JPH10189931A - Method and system for manufacturing solid-state image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image sensor superior in the quality of exter nal view of package and the image characteristic. SOLUTION: A UV-curing adhesive 7 is applied to a seal part 6 located at the circumferential fringe of a package 1, containing a chip 2 and a gap 13 is made in the adhesive 7 at least one position thereof before a glass is mounted on the package 1 and bonded to the seal part 6. An optical fiber for irradiating UV-rays is arranged on two opposite sides of the seal part 6 which is then cured entirely on four sides thereof, by varying the curing position of the optical fiber. Consequently, the gap 13 serves as a passage for releasing an internal pressure, generated when the gap 13 spreads the adhesive 7 while mounting the glass, to the outside of the package 1 and the gap is closed under a state in which the pressure is balanced on the inside and the outside of the package 1. Furthermore, only the seal part 6 can be irradiated with UV-rays and spectral characteristics of a desired color filter can be obtained by eliminating the effect of UV-rays on an organic film 3 placed on the chip 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for manufacturing a solid-state imaging device.

[0002]

2. Description of the Related Art In a package structure of a solid-state imaging device, a container for housing a stable light to reach a device is hollow, and a transparent glass plate is used for a lid thereof. As for the adhesion between the container and the lid, a highly airtight method is required to protect the device from the external environment.

[0003] Therefore, as a method of fixing the lid to the container, there are a method of heat curing using a thermosetting adhesive, a method using an ultraviolet curing adhesive, and the like. Among them, a method using an ultraviolet-curable adhesive will be described with reference to FIGS. FIG. 11 is a perspective view of a solid-state imaging device to which a sealing adhesive has been applied. The solid-state imaging device 31
The chip 2 is housed in a preformed plastic or ceramic container 1. On the surface of chip 2,
An organic film 3 for color reproduction is formed. The organic film 3 is a color filter in which a photoresist is formed in a predetermined pattern on the upper surface of the filter and further dyed in a predetermined color. The electrical connection between the chip 2 and the container 1 is made by a metal wire 4
And guided outside through the lead frame 5. At the time of sealing, a UV curable adhesive 7 is applied around the seal portion 6 of the container by a dispenser 8.

Next, a method of bonding glass will be described with reference to the explanatory view of FIG. Container 1 coated with adhesive 7
The glass 9 is placed on top of the. In this case, the glass 9 is pressed by the cylinder 10 to uniformly spread the adhesive 7.
Finally, the method of curing the adhesive will be described with reference to the perspective view of FIG. A light guide 35 in which the optical fiber 16 is inserted from the lamp light source 14 is installed on the upper part of the solid-state imaging device 31 to which the glass 9 is adhered, and the adhesive 7 is cured by the ultraviolet light irradiated through the optical fiber 16. The end face of the light guide 35 used here is in a state where the optical fibers 16 are bundled as shown in FIG.

[0005]

However, in the above-mentioned conventional manufacturing method, when the glass 9 is placed and pressed in order to apply the adhesive 7 to the sealing portion 6 of the container 1 once, the container 1
There is a disadvantage that the adhesive 7 is pushed out from the inside to the outside by the action of the inside air being compressed and going out of the bonding surface, and the bonding surface is distorted.

When the surface of the chip 2 is irradiated with an ultraviolet ray for curing the adhesive 7, the color of the organic film 3 for color reproduction formed on the chip 2 is faded and deteriorated, and a desired color filter is separated. Characteristics were not obtained, which was a serious problem in practical use.
Further, since the step of holding down the glass 9 and the step of curing the adhesive 7 by irradiating ultraviolet rays are separated, there is a disadvantage that the number of steps is increased.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method and an apparatus for manufacturing a low-cost solid-state imaging device which solves the above-mentioned conventional problems and has excellent sealing appearance quality and image characteristics. .

[0008]

According to a first aspect of the present invention, there is provided a method of manufacturing a solid-state imaging device, comprising: applying an ultraviolet-curable adhesive to a seal located at a peripheral edge of a package containing a chip; In addition to applying the adhesive, a gap is provided in at least one place of the adhesive, and glass is placed on the package and adhered to the seal portion.

