JPH04368137A - Packaging method for semiconductor element - Google Patents

Abstract

PURPOSE:To avoid the increse of cost and prevent the decrease of packaging density, when a semiconductor element is resin-sealed and packaged. CONSTITUTION:While ultraviolet-curing resin 5 is spread on the outer peripheral part S2 and the inner peripheral part S1 of a semiconductor element 2, firstly the outer peripheral part S2 only is irradiate with ultraviolet radiation and cured. Secondly the whole surface containing at least the inner peripheral part S1 is irradiated with ultraviolet radiation, and the whole part of the ultraviolet- curing resin 5 is cured.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packaging semiconductor elements such as ICs by sealing them with ultraviolet curing resin.

0002

2. Description of the Related Art In order to complete a semiconductor device such as an IC as a semiconductor device, it is necessary to seal and mount the chip-shaped semiconductor device with an appropriate protective material in order to protect it from the external atmosphere. As this protective material, resin is usually widely used because it is excellent in terms of workability, cost, airtightness, etc.

[0003] As a conventional method for mounting semiconductor elements using such resin, a lead frame is prepared in advance with a dam frame for preventing resin from flowing out, and a semiconductor element is connected to a desired surface of this lead frame. Furthermore, after wire bonding is performed, a method is implemented in which a region including the semiconductor element and a part of the lead frame is surrounded by a mold using a transfer molding technique, and a resin is poured into this region.

Another method is to connect a semiconductor element onto a wiring board, perform wire bonding, and then apply resin over a wide area to a thickness that completely covers the semiconductor element. .

[0005]

However, the following problems exist in each of the conventional semiconductor element mounting methods.

First, in the former method of transfer molding resin using a lead frame, the lead frame must be processed into a complicated pattern including a dam frame to prevent the resin from flowing out, which increases costs. I can't do it.

Next, in the latter method of applying resin, it is necessary to apply the resin over a wide area in order to completely cover the semiconductor element, resulting in a reduction in packaging density.

The present invention has been made in response to the above-mentioned problems, and it is an object of the present invention to provide a method for mounting semiconductor elements that avoids an increase in cost and a decrease in packaging density. be.

[0009]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a semiconductor device mounting method in which a semiconductor device connected to a substrate is sealed with an ultraviolet curing resin. applying ultraviolet curable resin so as to cover the periphery, irradiating ultraviolet rays only to the outer periphery to partially cure the ultraviolet curable resin, and then applying ultraviolet rays to at least the inner periphery. The method is characterized by including a step of curing the entire ultraviolet curable resin by irradiating the resin.

0010

[Operation] First, while applying ultraviolet curable resin to cover the outer and inner periphery of the semiconductor element, only the outer periphery is irradiated with ultraviolet rays, so that only the ultraviolet curable resin in this area is partially cured. do. Next, by irradiating at least the inner peripheral portion with ultraviolet rays, the remaining portion of the ultraviolet curable resin is cured, and as a result, the entire ultraviolet curable resin is cured. This eliminates the need for a lead frame with a complicated pattern, thereby avoiding an increase in cost, and since the ultraviolet curable resin is applied over a minimum area, it is possible to prevent a decrease in packaging density.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to the drawings.

FIGS. 1 to 3 are cross-sectional views illustrating the method of mounting a semiconductor element according to the present invention in the order of steps.
An example using a C chip is shown.

As shown in FIG. 1, after a semiconductor element 2 (IC chip) is connected to a substrate 1 on which desired wiring is provided, gold is connected between the electrode 2A on the semiconductor element 2 and the wiring on the substrate 1. Bonding is performed using a wire 3 such as a wire.

Subsequently, as shown in FIG. 2, while applying the ultraviolet curing resin 5 to cover the outer circumferential portion S2 and the inner circumferential portion S1 of the semiconductor element 2, only the outer circumferential portion S2 is irradiated with ultraviolet rays 4. As a result, only the ultraviolet curing resin 5A corresponding to the outer peripheral portion S2 is partially cured.

In this case, as a resin coating device for irradiating ultraviolet rays while coating the ultraviolet curable resin 5, an apparatus having a configuration as shown in FIGS. 4 and 5, or FIG. 6 can be used.

FIGS. 4 and 5 are a side view and a plan view showing the first resin coating device 7, and this first resin coating device 7 includes:
A cylindrical support 8, a ring-shaped lens 9 that is supported on the bottom surface 8A of the annular space of the cylindrical support 8 and focuses on the outer circumferential surface S2, and A plurality of ultraviolet lamps 10 are supported along the line, and a resin dispenser 12 is disposed within the central hole 11 of the cylindrical support 8.
It is composed of.

The resin dispenser 12 also includes a supply pipe 13 connected to a resin supply source, a storage section 14 for storing the supplied resin, and a nozzle section 15 for discharging the resin.

