JPH04351107A - Piezoelectric oscillator and its manufacture - Google Patents

Abstract

PURPOSE:To suppress the increase in terminal number due to the addition of the adjustment function by inputting an electric signal to a signal input lead terminal prolonged to the outside from the piezoelectric oscillator and cutting-off the input lead terminal. CONSTITUTION:A VDD lead terminal 27 and an output lead terminal 26 connecting electrically to a semiconductor element 21 are connected by a dam bar 35 prolonged from an outer ridge 25 to an outer ridge 26 and a lead terminal 30 and a VSS lead terminal 29 are connected by other dam bar 36. After sealing, the dam bars 35, 36 are cut off, the lead terminals 31, 32 are cut off from the ridge of a resin 23 and data control and data input lead terminals 33, 34 are cut off from the ridge of the outer ridge 26. Then the frequency adjustment is implemented by applying a prescribed power supply voltage between the VDD lead terminal 27 and the VSS lead terminal 29, after the frequency adjustment, the data control lead terminal 33 and the data input lead terminal 34 are cut off from the ridge of the resin 23. Thus, the presence of the undesired lead terminal is eliminated.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric oscillator that can be adjusted after being sealed and a method for manufacturing the same.

0002

[Prior Art] A conventional piezoelectric oscillator, as shown in FIG.
The semiconductor element 71 is fixed to the die pad 70, and a thin metal wire (
In this example, electrical connections are made by Au wires 72) to lead terminals 77 to 79 that are externally connected during mounting, and to lead terminals 81 and 82 that are later cut from the edge of the package. A piezoelectric vibrator (crystal vibrator 64 in this example) is electrically connected to the semiconductor element 71, and is electrically connected by welding or the like to lead terminals 81 and 82 which are later cut from the edge of the package. the Au wire 72;
A portion of the crystal resonator 64 and the lead terminals 77 to 82 are sealed with resin 73, and dam bars 85 and 86 are sealed.
Also, the lead terminals 81, 82 and the outer edge portion 75 were cut.

0003

[Problems to be Solved by the Invention] However, in the prior art described above, when inputting data to a semiconductor element and adjusting it during the mounting process in order to improve the performance of the piezoelectric oscillator, for example, frequency adjustment is performed to improve the performance of the piezoelectric oscillator. In order to improve the accuracy of the piezoelectric oscillator, the number of externally connected lead terminals must be increased accordingly, and lead terminals that are unnecessary for the user must be added to the piezoelectric oscillator. However, when using such a piezoelectric oscillator, there are also problems in that the user is subject to restrictions on board design, such as an increase in pinholes on the board and restrictions on wiring.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a piezoelectric oscillator which has the same number of terminals as the conventional piezoelectric oscillator and is compatible even when a semiconductor element with an adjustment function is mounted on the piezoelectric oscillator.

[0005]

[Means for Solving the Problems] The piezoelectric oscillator of the present invention has the following features:
A piezoelectric oscillator that includes at least a semiconductor element and a piezoelectric vibrator and is sealed with resin, the piezoelectric oscillator having a signal input lead terminal that is electrically connected to the semiconductor element and not electrically connected to the piezoelectric vibrator; The end face of the input lead terminal is exposed to the end face of the resin.

The method for manufacturing a piezoelectric oscillator of the present invention includes cutting a dam bar between externally connected lead terminals after sealing with a resin, and connecting a signal input lead terminal extending from an outer edge of a lead frame to an edge of the outer edge. A step of inputting an electrical signal to at least the signal input lead terminal, and a step of cutting the signal input lead terminal from the edge of the resin.

The method of manufacturing a piezoelectric oscillator according to the present invention is characterized in that a dam bar is provided on the signal input lead terminal, and the dam bar is cut when the dam bar is cut between the externally connected lead terminals.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A piezoelectric oscillator according to the present invention will be explained in detail using a crystal oscillator as an example with reference to the drawings. Note that, as a first embodiment, a case will be described below in which a frequency adjustment function is added to a semiconductor element.

FIG. 2(a) is a block circuit diagram showing a first embodiment of the crystal oscillator of the present invention, and FIG. 2(b) is a circuit diagram showing an oscillation circuit and a capacitor array. In Figure 2 (
In a), the dotted line indicates a semiconductor element. The oscillation circuit 1 is electrically connected to a crystal oscillator 14, and the output of the oscillation circuit 1 is frequency-divided by a frequency division circuit 2 to become a predetermined frequency-divided output selected by a frequency division selection circuit 3, and output to an output section 4. transmitted to. The frequency adjustment circuit added to the semiconductor element will be explained below. The data processing circuit 7 has a data input terminal 13
Converts serially input data into parallel data, and transmits the parallel data to the data control circuit 6. The data control circuit 6 transmits data from the data processing circuit 7 to the capacitor array 5 and the frequency division selection circuit 3 during frequency adjustment and frequency division selection, and transmits the data from the data processing circuit 7 to the capacitor array 5 and the frequency division selection circuit 3 during storage.
The data stored in the PROM circuit 8 is then transmitted to the capacitor array 5 and the frequency division selection circuit 3 during normal operation. The capacitor array 5 has a capacitor whose one side is connected to the input side of the inverter 15 of the oscillation circuit 1 and a transistor whose one side is grounded, which are connected in series, and a plurality of them are connected in parallel, and the gates of the plurality of transistors are connected to the input side of the inverter 15 of the oscillation circuit 1. O due to data from data control circuit 6
N or OFF.

