JPH0440560U - - Google Patents
Info
- Publication number
- JPH0440560U JPH0440560U JP8300790U JP8300790U JPH0440560U JP H0440560 U JPH0440560 U JP H0440560U JP 8300790 U JP8300790 U JP 8300790U JP 8300790 U JP8300790 U JP 8300790U JP H0440560 U JPH0440560 U JP H0440560U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- heat
- metal core
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims description 2
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例による印刷配線板を
示す断面図、第２図は本考案の他の実施例を示す
断面図であり、第３図、第４図は従来の印刷配線
板を示す断面図である。
１は金属芯、２は絶縁層、３は印刷配線板本体
、４は放熱金属板、５は導体パターン、６はＩＣ
等電子部品、７は６のリード、８はスルーホール
、９は金属ネジ、１０は絶縁性の皮膜、１１は熱
伝導性ラバーシートである。なお、図中、同一符
号は同一部分を示す。
FIG. 1 is a sectional view showing a printed wiring board according to one embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIGS. 3 and 4 are conventional printed wiring boards. FIG. 1 is a metal core, 2 is an insulating layer, 3 is a printed wiring board body, 4 is a heat dissipation metal plate, 5 is a conductor pattern, 6 is an IC
7 is a lead of 6, 8 is a through hole, 9 is a metal screw, 10 is an insulating film, and 11 is a thermally conductive rubber sheet. Note that in the figures, the same reference numerals indicate the same parts.
Claims (1)
を設けた放熱金属板を金属芯入り配線板の導体パ
ターン配線密度を減少させることなく金属ネジ等
で一体化し、発熱するＩＣ等電子部品を放熱金属
板に実装させて、電子部品本体とリード双方から
金属芯入り印刷配線板の金属芯に高速で効果的に
熱伝導が出来、電子部品の放熱性を向上させるこ
とを特徴とする印刷配線板。 A heat dissipating metal plate with an insulating film applied to the contact area with a printed wiring board with a metal core is integrated with metal screws, etc. without reducing the conductor pattern wiring density of the printed wiring board with a metal core, and heat is radiated from electronic components such as ICs that generate heat. A printed wiring board characterized in that when mounted on a metal plate, heat can be conducted effectively at high speed from both the electronic component body and the leads to the metal core of the printed wiring board with a metal core, thereby improving the heat dissipation of the electronic component. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8300790U JPH0440560U (en) | 1990-08-04 | 1990-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8300790U JPH0440560U (en) | 1990-08-04 | 1990-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440560U true JPH0440560U (en) | 1992-04-07 |
Family
ID=31630316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8300790U Pending JPH0440560U (en) | 1990-08-04 | 1990-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440560U (en) |
-
1990
- 1990-08-04 JP JP8300790U patent/JPH0440560U/ja active Pending
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