Using the first resin applicator 7 having such a configuration, the resin dispenser 12 is installed as shown in FIGS. 4 and 5.
With the nozzle part 15 located directly above the substantially central part of the semiconductor element 2, the nozzle part 1 is moved by a drive part (not shown).
The resin is discharged from 5 and applied to the outer circumferential portion S2 and inner circumferential portion S1 of the semiconductor element 2. At the same time, the plurality of ultraviolet lamps 10 are turned on by a drive circuit (not shown) to irradiate the outer circumference S2 with ultraviolet rays. As a result, as described above, only the ultraviolet curable resin 5A corresponding to this outer peripheral portion S2 can be cured.

FIG. 6 is a perspective view showing the second resin coating device 17, which includes a motor 18,
A disc-shaped support 20 rotatable by the motor 18 via a gear 19, and a central hole 2 of the disc-shaped support 20.
1, and a cylindrical support 23 which is connected to an optical fiber 22 that passes through the disc-shaped support 20 and is rotatable together with the disc-shaped support 20.

Further, a lens 24 is supported at the middle part of the cylindrical support 23 and focuses on one end 22A of the optical fiber 22 at the bottom 23A, and an ultraviolet lamp 10 is supported at the upper part 23B of the cylindrical support 23. It consists of

Second resin coating device 17 configured as above
As shown in FIG. 6, with the nozzle part 15 of the resin dispenser 12 positioned directly above the substantially central part of the semiconductor element 2, the resin is discharged from the nozzle part 15 by a drive part (not shown) to remove the semiconductor element. Coat the outer peripheral part S2 and inner peripheral part S1 of No. 2. At the same time, the ultraviolet lamp 10 is turned on by a drive circuit (not shown) to irradiate the outer peripheral portion S2 with ultraviolet rays 4 from the other end 22B of the optical fiber 22. Furthermore, at the same time, the disc-shaped support 20 is rotated by the motor 18 via the gear 19.

[0022] Thereby, as in the case of the first resin coating device 7, only the ultraviolet curing resin 5A corresponding to the outer peripheral portion S2 can be cured from the optical fiber 22.

Next, as shown in FIG. 3 following FIG. 2,
Ultraviolet rays 4 are applied to the entire surface of the ultraviolet curing resin 5 as shown by the arrow.
irradiate. As a result, the entire surface including at least the inner peripheral portion S1 is irradiated with ultraviolet rays, and as a result, the entire ultraviolet curable resin 5 is cured. Thus, the sealing of the semiconductor element 2 is completed.

According to this embodiment, first, only the outer circumferential portion of the semiconductor element is irradiated with ultraviolet rays to partially cure the ultraviolet curing resin 5, and then the entire surface including the remaining inner circumferential portion S1 is irradiated with ultraviolet rays. Since the curing process is carried out in two stages such that the entire ultraviolet curing resin 5 is cured by irradiating it with ultraviolet rays, a lead frame with a complicated pattern is not required, thereby avoiding an increase in cost. Can be done.

Further, after the ultraviolet curing resin 5 on the outer peripheral part of the semiconductor element 2 is cured, by curing the ultraviolet curing resin 5 on the inner circumferential part S1 in this cured part, the outside of the outer peripheral part S2 that has been cured previously can be cured. Since the ultraviolet curing resin 5 does not spread, the ultraviolet curing resin 5 can be applied to the minimum area.
A decrease in packaging density can be prevented.

[0026]Although the embodiments in this text have been explained using an IC chip as the semiconductor element 2, the same applies to other semiconductor elements as long as they are not limited to ICs but are intended for resin sealing. Can be applied.

[0027]

As described above, according to the present invention, the outer circumferential portion of the ultraviolet curing resin for sealing the semiconductor element is first cured, and then the inner circumferential portion is cured, thereby reducing cost. At the same time, it is possible to prevent the packaging density from decreasing.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing one step of the semiconductor device mounting method of the present invention.

FIG. 2 is a cross-sectional view showing another step of the semiconductor device mounting method of the present invention.

FIG. 3 is a cross-sectional view showing other steps of the semiconductor device mounting method of the present invention.

FIG. 4 is a side view showing a first resin coating device used for implementing the present invention.

FIG. 5 is a plan view showing a first resin coating device used for implementing the present invention.

FIG. 6 is a perspective view showing a second resin coating device used for implementing the present invention.

[Explanation of symbols]

2 Semiconductor element 4 Ultraviolet rays 5 Ultraviolet curing resin 7 First resin coating device 9, 24 Lens 10 Ultraviolet lamp 12 Resin dispenser 17 Second resin coating device 20 Disk-shaped support 22 Optical fiber

Claims (1)

[Claims] 1. A method for mounting a semiconductor element in which a semiconductor element connected to a substrate is sealed with an ultraviolet curable resin, in which the ultraviolet curable resin is applied so as to cover an outer peripheral part and an inner peripheral part of the semiconductor element; The method includes a step of partially curing the ultraviolet curable resin by irradiating only the outer periphery with ultraviolet rays, and a step of irradiating at least the inner periphery of the ultraviolet curable resin with ultraviolet rays to cure the entire ultraviolet curable resin. A method for mounting a semiconductor element, characterized by: