JP3151853B2 - Manufacturing method of piezoelectric oscillator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure adjustable after sealing.
The present invention relates to a method for manufacturing an electric oscillator .

[0002]

2. Description of the Related Art As shown in FIG.
The semiconductor element 71 is fixed to the die pad 70 and electrically connected to the lead terminals 77 to 79 which are externally connected at the time of mounting with a thin metal wire (in this example, the Au wire 72), and the lead terminals 81 and 82 which are cut from the edge of the package later. Connected. The piezoelectric vibrator (in this example, the crystal vibrator 64) is electrically connected to the semiconductor element 71, and is electrically connected to lead terminals 81 and 82 which are cut from the edge of the package later by welding or the like. The Au wire 7
2. The crystal oscillator 64 and the lead terminals 77 to 82
Is sealed with the resin 73 except for a part of the dam bar 85,
86 and between the lead terminals 81 and 82 and the outer edge 75.

[0003]

However, in the above-mentioned prior art, when data is input to a semiconductor device and adjusted in a mounting process in order to improve the performance of the piezoelectric oscillator, for example, the frequency is adjusted and the piezoelectric oscillator is adjusted. In order to increase the precision of the piezoelectric oscillator, it is necessary to increase the number of externally connected lead terminals, and it is necessary to add unnecessary lead terminals to the piezoelectric oscillator. However, when such a piezoelectric oscillator is used, there is also a problem that restrictions on a user's substrate design such as an increase in the number of pinholes in the substrate and restrictions on wiring can be made.

Accordingly, an object of the present invention is to provide a method of manufacturing a piezoelectric oscillator which has the same number of terminals as a conventional one even when a semiconductor element having an adjustment function added to the piezoelectric oscillator is mounted.

[0005]

Method of manufacturing a piezoelectric oscillator of the problem-solving means for the invention, two outer extending parallel with maintaining a predetermined distance
Edge and two first dam bars connected between the outer edges
And a second dam bar connected between the first dam bars
And one of the outer edge portions, the first dam bar, and the
In the area surrounded by the second dam bar, the data control lead
Terminal and one free end of the data input lead terminal
The data control lead terminal and the data
The other end of the data input lead terminal is connected to the second dam bar.
Lead frame intersected with the other of the outer edges
Forming an outer edge portion of the lead frame
Surrounding the first dam bar and the second dam bar
And the data control lead terminal and data input
Area where one free end of the lead terminal is formed
Installing a quartz oscillator and a semiconductor element,
Between the crystal unit and the semiconductor element, and the semiconductor element
And the data control lead terminal and the data input
Electrical connection between one of the free ends of the
The crystal oscillator, the semiconductor element, and the data system.
One of the control lead terminal and the data input lead terminal
Sealing the free end with a resin, and the outer edge
Switching by cutting the first da Muba said second da Muba and
Separating the data control lead terminals and the data
Frequency tone by entering the electrical signal to the over data input lead terminal
Performing the adjustment, the data control lead terminal and the
Cutting the data input lead terminal from the edge of the resin.

[0006] method of manufacturing a piezoelectric oscillator, the de
Data control lead terminal and the data input lead terminal
The second dam bar and the second dam bar
Between one of the outer edges in the longitudinal direction of the outer edge.
Do not form wide sections that extend in opposite directions along
Characterized in that that.

Further, when cutting the first dam bar, a second dam bar provided on the signal input lead terminal is cut. Furthermore, the signal input lead terminal is thin near the edge of the resin and near the outer edge, and is thick between the vicinity of the edge of the resin and the vicinity of the outer edge.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the drawings, using a piezoelectric oscillator as an example of a piezoelectric oscillator. Incidentally, the case of adding a frequency adjustment function semi conductive elements below.

[0009] in FIG. 2 (a) of the crystal oscillator according to the present invention
FIG. 2B is a block circuit diagram illustrating an example , and FIG. 2B is a circuit diagram illustrating an oscillation circuit and a capacitor array. FIG. 2 (a)
, The dotted line indicates a semiconductor element. The oscillating circuit 1 is electrically connected to the crystal oscillator 14, and the output of the oscillating circuit 1 is frequency-divided by the frequency-dividing circuit 2 and becomes a predetermined frequency-divided output selected by the frequency-dividing selection circuit 3. Transmitted to Hereinafter, the frequency adjustment circuit added to the semiconductor element will be described. The data processing circuit 7 converts the data serially input to the data input terminal 13 into parallel data, and transmits the parallel data to the data control circuit 6. The data control circuit 6 transmits the data from the data processing circuit 7 to the capacitance array 5 and the frequency division selection circuit 3 at the time of frequency adjustment and frequency division selection, and transmits the data from the data processing circuit 7 to the PROM circuit 8 at the time of storage. , Said PRO
The data stored in the M circuit 8 is transmitted to the capacitance array 5 and the frequency division selection circuit 3. The capacitor array 5 has a capacitor connected on one side to the input side of the inverter 15 of the oscillation circuit 1 and a transistor grounded on one side connected in series, and a plurality of these are connected in parallel. It is turned ON or OFF by data from the data control circuit 6.

