JPH0435859B2 - - Google Patents
Info
- Publication number
- JPH0435859B2 JPH0435859B2 JP58065921A JP6592183A JPH0435859B2 JP H0435859 B2 JPH0435859 B2 JP H0435859B2 JP 58065921 A JP58065921 A JP 58065921A JP 6592183 A JP6592183 A JP 6592183A JP H0435859 B2 JPH0435859 B2 JP H0435859B2
- Authority
- JP
- Japan
- Prior art keywords
- proximity switch
- proximity
- lead frame
- detection coil
- switch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 27
- 230000010355 oscillation Effects 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/945—Proximity switches
- H03K17/95—Proximity switches using a magnetic detector
- H03K17/9505—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
- Electronic Switches (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58065921A JPS59190717A (ja) | 1983-04-13 | 1983-04-13 | 近接スイツチ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58065921A JPS59190717A (ja) | 1983-04-13 | 1983-04-13 | 近接スイツチ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59190717A JPS59190717A (ja) | 1984-10-29 |
JPH0435859B2 true JPH0435859B2 (de) | 1992-06-12 |
Family
ID=13300913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58065921A Granted JPS59190717A (ja) | 1983-04-13 | 1983-04-13 | 近接スイツチ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59190717A (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4437721A1 (de) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
DE19639650A1 (de) * | 1996-09-26 | 1998-04-02 | Sican Gmbh | Integrierte Schaltung mit einem induktiven Bauelement und Verfahren zur Herstellung hierzu |
US5909050A (en) * | 1997-09-15 | 1999-06-01 | Microchip Technology Incorporated | Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor |
US6351033B1 (en) * | 1999-10-06 | 2002-02-26 | Agere Systems Guardian Corp. | Multifunction lead frame and integrated circuit package incorporating the same |
JPWO2006085363A1 (ja) * | 2005-02-09 | 2008-06-26 | 株式会社ルネサステクノロジ | 半導体装置及び電子回路 |
US20060276157A1 (en) * | 2005-06-03 | 2006-12-07 | Chen Zhi N | Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications |
JP5749066B2 (ja) * | 2011-05-02 | 2015-07-15 | 新電元工業株式会社 | インダクタ一体型リードフレーム、並びに、電子回路モジュール及びその製造方法 |
WO2016026476A1 (de) * | 2014-08-22 | 2016-02-25 | Balluff Gmbh | Induktiver näherungssensor in integrierter bauweise |
-
1983
- 1983-04-13 JP JP58065921A patent/JPS59190717A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59190717A (ja) | 1984-10-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6020627A (en) | Chip card and method of manufacturing a chip card | |
JPH04364472A (ja) | 磁電変換装置 | |
JPH0435859B2 (de) | ||
US5353194A (en) | Modular power circuit assembly | |
KR0165135B1 (ko) | 주화검출기 | |
JP2003167009A (ja) | 電流検出装置 | |
JPH05291482A (ja) | 混成集積回路装置及びその製造方法 | |
US4378504A (en) | Proximity switch | |
US6486796B2 (en) | Relative-displacement detecting unit | |
JPH0634391A (ja) | 磁気センサモジュール | |
US6064285A (en) | Printed circuit board helical resonator and filter apparatus | |
JP3350776B2 (ja) | 電流検出器 | |
JPH0435860B2 (de) | ||
JPH0815330A (ja) | 電流検出器 | |
JPH08233864A (ja) | 電気量測定装置 | |
JPS59143230A (ja) | 近接スイツチ | |
JP4532018B2 (ja) | 小型アンテナ及びその製造方法 | |
CN108695285B (zh) | 半导体装置以及电子装置 | |
JPS59190719A (ja) | 近接スイツチ | |
JPH06169211A (ja) | アンテナの装着構造 | |
JPH0720625Y2 (ja) | 磁気抵抗センサ | |
JPH08236356A (ja) | 複合素子 | |
JPH0655971A (ja) | 電子式方向指示器 | |
US4894016A (en) | Electrical connector | |
JPH06201732A (ja) | 電流センサ |