JPH0437584B2 - - Google Patents
Info
- Publication number
- JPH0437584B2 JPH0437584B2 JP724183A JP724183A JPH0437584B2 JP H0437584 B2 JPH0437584 B2 JP H0437584B2 JP 724183 A JP724183 A JP 724183A JP 724183 A JP724183 A JP 724183A JP H0437584 B2 JPH0437584 B2 JP H0437584B2
- Authority
- JP
- Japan
- Prior art keywords
- foreign matter
- sealing
- assembly
- glass tube
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 20
- 239000008188 pellet Substances 0.000 description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP724183A JPS59134836A (ja) | 1983-01-21 | 1983-01-21 | 異物除去方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP724183A JPS59134836A (ja) | 1983-01-21 | 1983-01-21 | 異物除去方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59134836A JPS59134836A (ja) | 1984-08-02 |
| JPH0437584B2 true JPH0437584B2 (enrdf_load_stackoverflow) | 1992-06-19 |
Family
ID=11660502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP724183A Granted JPS59134836A (ja) | 1983-01-21 | 1983-01-21 | 異物除去方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59134836A (enrdf_load_stackoverflow) |
-
1983
- 1983-01-21 JP JP724183A patent/JPS59134836A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59134836A (ja) | 1984-08-02 |
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