As described above, when the adhesive is applied to the seal portion of the package, at least one gap is provided, and the gap is formed when the adhesive is stretched while placing and holding the glass. It becomes a path for releasing the pressure to the outside of the package, and the adhesive is uniformly spread, and is closed in a state where the pressure inside and outside the package is balanced.

According to a second aspect of the present invention, there is provided a method for manufacturing a solid-state imaging device, wherein an ultraviolet-curing adhesive is applied to a seal located at a periphery of a package containing a chip having a color filter on its surface, and glass is applied to the package. It is placed and adhered to the seal portion, and optical fibers for irradiating ultraviolet rays are arranged on two opposite sides of the seal portion, and by changing the curing position by the optical fiber, the entire four sides of the seal portion are cured. It is characterized by the following.

As described above, when the adhesive is cured with ultraviolet rays, the optical fibers for irradiating ultraviolet rays are arranged on the two opposing sides of the seal portion, and the curing position by the optical fibers is changed, whereby the sealing is performed. Since the entire four sides of the part are cured, it is possible to irradiate only the seal part with ultraviolet light, and it is possible to eliminate the influence of the ultraviolet light which the organic film formed on the chip receives, and to obtain the desired spectral characteristics of the color filter. Characteristics are obtained. Further, after curing the two opposing sides of the seal portion with the optical fiber, the curing position of the optical fiber is changed and the remaining two sides are cured, so that the adhesive can be cured in two steps.

According to a third aspect of the present invention, there is provided a method of manufacturing a solid-state imaging device, wherein an ultraviolet-curing adhesive is applied to a seal located at a periphery of a package containing a chip having a color filter on its surface, and glass is applied to the package. It is mounted and adhered to a seal portion, and an optical fiber for irradiating ultraviolet rays is arranged in the shape of a well or a mouth on the seal portion, and the entire seal portion is cured.

As described above, when curing the adhesive, optical fibers for irradiating ultraviolet rays are arranged in the shape of a well or a square on the seal portion, and the entire seal portion is cured.
The curing of the adhesive can be performed in one step, and the ultraviolet rays can be applied only to the seal portion, as in the second aspect, and the influence of the ultraviolet rays on the organic film formed on the chip can be eliminated. Can be.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a solid-state imaging device, wherein an ultraviolet-curing adhesive is applied to a seal located at a peripheral edge of a package in which a chip having a color filter on its surface is housed, and is mounted on the package. At the same time, the glass is pressed down and adhered to the seal portion, and at the same time, an optical fiber for ultraviolet irradiation is arranged on the seal portion to cure the entire seal portion.

As described above, the glass placed on the package is pressed down and adhered to the seal portion, and at the same time, the optical fibers for ultraviolet irradiation are arranged on the seal portion and the entire seal portion is cured. In the same manner as described above, it is possible to irradiate only the seal portion with ultraviolet rays, thereby eliminating the influence of the ultraviolet rays on the organic film formed on the chip, and holding down the glass and curing the adhesive in one step. It can be carried out.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a solid-state imaging device, wherein an ultraviolet-curing adhesive is applied to a seal portion located at a peripheral edge of a package containing a chip having a color filter on its surface, and glass is applied to the package. It is put on and adhered to the seal part.On this seal part, optical fibers for ultraviolet irradiation are arranged in the shape of a mouth, and optical fibers for ultraviolet irradiation are arranged in spot form outside each corner of the mouth. , Characterized in that the entire surface of the seal portion is cured.

As described above, when the adhesive is cured with ultraviolet rays, optical fibers for irradiating ultraviolet rays are arranged in the shape of a mouth on the seal portion, and spots are formed outside the corners of the mouth to irradiate the ultraviolet rays. By arranging the optical fibers, the entire surface of the seal portion is cured, so that the curing of the adhesive can be performed in one step, and the curing of the adhesive at the corner portion of the seal portion can be further improved by the optical fibers arranged in a spot shape. I can do it for sure.
Further, similarly to the second aspect, it is possible to irradiate only the seal portion with the ultraviolet ray, and it is possible to eliminate the influence of the ultraviolet ray on the organic film formed on the chip.