FIG. 1 is a plan view showing an example of mounting the above crystal oscillator. Note that the signal input lead terminals in this example include a data control lead terminal 33 and a data input lead terminal 34. Semiconductor element 21 on die pad 20
The lead terminals 27 to 29, which are externally connected during mounting by wire bonding connection using thin metal wires (Au wire 22 in this example), and the lead terminals 31 to 34, which are later cut from the edge of the package, are electrically connected. Connecting. The crystal resonator 14 is electrically connected to the semiconductor element 21 and electrically and mechanically connected by welding or the like to lead terminals 31 and 32 which are later cut from the edge of the package. , the crystal oscillator 14 and the lead terminals 27 to 34 are partially sealed with a resin 23 such as a molding agent. At this time, the lead terminals coming out of the resin 23 are a VDD lead terminal 27, a VSS lead terminal 29, an output lead terminal 28, a lead terminal 30, a data control lead terminal 33 for controlling the data control circuit, and a data control lead terminal 33 for controlling the data control circuit. Input lead terminal 3
The lead terminals 31 and 32 are electrically connected to the crystal resonator 14 and the data control lead terminal 33.
The data input lead terminal 34 is thin in the vicinity of the resin 23 and in the vicinity of the outer edge 26 so that it can be easily cut later, and a pin probe or the like is provided between the vicinity of the resin 23 and the outer edge 26. It is thicker to make it easier to make electrical connections. Each lead terminal extending from the longitudinal direction of the crystal oscillator, that is, the lead terminals 31 and 32, the data input lead terminal 34, and the data control lead terminal 33 are connected to the outer edge portions 25 and 26, respectively. Further, the VDD lead terminal 27 and the output lead terminal 28 are connected by a dam bar 35 (shown by a dotted line in the figure) extending from the outer edge 25 to the other outer edge 26, and the lead terminal 30 and the VS
The S lead terminal 29 is connected by the other dam bar 36 (indicated by a dotted line in the figure). After sealing, the dam bars 35 and 36 are cut, the lead terminals 31 and 32 are cut from the edge of the resin 23, and the data control lead terminal 33 and the data input lead terminal 34 are cut from the outer edge 26. cut off from the edge. (Indicated by the dashed-dotted line in the figure)
Thereafter, frequency adjustment is performed by applying a predetermined power supply voltage between the VDD lead terminal 27 and the VSS lead terminal 29.
Based on the oscillation frequency output from the output lead terminal 28, a predetermined signal is input to the data control lead terminal 33 and the data input lead terminal 34 to adjust the frequency. After frequency adjustment, the data control lead terminal 33 and the data input lead terminal 34 are cut from the edge of the resin 23. Therefore, the crystal oscillator in this example does not have lead terminals that are unnecessary for the user, and has the same number of terminals as the conventional crystal oscillator.

As a second embodiment, as shown in FIG. 3, a dam bar 57 is provided in the vicinity of the resin 58 and extends from the signal input lead terminals 59 and 60 in parallel with the outer edge 61. The resin 58 does not seep out or burrs or the like adhere to the thick portions of the lead terminals 59 and 60, and conductivity failures do not occur during electrical connection using pin probes or the like during inspection.

0012

As described above, by inputting an electrical signal to the signal input lead terminal that is electrically connected to the semiconductor element and extending outward from the piezoelectric oscillator, and then cutting the input lead terminal, Even if an adjustment function or the like is added to the semiconductor element, the number of terminals is the same as that of the conventional device, and there is no need to provide unnecessary terminals for the user, and there is no need to regulate the use of the piezoelectric oscillator.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2(a) is a circuit block diagram showing the electronic circuit of FIG. 1; (b) is a circuit diagram showing the oscillation circuit and capacitor array of FIG. 2(a).

FIG. 3 is a plan view showing a second embodiment of the invention.

FIG. 4 is a plan view showing a conventional piezoelectric oscillator.

[Explanation of symbols]

20 Die pad 21 Semiconductor element 22 Au wire 23 Resin 25, 26 Outer edge 27-32 Lead terminal 33 Lead terminal for data control 34 Lead terminal for data input 35, 36 Dam Bar

Claims (3)

[Claims] 1. A piezoelectric oscillator that includes at least a semiconductor element and a piezoelectric vibrator and is sealed with a resin, wherein a signal input lead terminal is electrically connected to the semiconductor element and not electrically connected to the piezoelectric vibrator. A piezoelectric oscillator comprising: an end surface of the signal input lead terminal exposed at an end surface of the resin package. 2. After sealing with resin, cutting a dam bar between externally connected lead terminals, and cutting a signal input lead terminal extending from the outer edge of the lead frame from the edge of the outer edge; 2. The method of manufacturing a piezoelectric oscillator according to claim 1, comprising the steps of: inputting an electrical signal to the signal input lead terminal; and cutting the signal input lead terminal from the edge of the resin. 3. The signal input lead terminal is provided with a dam bar, and the dam bar is cut when the dam bar is cut between the lead terminals connected externally.
A method of manufacturing the piezoelectric oscillator described.