPH0514516Y2 (pl) | ||
| JPS61244052A (ja) | 半導体装置 | |
| JPH0631723Y2 (ja) | 半導体装置 | |
| JPS6177349A (ja) | 混成集積回路の冷却方法 | |
| JPS6334287Y2 (pl) | ||
| JPH0642372Y2 (ja) | 混成集積回路装置 | |
| JPS635248Y2 (pl) | ||
| JPH0534133Y2 (pl) | ||
| JPH0521902Y2 (pl) | ||
| JPH056715Y2 (pl) |