According to a sixth aspect of the present invention, there is provided an apparatus for manufacturing a solid-state image pickup device, wherein an ultraviolet-curing adhesive is applied with a dispenser to a seal located at a peripheral edge of a package in which a chip having a color filter on its surface is accommodated. An apparatus for manufacturing a solid-state imaging device in which glass is adhered to a seal portion and a light guide for ultraviolet irradiation is arranged on a package to cure the adhesive, and an optical fiber in the light guide is used. It is characterized by being arranged so as to correspond to the seal portion.

As described above, since the optical fibers in the light guide are arranged so as to correspond to the seal portion, it is possible to irradiate only the seal portion with ultraviolet rays, and the organic film formed on the chip receives the ultraviolet light. It is possible to eliminate the influence of ultraviolet rays, and to obtain a desired spectral characteristic of the color filter. According to a seventh aspect of the present invention, in the manufacturing apparatus of the sixth aspect, the light guide has an inclined pressing surface formed on an end face for pressing a peripheral portion of the glass.
As described above, since the inclined pressing surface for pressing the peripheral portion of the glass is formed on the end surface of the light guide, the pressing of the glass and the curing of the adhesive similar to the sixth aspect can be performed in one step.

According to an eighth aspect of the present invention, in the apparatus for manufacturing a solid-state imaging device according to the sixth aspect, the optical fibers in the light guide are arranged in the shape of a mouth, and are arranged in the form of spots outside the corners of the mouth. I have. As described above, since the optical fibers in the light guide are arranged in the shape of a mouth and arranged in a spot shape outside each corner of the mouth, it is possible to irradiate only the seal portion with ultraviolet rays as in claim 6. And curing of the adhesive can be performed in one step. Moreover, the curing of the adhesive at the corners of the seal portion can be more reliably achieved by the optical fibers arranged in a spot shape.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a method for manufacturing a solid-state imaging device according to a first embodiment of the present invention, and FIG. 2 is a perspective view showing a phenomenon in which an internal pressure of a package is increased and an adhesive is pushed from inside to outside. FIG. In the solid-state imaging device 21, an ultraviolet-curing adhesive 7 is applied to a seal portion 6 located on a peripheral edge of the package 1 in which the chip 2 is stored, and the package 1 and the glass 9 are adhered by the adhesive 7. The package 1 is preformed in a square or a rectangle with plastic or ceramic. An organic film (color filter) 3 for color reproduction is formed on the surface of the chip 2. The organic film 3 is a color filter in which a photoresist is formed in a predetermined pattern on the upper surface of the filter and further dyed in a predetermined color. When the organic film 3 is irradiated with an ultraviolet ray for curing the adhesive 7, the color fades and the desired spectral characteristics of the color filter cannot be obtained. The electrical connection between chip 2 and package 1 is
It is performed by the metal wire 4 and is guided to the outside through the lead frame 5.

Next, a method of manufacturing the solid-state imaging device will be described. As shown in FIG. 1, an adhesive 7 is applied to a seal portion 6 of the package 1 using a dispenser 8. At this time, the dispenser 8 is moved over the entire circumference of the seal portion 6 to apply the coating. However, the coating is started without leaving a gap 13 of about 0.5 to 1.0 mm without completely connecting the starting point 11 and the ending point 12 of the coating. Terminate. Next, the glass 9 is placed on the package 1 and adhered to the seal portion 6, and the glass 9 is pressed by the cylinder 10 in order to uniformly spread the adhesive 7 (FIG. 11). As a result, the gap 13 eventually disappears and becomes completely sealed. Here, if the gap 13 is not provided, as shown in FIG. 2, a phenomenon occurs in which the internal pressure of the package 1 increases and the adhesive 7 is pushed out from the inside to the outside. And the seal portion 6 of the package 1 is not wrapped around. That is, the gap A is formed without the adhesive 7 being continuous. However, in this manufacturing method, since the gap 13 is provided, the phenomenon due to the internal pressure of the package 1 can be suppressed, and the gap A is not formed.