FIG. 1 is a plan view showing an example of mounting of the above crystal oscillator. Note that the signal input lead terminals in this example are the data control lead terminal 33 and the data input lead terminal 34. The semiconductor element 21 is attached to the die pad 20.
And lead terminals 27 to 29 which are externally connected at the time of mounting by wire bonding connection or the like with a thin metal wire (Au wire 22 in this example), and lead terminals 31 to 34 which are later cut from the edge of the package. Connecting. The crystal unit 14 is electrically connected to the semiconductor element 21, and is electrically and mechanically connected to lead terminals 31 and 32, which are later cut from the edge of the package, by welding or the like. Then, the crystal oscillator 14 and a part of the lead terminals 27 to 34 are sealed with a resin 23 such as a molding agent except for a part thereof. At this time, the lead terminals coming out of the resin 23 include a VDD lead terminal 27, a VSS lead terminal 29, an output lead terminal 28, a lead terminal 30, a data control lead terminal 33 for controlling a data control circuit, and a data control lead terminal. Input lead terminal 34
And the lead terminals 31 and 32 electrically connected to the crystal unit 14. The data control lead terminal 33 and the data input lead terminal 34 are located near the resin 23 and near the outer edge 26, respectively. It is thin so as to be easily cut, and thick between the vicinity of the resin 23 and the vicinity of the outer edge portion 26 so as to facilitate electrical connection by a pin probe or the like. Each lead terminal extending in the longitudinal direction of the crystal oscillator, that is, the lead terminals 31 and 32, the data input lead terminal 34, and the data control lead terminal 33 are connected to outer edges 25 and 26, respectively. The VDD lead terminals 27 and the output lead terminals 28 are dam bars 35 extending from the outer edge 25 to the other outer edge 26 (shown by dotted lines in the figure).
The lead terminal 30 and the VSS lead terminal 29 are connected by another dam bar 36 (shown by a dotted line in the figure). After sealing, the dam bar 3
5 and 36 are cut, the lead terminals 31 and 32 are cut from the edge of the resin 23, and the data control lead terminal 33 and the data input lead terminal 34 are cut from the edge of the outer edge 26. After that, the frequency is adjusted by the VDD lead terminal 27 and the VSS.
A predetermined power supply voltage is applied between the output lead terminals 29, and a predetermined signal is input to the data control lead terminals 33 and the data input lead terminals 34 according to the oscillation frequency output from the output lead terminals 28. Make adjustments.
After the frequency adjustment, the data control lead terminal 33 and the data input lead terminal 34 are cut from the edge of the resin 23. Therefore, the crystal oscillator in this example has no lead terminals unnecessary for the user, and has the same number of terminals as the conventional crystal oscillator.

As an embodiment of the present invention , as shown in FIG.
By providing a dam bar 57 extending in parallel with the outer edge 61 from the outside, the resin 58 does not ooze out to the thick portions of the signal input lead terminals 59 and 60, and burrs and the like do not adhere. In the electrical connection by the pin probe or the like, conduction failure does not occur.

[0012]

