JPH0434769U - - Google Patents
Info
- Publication number
- JPH0434769U JPH0434769U JP7571490U JP7571490U JPH0434769U JP H0434769 U JPH0434769 U JP H0434769U JP 7571490 U JP7571490 U JP 7571490U JP 7571490 U JP7571490 U JP 7571490U JP H0434769 U JPH0434769 U JP H0434769U
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- open
- circuit board
- sealing body
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Description
第１図は本考案によるオープンエアパツケージ
の一実施例の加熱前の状態を示す断面図、第２図
は第１図の実施例の加熱時を示す断面図、第３図
は第１図の実施例の加熱後の完成状態を示す断面
図、第４図は従来のオープンエアパツケージの一
例を示す断面図である。
１０……オープンエアパツケージ、１１……回
路素子、１２……回路基板、１３……ケース、１
３ａ……リード端子、１４……絶縁性フイルム、
１５……固形封止体、１５ａ，１５ｂ……スルー
ホール。
FIG. 1 is a sectional view showing an embodiment of the open air package according to the present invention before heating, FIG. 2 is a sectional view showing the embodiment of FIG. 1 during heating, and FIG. FIG. 4 is a cross-sectional view showing an example of the completed state after heating. FIG. 4 is a cross-sectional view showing an example of a conventional open air package. 10...Open air package, 11...Circuit element, 12...Circuit board, 13...Case, 1
3a... Lead terminal, 14... Insulating film,
15...Solid sealing body, 15a, 15b...Through hole.
Claims (1)
したケース内に収納し、開放側の回路基板の表面
に絶縁性フイルムを載置した後、その上に未硬化
状態の熱可塑性樹脂から成形された固形封止体を
載置して、該固形封止体を加熱硬化させることに
より、封止樹脂層を形成して、密閉・封止を行う
ようにしたことを特徴とするオープンエアパツケ
ージ。 A circuit board with circuit elements mounted thereon is housed in a case with one side open, and an insulating film is placed on the surface of the circuit board on the open side. What is claimed is: 1. An open air package characterized in that a sealing resin layer is formed by placing a solid sealing body, and heating and curing the solid sealing body, thereby performing sealing and sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7571490U JPH0434769U (en) | 1990-07-17 | 1990-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7571490U JPH0434769U (en) | 1990-07-17 | 1990-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434769U true JPH0434769U (en) | 1992-03-23 |
Family
ID=31616533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7571490U Pending JPH0434769U (en) | 1990-07-17 | 1990-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434769U (en) |
-
1990
- 1990-07-17 JP JP7571490U patent/JPH0434769U/ja active Pending
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