From the state where the glass 9 is placed on the package 1 by the above method and the adhesive 7 is uniformly extended, the light guide 15 extended from the ultraviolet lamp light source 14 is attached to the package 1 as shown in FIG. Placed on top and the adhesive 7 is cured. In this case, as shown in FIG.
The optical fibers 16 inserted into the distal end portion 5 are arranged in parallel on two opposing sides of the seal portion 6. When ultraviolet rays are irradiated from the optical fiber 16, curing proceeds on two opposing sides of the seal portion 6. The above is the first curing step. Next, as for the remaining two sides, as shown in FIG.
By irradiating ultraviolet rays from the optical fiber 16 which is arranged 90 ° reversed from the other side, curing proceeds on the remaining two sides, and curing of the entire surface of the seal portion 6 is completed. The above is the second curing step. In the first and second steps, the same light guide 15 may be used by inverting the distal end portion, or different light guides 15 having different arrangements of the optical fibers 16 may be used.

According to this embodiment, since the gap 13 is provided when the adhesive 7 is applied to the seal portion 6 of the package 1, the gap 13 is placed on the glass 9 and pressed down while the adhesive 7 is applied. This is a path through which the internal pressure generated during the expansion is released to the outside of the package 1, and the adhesive 7 is uniformly expanded and closed in a state where the pressure inside and outside the package 1 is balanced. It is sufficient that the gap 13 is provided in at least one place.

When the adhesive 7 is cured with ultraviolet light,
By arranging optical fibers for irradiating ultraviolet rays on two opposing sides of the seal portion 6 and changing the curing position by the optical fibers 16, the entire four sides of the seal portion 6 are cured. 6 can be irradiated, and the effect of ultraviolet rays on the organic film 3 formed on the chip 2 can be eliminated, and a desired spectral characteristic of the color filter can be obtained. Further, in this case, after curing the two opposing sides of the seal portion 6 with the optical fiber 16, the curing position of the optical fiber 16 is changed and the remaining two sides are cured, so that the adhesive 7 is cured in two steps. it can.

A second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a plan view showing an arrangement of optical fibers on an end face of a light guide used in a method for manufacturing a solid-state imaging device according to a second embodiment of the present invention. The optical fiber 16 inserted into the tip of the light guide 22
It is arranged in the shape of a mouth on the seal portion of the package.

Regarding the method of manufacturing this solid-state imaging device,
As in the first embodiment, the light guide 22 is placed right above the package 1 from a state where the glass is placed on the package and the adhesive is uniformly stretched. The optical fiber 16 at the tip is disposed in a shape of a mouth on the seal portion, and irradiates at a fixed distance. Other configurations are the same as those of the first embodiment.

According to this embodiment, when curing the adhesive, the optical fibers 16 for irradiating ultraviolet rays are arranged in a square shape on the seal portion, and the entire surface of the seal portion is cured. Can be performed in one step, and similarly to the first embodiment, it is possible to irradiate only the seal portion with ultraviolet rays, thereby eliminating the influence of the ultraviolet rays on the organic film formed on the chip. be able to.

A third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a plan view showing an arrangement of optical fibers on an end face of a light guide used in a method of manufacturing a solid-state imaging device according to a third embodiment of the present invention. The optical fiber 16 inserted into the tip of the light guide 23
It is arranged in the shape of a well above the seal of the package.

Regarding the method of manufacturing this solid-state imaging device,
As in the first embodiment, the light guide 23 is placed right above the package 1 from a state where the glass is placed on the package and the adhesive is uniformly stretched. The optical fiber 16 at the tip is arranged in a well shape on the seal portion, and irradiates at a fixed distance. In this case, the optical fiber 16 has a shape extending crosswise at the corner 19. With this method, the illuminance of the corner 19 can be reinforced and the curing of the adhesive can be stabilized. Other configuration effects are the same as those of the second embodiment.

