JPH0436600B2 - - Google Patents
Info
- Publication number
- JPH0436600B2 JPH0436600B2 JP8541184A JP8541184A JPH0436600B2 JP H0436600 B2 JPH0436600 B2 JP H0436600B2 JP 8541184 A JP8541184 A JP 8541184A JP 8541184 A JP8541184 A JP 8541184A JP H0436600 B2 JPH0436600 B2 JP H0436600B2
- Authority
- JP
- Japan
- Prior art keywords
- resin adhesive
- circuit board
- conductive resin
- electronic component
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 description 40
- 239000011347 resin Substances 0.000 description 40
- 239000000853 adhesive Substances 0.000 description 39
- 230000001070 adhesive effect Effects 0.000 description 39
- 239000004020 conductor Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 230000002950 deficient Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- -1 trichlene Chemical compound 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8541184A JPS60229397A (ja) | 1984-04-26 | 1984-04-26 | 電子部品装着方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8541184A JPS60229397A (ja) | 1984-04-26 | 1984-04-26 | 電子部品装着方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60229397A JPS60229397A (ja) | 1985-11-14 |
| JPH0436600B2 true JPH0436600B2 (enrdf_load_html_response) | 1992-06-16 |
Family
ID=13858059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8541184A Granted JPS60229397A (ja) | 1984-04-26 | 1984-04-26 | 電子部品装着方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60229397A (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010108589A (ja) * | 2008-10-03 | 2010-05-13 | Nhk Spring Co Ltd | ヘッドサスペンション、及びヘッドサスペンションの製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63273393A (ja) * | 1987-04-30 | 1988-11-10 | Nec Corp | 混成集積回路装置 |
-
1984
- 1984-04-26 JP JP8541184A patent/JPS60229397A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010108589A (ja) * | 2008-10-03 | 2010-05-13 | Nhk Spring Co Ltd | ヘッドサスペンション、及びヘッドサスペンションの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60229397A (ja) | 1985-11-14 |
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