As described above, a predetermined distance is maintained.
Two outer edges extending in parallel and connected between the outer edges
Connected between the two first dam bars and the first dam bar
A second dam bar is provided, one of the outer edges and
The area surrounded by the first dam bar and the second dam bar
The data control lead terminal and the data input lead terminal
One free end of the child and said data control
The other end of the lead terminal and the data input lead terminal
Part intersects with the second dam bar and is connected to the other of the outer edges.
Forming a sintered lead frame, said Ridofu
Of the frame, one of the outer edges, the first dam bar and the
And a data control lead surrounded by a second dam bar.
Terminal and one free end of the data input lead terminal
The crystal unit and the semiconductor element are set in the formed area.
Placing between the crystal unit and the semiconductor element.
And the semiconductor element and the data control lead terminal,
Between one free end of the data input lead terminal and
Electrically connecting the crystal unit and the semiconductor
Element, the data control lead terminal, and the data input
And one of the free end of the use lead terminals are sealed with resin
Step and, between the outer edge and the first da Muba a step of disconnecting by cutting and the second dam <br/> bar, the data control Li
And performing frequency adjustment by inputting an electrical signal to the mode pin and the data input lead terminal, for the data control
Cutting the lead terminal and the data input lead terminal from the edge of the resin ,
Crystal oscillator, semiconductor element, data control lead terminal and
Surrounds one free end of data input lead terminal
It has an outer edge and a dam bar, and is outside the resin package.
Data control lead terminals and data input
A lead frame having lead terminals and
Implement a crystal oscillator and the semiconductor element to the lead frame
Entire manufacturing including frequency adjustment due to resin sealing
The process is simple and easy.
When the package is formed, the resin is
And lead terminals for data input extend outside the package
Flow into the area where electrical contact is possible and adhere
To prevent data control lead terminals and data input
Input a predetermined signal to the lead terminals for
When contacting with the adhered resin,
No, it is certainly feasible frequency adjustment, have the same number of terminals in the conventional be added such adjustment function to a semiconductor device, without providing unnecessary terminal for the user, performs the regulation on the use of pressure electrostatic oscillator Unnecessary piezoelectric oscillators can be easily manufactured. In addition, the data control lead
The data terminal and the data input lead terminal.
A second dam bar and the outer edge portion adjacent to the second dam bar;
Between them along the longitudinal direction of the outer edge.
By forming a wide part extending in the opposite direction,
The wide part is the same as the first dam bar, the second dam bar and the outer edge
Two distances apart from each other
Because the center of the part is separated by a certain distance,
Probe etc. for inspection and frequency adjustment
When making electrical contact with the wide part, the pin probe
Inspection and frequency adjustment without contact with parts other than the wide area
While performing integer reliably and easily, have the same number of terminals in the conventional be added such adjustment function to a semiconductor device, without providing unnecessary terminals for users, the need for performing the restriction on the use of pressure electrostatic oscillator free piezoelectric oscillator, it is possible to manufacture.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of mounting a crystal oscillator according to the present invention.

FIG. 2A is a circuit block diagram illustrating the electronic circuit of FIG. 1; FIG. 3B is a circuit diagram showing the oscillation circuit and the capacitor array of FIG.

Plan view illustrating the actual施例of the present invention; FIG.

FIG. 4 is a plan view showing a conventional piezoelectric oscillator.

[Explanation of symbols]

Reference Signs List 20 die pad 21 semiconductor element 22 Au wire 23 , 58 resin 25 , 26 , 61 outer edge 27-32 lead terminal 33 data control lead terminal 34 data input lead terminal 35 , 36 , 57 dam bar 59, 60 signal input lead Terminal

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H03B 5/30-5/42 H01L 23/00

Claims (2)

(57) [Claims] 1. Two parallel extending parts maintaining a predetermined interval.
An outer edge, and two first dam bars connected between the outer edges.
And a second dam bar connected between the first dam bar and
And one of the outer edges, the first dam bar and the front
In the area surrounded by the second dam bar, data control resources
One free end of the lead terminal and data input lead terminal
Is provided, and the data control lead terminal and the
The other end of the data input lead terminal is
Lead frame that intersects with
Forming one of the outer edges of the lead frame and the first dam.
And the second dam bar is surrounded by
One of data control lead terminals and data input lead terminals
In the area where the free end of
Installing a body element, and between the quartz oscillator and the semiconductor element;
Element, the data control lead terminal, and the data input
Electrical connection to one free end of the
Step, the crystal resonator, the semiconductor element, and the data control
One of the lead terminal and the data input lead terminal
A step of sealing an end portion of a resin, the outer edge portion and the first da Muba a step of disconnecting by cutting said second da Muba, lead terminals and Li for the data input the data control
Inputting an electrical signal to the input terminal to adjust the frequency; and providing the data control lead terminal and the data input lead.
Cutting a lead terminal from an edge of the resin. 2. The data control lead terminal and the data control lead terminal.
The second dam bar and the second
2 between one of the outer edges adjacent to the dam bar,
Extend in opposite directions along the length of the outer edge
2. The method according to claim 1, wherein a wide portion is formed .