A fourth embodiment of the present invention will be described with reference to FIGS. FIG. 8 is an explanatory diagram showing a use state of a light guide used in a method for manufacturing a solid-state imaging device according to a fourth embodiment of the present invention. The light guide 20 has a structure that also serves as a glass holder,
An inclined pressing surface 25 is formed on the end surface for holding the peripheral portion of the holding member. Therefore, the end face has a pyramid shape.
As shown in FIG. 9, the optical fibers 16 inserted into the light guide 20 are arranged on the seal portion 6 of the package 1 in the shape of a square.

The method of manufacturing this solid-state imaging device is described below.
In a state where the glass 9 is placed on the package 1 as in the first embodiment, the glass 9 is pressed by the light guide 20 and adhered to the seal portion 6, and at the same time, the optical fiber 16 is placed on the seal portion 6 in this state. It is arranged in the shape of a mouth and irradiates at a certain distance. Other configurations are the same as those of the first embodiment.

According to this embodiment, the glass 9 is placed on the package 1 and adhered to the seal portion 6, and at the same time, the optical fibers 16 for ultraviolet irradiation are arranged on the seal portion 6, and Since the entire surface is cured, similarly to the first embodiment, it is possible to irradiate only the sealing portion 6 with ultraviolet rays, and it is possible to eliminate the influence of the ultraviolet rays on the organic film formed on the chip. The pressing of the glass 9 and the curing of the adhesive can be performed in one step. For this reason, the number of steps is reduced and productivity is improved.

A fifth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a plan view showing an arrangement of optical fibers on an end face of a light guide used in a method of manufacturing a solid-state imaging device according to a fifth embodiment of the present invention. The optical fiber 16 inserted into the tip of the light guide 26
Are arranged in a mouth shape on the seal part of the package,
Further, spots are arranged outside each corner of the mouth. In the figure, 16a indicates a mouth-shaped portion, and 16b indicates a spot-shaped portion.

Regarding the method of manufacturing this solid-state imaging device,
As in the first embodiment, the glass is placed on the package, and the light guide 26 is arranged right above the package from the state where the adhesive is uniformly stretched. Optical fiber 1 at the tip
Numerals 6 are arranged in the shape of a mouth on the seal portion, and are arranged in the form of spots outside the corners of the mouth, and irradiate at a fixed distance. Other configurations are the same as those of the first embodiment.

According to this embodiment, when curing the adhesive, the optical fibers 16a for irradiating the ultraviolet rays are arranged in a square shape on the seal portion, and further, spot-shaped outside each corner of the square shape. Since the optical fibers 16b for ultraviolet irradiation are arranged and the entire surface of the seal is cured, the adhesive at the corners of the seal can be more reliably cured, and the entire surface of the seal can be uniformly cured.

Further, the curing of the adhesive can be performed in one step, and the first
As in the case of the first embodiment, it is possible to irradiate only the seal portion with ultraviolet rays, and it is possible to eliminate the influence of the ultraviolet rays on the organic film formed on the chip.

[0038]

According to the method of manufacturing a solid-state imaging device according to the first aspect of the present invention, at least one gap is provided when the adhesive is applied to the seal portion of the package. A path through which the internal pressure generated when the adhesive is stretched while placing and holding the glass is released to the outside of the package. The adhesive is uniformly stretched and closed in a state where the pressure inside and outside the package is balanced. Along with this, the phenomenon that the internal pressure of the package increases and the adhesive is spread from the inside to the outside can be suppressed, and the bonding surface becomes uniform.

According to the method of manufacturing a solid-state imaging device according to the second aspect of the present invention, when the adhesive is cured with ultraviolet rays, the optical fibers for irradiating ultraviolet rays are arranged on two opposing sides of the seal portion. By changing the curing position of the optical fiber, the entire four sides of the sealing portion are cured, so that only the sealing portion can be irradiated with ultraviolet light, and the influence of the ultraviolet light on the organic film formed on the chip can be obtained. Can be eliminated, and a desired spectral characteristic of the color filter can be obtained. Further, after curing the two opposing sides of the seal portion with the optical fiber, the curing position of the optical fiber is changed and the remaining two sides are cured, so that the adhesive can be cured in two steps.

