JPH0435005Y2 - - Google Patents
Info
- Publication number
- JPH0435005Y2 JPH0435005Y2 JP1987043497U JP4349787U JPH0435005Y2 JP H0435005 Y2 JPH0435005 Y2 JP H0435005Y2 JP 1987043497 U JP1987043497 U JP 1987043497U JP 4349787 U JP4349787 U JP 4349787U JP H0435005 Y2 JPH0435005 Y2 JP H0435005Y2
- Authority
- JP
- Japan
- Prior art keywords
- heater
- solder
- pipe
- bath
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 45
- 238000005476 soldering Methods 0.000 claims description 21
- 238000007654 immersion Methods 0.000 description 6
- 230000008602 contraction Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- LNSPFAOULBTYBI-UHFFFAOYSA-N [O].C#C Chemical group [O].C#C LNSPFAOULBTYBI-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Furnace Details (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043497U JPH0435005Y2 (US20020095090A1-20020718-M00002.png) | 1987-03-26 | 1987-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043497U JPH0435005Y2 (US20020095090A1-20020718-M00002.png) | 1987-03-26 | 1987-03-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63150761U JPS63150761U (US20020095090A1-20020718-M00002.png) | 1988-10-04 |
| JPH0435005Y2 true JPH0435005Y2 (US20020095090A1-20020718-M00002.png) | 1992-08-19 |
Family
ID=30860410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987043497U Expired JPH0435005Y2 (US20020095090A1-20020718-M00002.png) | 1987-03-26 | 1987-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0435005Y2 (US20020095090A1-20020718-M00002.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7392926B2 (en) * | 2004-09-15 | 2008-07-01 | Hakko Corporation | Electrically-controlled soldering pot apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950135A (ja) * | 1982-09-17 | 1984-03-23 | Toshiba Ceramics Co Ltd | アンダ−ヒ−ト型保持炉 |
-
1987
- 1987-03-26 JP JP1987043497U patent/JPH0435005Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950135A (ja) * | 1982-09-17 | 1984-03-23 | Toshiba Ceramics Co Ltd | アンダ−ヒ−ト型保持炉 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63150761U (US20020095090A1-20020718-M00002.png) | 1988-10-04 |
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