JPH0436115Y2 - - Google Patents
Info
- Publication number
- JPH0436115Y2 JPH0436115Y2 JP1986154185U JP15418586U JPH0436115Y2 JP H0436115 Y2 JPH0436115 Y2 JP H0436115Y2 JP 1986154185 U JP1986154185 U JP 1986154185U JP 15418586 U JP15418586 U JP 15418586U JP H0436115 Y2 JPH0436115 Y2 JP H0436115Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bumps
- wiring board
- metal bumps
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010931 gold Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 4
- 230000008646 thermal stress Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154185U JPH0436115Y2 (de) | 1986-10-07 | 1986-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154185U JPH0436115Y2 (de) | 1986-10-07 | 1986-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6359326U JPS6359326U (de) | 1988-04-20 |
| JPH0436115Y2 true JPH0436115Y2 (de) | 1992-08-26 |
Family
ID=31073750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986154185U Expired JPH0436115Y2 (de) | 1986-10-07 | 1986-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436115Y2 (de) |
-
1986
- 1986-10-07 JP JP1986154185U patent/JPH0436115Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6359326U (de) | 1988-04-20 |
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