According to the method of manufacturing a solid-state imaging device according to the third aspect of the present invention, when curing the adhesive, optical fibers for irradiating ultraviolet rays are arranged in a shape of a well or a mouth on the seal portion. Then, the entire surface of the seal portion is cured, so that the adhesive can be cured in one step.
It is possible to irradiate only the seal portion with ultraviolet rays, and it is possible to eliminate the influence of the ultraviolet rays on the organic film formed on the chip.

According to the method of manufacturing a solid-state imaging device according to the fourth aspect of the present invention, the glass placed on the package is pressed down and adhered to the seal portion, and at the same time, the optical fibers for ultraviolet irradiation are arranged on the seal portion. Then, since the entire surface of the seal portion is cured, it is possible to irradiate only the seal portion with ultraviolet light, similarly to the second aspect, and it is possible to eliminate the influence of the ultraviolet light on the organic film formed on the chip. At the same time, the pressing of the glass and the curing of the adhesive can be performed in one step. For this reason, the number of steps is reduced and productivity is improved.

According to the method of manufacturing a solid-state imaging device according to the fifth aspect of the present invention, when the adhesive is cured with ultraviolet rays, optical fibers for irradiating ultraviolet rays are arranged in a square shape on the seal portion. In addition, by arranging optical fibers for ultraviolet irradiation in the form of spots outside each corner of the mouth, the entire surface of the seal portion is cured, so that the adhesive can be cured in one step.
Moreover, the curing of the adhesive at the corners of the seal portion can be more reliably achieved by the optical fibers arranged in a spot shape. Also,
As in the case of the second aspect, it is possible to irradiate only the seal portion with ultraviolet rays, and it is possible to eliminate the influence of the ultraviolet rays on the organic film formed on the chip.

According to the apparatus for manufacturing a solid-state imaging device according to the sixth aspect of the present invention, since the optical fibers in the light guide are arranged so as to correspond to the seal portion, the ultraviolet rays are applied only to the seal portion. This makes it possible to eliminate the influence of ultraviolet rays on the organic film formed on the chip, and obtain a desired spectral characteristic of the color filter.

According to a seventh aspect of the present invention, the inclined pressing surface for pressing the peripheral portion of the glass is formed on the end face of the light guide, so that the pressing of the glass and the curing of the adhesive similar to the sixth aspect are performed. It can be performed in one step. In the eighth aspect, the optical fibers in the light guide are arranged in the shape of a mouth and in the form of a spot outside each corner of the mouth, so that the ultraviolet rays are sealed as in the sixth aspect. It is possible to irradiate only the part and to cure the adhesive in one step. Also,
The optical fibers arranged in a spot form can more reliably cure the adhesive at the corner of the seal.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state in which an adhesive is applied in a method for manufacturing a solid-state imaging device according to a first embodiment of the present invention;

FIG. 2 is a perspective view of a phenomenon in which an internal pressure of a package is increased and an adhesive is pushed from inside to outside.

FIG. 3 is a perspective view showing a state in which an adhesive is cured by the method for manufacturing the solid-state imaging device according to the first embodiment of the present invention;

FIG. 4 is a plan view showing an optical fiber arrangement on an end face of a light guide in a first curing step in the first embodiment of the present invention.

FIG. 5 is a plan view showing an arrangement of optical fibers on a light guide end face in a second curing step in the first embodiment of the present invention.

FIG. 6 is a plan view showing an optical fiber arrangement on a light guide end face in a method for manufacturing a solid-state imaging device according to a second embodiment of the present invention.

FIG. 7 is a plan view showing an optical fiber arrangement on a light guide end face in a method for manufacturing a solid-state imaging device according to a third embodiment of the present invention.

FIG. 8 is an explanatory diagram showing a use state of a light guide that also serves as a glass holder in a method for manufacturing a solid-state imaging device according to a fourth embodiment of the present invention.

FIG. 9 is a plan view of a light guide end face in a method for manufacturing a solid-state imaging device according to a fourth embodiment of the present invention.

FIG. 10 is a plan view showing an optical fiber arrangement on an end face of a light guide in a method for manufacturing a solid-state imaging device according to a fifth embodiment of the present invention.

FIG. 11 is a perspective view of a solid-state imaging device to which an adhesive is applied in a conventional manufacturing method.

FIG. 12 is an explanatory view of a method of bonding glass in a conventional manufacturing method.

FIG. 13 is a perspective view showing a state in which an adhesive is cured in a conventional manufacturing method.

FIG. 14 is a plan view of a light guide end face in a conventional manufacturing method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package 2 Chip 3 Organic film (color filter) 4 Metal wire 5 Lead frame 6 Seal part 7 Adhesive 8 Dispenser 9 Glass 10 Cylinder 11 Application start point 12 Application end point 13 Application gap 14 Lamp light source 15 Light guide 16 Optical fiber 19 corner 20 light guide 21 solid-state imaging device

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Junichi Kanno 1-1, Sachimachi, Takatsuki-shi, Osaka Prefecture Matsushita Electronics Industrial Co., Ltd. (72) Inventor Shogai 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Industry Co., Ltd.

Claims (8)

[Claims] 1. An ultraviolet-curable adhesive is applied to a seal located at a peripheral edge of a package in which a chip is stored, and a gap is provided in at least one place of the adhesive.
A method for manufacturing a solid-state imaging device, comprising placing glass on the package and bonding the glass to the seal portion. 2. An ultraviolet-curable adhesive is applied to a seal portion located at a peripheral edge of a package containing a chip having a color filter on its surface, and glass is placed on the package and adhered to the seal portion. An optical fiber for irradiating ultraviolet rays is arranged on two opposing sides of the seal portion, and by changing a curing position by the optical fiber, the entire four sides of the seal portion are cured. Production method. 3. An ultraviolet-curable adhesive is applied to a seal located at a peripheral edge of a package in which a chip having a color filter on its surface is accommodated, and glass is placed on the package and adhered to the seal. A method for manufacturing a solid-state imaging device, comprising: arranging optical fibers for ultraviolet irradiation in a cross-shaped shape on a seal portion and curing the entire surface of the seal portion. 4. An ultraviolet-curable adhesive is applied to a seal located at a peripheral edge of a package in which a chip having a color filter on its surface is housed, and the glass placed on the package is pressed down and adhered to the seal. At the same time, an optical fiber for irradiating ultraviolet rays is arranged on the seal portion, and the entire surface of the seal portion is cured. 5. An ultraviolet-curable adhesive is applied to a seal located at a peripheral edge of a package in which a chip having a color filter on its surface is accommodated, and glass is placed on the package and adhered to the seal. By arranging optical fibers for UV irradiation in the shape of a mouth on the seal part, and arranging optical fibers for UV irradiation in the form of spots outside each corner of the mouth, it is possible to cure the entire surface of the seal part. A method for manufacturing a solid-state imaging device. 6. An ultraviolet curable adhesive is applied by a dispenser to a seal portion located at a peripheral edge of a package in which a chip having a color filter on its surface is stored, and glass is placed on the package and adhered to the seal portion. An apparatus for manufacturing a solid-state imaging device in which a light guide for ultraviolet irradiation is arranged on the package to cure the adhesive, wherein an optical fiber in the light guide corresponds to the seal portion. The manufacturing apparatus of the solid-state imaging device characterized by being arranged as follows. 7. An apparatus for manufacturing a solid-state imaging device according to claim 6, wherein the light guide has an inclined pressing surface formed on an end face for pressing a peripheral portion of the glass. 8. The solid-state imaging device manufacturing apparatus according to claim 6, wherein the optical fibers in the light guide are arranged in a square shape, and are arranged in a spot shape outside each corner of the mouth shape.