JPH0436250U - - Google Patents

Info

Publication number
JPH0436250U
JPH0436250U JP7838090U JP7838090U JPH0436250U JP H0436250 U JPH0436250 U JP H0436250U JP 7838090 U JP7838090 U JP 7838090U JP 7838090 U JP7838090 U JP 7838090U JP H0436250 U JPH0436250 U JP H0436250U
Authority
JP
Japan
Prior art keywords
package
weight
external lead
lead terminals
insulating container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7838090U
Other languages
Japanese (ja)
Other versions
JP2517203Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7838090U priority Critical patent/JP2517203Y2/en
Publication of JPH0436250U publication Critical patent/JPH0436250U/ja
Application granted granted Critical
Publication of JP2517203Y2 publication Critical patent/JP2517203Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第2図は第1図
に示すパツケージの絶縁基体の斜視図、第3図は
第2図に示すパツケージの外部リード端子と絶縁
枠体の連結状態を説明するための部分拡大断面図
、第4図は従来の半導体素子収納用パツケージの
断面図、第5図は第4図のパツケージの絶縁基体
の平面図である。 1……絶縁基体、2……蓋体、3……絶縁容器
、7……外部リード端子、8……絶縁枠体、9…
…ガラス部材。
FIG. 1 is a sectional view showing an embodiment of the package for housing semiconductor elements according to the present invention, FIG. 2 is a perspective view of the insulating base of the package shown in FIG. 1, and FIG. 3 is a cross-sectional view of the package shown in FIG. 2. 4 is a sectional view of a conventional package for storing semiconductor elements; FIG. 5 is a plan view of the insulating base of the package shown in FIG. 4; FIG. It is. DESCRIPTION OF SYMBOLS 1... Insulating base, 2... Lid, 3... Insulating container, 7... External lead terminal, 8... Insulating frame, 9...
...Glass parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁容器の側辺より複数個の外部リード端子が
突出して成る半導体素子収納用パツケージにおい
て、前記絶縁容器の側辺より突出する外部リード
端子の各々が酸化シリコン60.0乃至70.0
重量%、酸化バリウム5.0乃至15.0重量%
、ナトリウムもしくはカリウムの酸化物10.0
乃至20.0重量%から成るガラス部材を介して
絶縁枠体に接着されていることを特徴とする半導
体素子収納用パツケージ。
In a semiconductor element storage package comprising a plurality of external lead terminals protruding from the side of an insulating container, each of the external lead terminals protruding from the side of the insulating container is silicon oxide 60.0 to 70.0.
Weight%, barium oxide 5.0 to 15.0% by weight
, sodium or potassium oxide 10.0
1. A package for housing a semiconductor device, characterized in that the package is bonded to an insulating frame via a glass member made of 20.0% by weight.
JP7838090U 1990-07-24 1990-07-24 Package for storing semiconductor devices Expired - Lifetime JP2517203Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7838090U JP2517203Y2 (en) 1990-07-24 1990-07-24 Package for storing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7838090U JP2517203Y2 (en) 1990-07-24 1990-07-24 Package for storing semiconductor devices

Publications (2)

Publication Number Publication Date
JPH0436250U true JPH0436250U (en) 1992-03-26
JP2517203Y2 JP2517203Y2 (en) 1996-11-20

Family

ID=31621609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7838090U Expired - Lifetime JP2517203Y2 (en) 1990-07-24 1990-07-24 Package for storing semiconductor devices

Country Status (1)

Country Link
JP (1) JP2517203Y2 (en)

Also Published As

Publication number Publication date
JP2517203Y2 (en) 1996-11-20

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term