JPH0442136B2 - - Google Patents

Info

Publication number
JPH0442136B2
JPH0442136B2 JP60015526A JP1552685A JPH0442136B2 JP H0442136 B2 JPH0442136 B2 JP H0442136B2 JP 60015526 A JP60015526 A JP 60015526A JP 1552685 A JP1552685 A JP 1552685A JP H0442136 B2 JPH0442136 B2 JP H0442136B2
Authority
JP
Japan
Prior art keywords
wafer
plate
peeling
index table
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60015526A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61178172A (ja
Inventor
Hiroshi Komase
Kazuhito Yasukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Instruments Corp
Original Assignee
Sankyo Seiki Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sankyo Seiki Manufacturing Co Ltd filed Critical Sankyo Seiki Manufacturing Co Ltd
Priority to JP60015526A priority Critical patent/JPS61178172A/ja
Publication of JPS61178172A publication Critical patent/JPS61178172A/ja
Publication of JPH0442136B2 publication Critical patent/JPH0442136B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP60015526A 1985-01-31 1985-01-31 ウエハ−の自動剥離装置 Granted JPS61178172A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60015526A JPS61178172A (ja) 1985-01-31 1985-01-31 ウエハ−の自動剥離装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60015526A JPS61178172A (ja) 1985-01-31 1985-01-31 ウエハ−の自動剥離装置

Publications (2)

Publication Number Publication Date
JPS61178172A JPS61178172A (ja) 1986-08-09
JPH0442136B2 true JPH0442136B2 (enrdf_load_html_response) 1992-07-10

Family

ID=11891250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60015526A Granted JPS61178172A (ja) 1985-01-31 1985-01-31 ウエハ−の自動剥離装置

Country Status (1)

Country Link
JP (1) JPS61178172A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2599712B2 (ja) * 1987-03-28 1997-04-16 三菱マテリアル株式会社 ウエーハ剥離装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151995A (en) * 1976-06-14 1977-12-16 Hitachi Ltd Wafer grinder
JPS58223561A (ja) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd ポリツシングマシン

Also Published As

Publication number Publication date
JPS61178172A (ja) 1986-08-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees