JPH04343513A - Surface acoustic wave element - Google Patents

Abstract

PURPOSE:To obtain a surface acoustic wave device capable of loading a surface acoustic wave element with high density without losing its characteristics. CONSTITUTION:An opening part 10a having a shape almost similar to the surface acoustic wave element 11 is formed on a film-like insulating supporting plate body 10 and plural leads 12 formed on the upper surface of the supporting plate body 10 are protruded to the opening part 10a. The bump electrode 13 of the element 11 is abutted upon the protruded lead parts from their lower parts, insulating plate bodies 14 for covering the opening part 10a are laminated on the lead face side of the plate body 10, the internal leads are connected to the bump electrode 13 from hole parts 14a perforated through the plate body 14 by a thermal press-containing method or the like, and then the hole parts 14a and the lower face part side of the element 11 are sealed with resins 15a, 15b. Thereby a space part can be formed on the surface of the element 11 and the element 11 can be packaged by means of rein sealing.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave device that can be mounted by providing a space above a surface acoustic wave element.

0002

[Prior Art] FIGS. 4 and 5 show TAB (Tape)
2 shows a resin-sealed structure of a semiconductor chip using automated bonding. That is, a plurality of conductive foil leads 2 are provided on an insulating support film 1 having an opening 1a,
The lead tips protruding into the opening 1a and the pumps 4 formed on the electrodes of the semiconductor chip 3 are bonded together by well-known bonding, and then the chip 3 and the opening 1a including the bonding portion are bonded with a thermosetting resin 5. It is a structure that is filled, hardened, and sealed. According to this TAB technology, highly sealed packaging of ICs can be realized.

0003

[Problems to be Solved by the Invention] The above TAB technology is aimed at mounting semiconductor chips such as ordinary ICs, and therefore, due to its function, resin etc. are adhered to the surface like surface acoustic wave elements. Therefore, it is unsuitable for those that impair the characteristics.

0004

OBJECTS OF THE INVENTION An object of the present invention is to provide a surface acoustic wave device that applies TAB technology, can mount a surface acoustic wave element without impairing its function, and can be sealed with resin.

[0005]

[Means for Solving the Problems] A first invention of the present application includes a surface acoustic wave element and an opening corresponding to the surface acoustic wave element, the opening being in contact with an electrode on the element on an upper surface. an insulating support plate supporting the element in the opening so that a plurality of leads are formed on the upper surface of the element and the electrodes on the upper surface of the element abut from below the protruding leads; and a hole facing the protruding lead parts. an insulating plate that covers the opening on the side opposite to the side on which the element is supported and is supported on the upper surface side of the insulating support plate; and a resin that covers the lower surface of the element and closes the hole. The gist is that it consists of the following.

[0006] A second invention of the present application includes a surface acoustic wave element;
The surface acoustic wave element has an opening larger than the surface acoustic wave element, and a plurality of leads are formed on the upper surface of the element and protrude from the opening so as to contact electrodes on the element, and the electrodes on the upper surface of the element abut from below the protruding leads. an insulating support plate supporting the element in the opening; a first insulating plate placed on the side where the leads are formed on the insulating support plate and covering the opening; A second insulating plate is placed on the insulating support plate on the opposite side of the first insulating plate and covers the element.

[0007]

[Function] According to the above structure, an insulating plate is further provided on the lead that contacts the electrode on the surface acoustic wave element side, so a space is formed on the element surface and resin sealing is possible. Become.

[0008]

Embodiment FIGS. 1(a), 1(b) and 2 show an embodiment of the present invention. Figure 1(a) shows the cross-sectional structure at an intermediate stage.
Figure 1(b) shows the cross-sectional structure after completion, and Figure 2 shows Figure 1(a).
) shows the planar structure of

In the figure, 10 is a film-like insulating support plate, 10a is an opening having almost the same shape as the surface acoustic wave element 11, and 12 is a conductive foil lead provided on the support plate 10. , this lead is the bump electrode 1 of the element.
3 and is led out to the opening 10a so as to come into contact with the opening 10a. The structure up to this point is the structure used in normal TAB technology.

In the present invention, a film-like insulating plate 14 is further laminated on the lead 12, as shown in FIG. 1(a). This insulating plate 14 is provided with a hole 14 a at the tip of the lead 12 , that is, at a portion that comes into contact with the bump electrode 13 . This hole 14a has a hole diameter that allows internal lead bonding in the next step. The internal leads and the bump electrodes of the element are joined by a method such as thermocompression bonding. Thereafter, as shown in FIG. 1(b), the hole 14a of the insulating plate 14 and the lower surface of the element 11 are sealed with a normal thermosetting resin, and the sealing resin 15a, 15b is sealed.
form. The resin on the lower surface of the element can cover between the side surface of the element and the periphery of the opening of the insulating support plate 10. After this sealing process, the external leads are cut and the mounting process is completed. With this configuration, it is possible to provide a space on the top surface of the element.

FIGS. 3(a) and 3(b) show another embodiment of the present invention. In this embodiment, as shown in FIG. 3(a), the opening 10a of the insulating support plate 10 is formed larger than the element, and the insulating support plate 10 has both sides, the side with the leads and the opposite side. Film-like insulating plates 16 and 17 that cover the opening 10a are bonded by heat-pressing or adhesive.

Sealing is completed with the above configuration, but if the environmental resistance is insufficient, sealing is performed with a thermosetting resin as shown in FIG. 3(b), and the sealing resin 18, form 19. Since the element 11 is sealed with the insulating plates 16 and 17, the resin does not reach the upper surface of the element and does not impair the characteristics of the element.

[0013]

Effects of the Invention According to the present invention, the surface acoustic wave element can be
When mounting using B technology, a space can be provided on the surface of the element, so a high-density package can be realized without impairing the characteristics of the element.

[Brief explanation of drawings]

FIG. 1(a) is a sectional view of an intermediate structure of a surface acoustic wave device showing an embodiment of the present invention. (b) is a sectional view of the structure after completion.

FIG. 2 is a plan view of FIG. 1(a).

FIGS. 3(a) and 3(b) are cross-sectional views showing other embodiments of the present invention, respectively.

FIG. 4 is a sectional view of a conventional surface acoustic wave device.

FIG. 5 is a plan view of an insulating support plate portion provided with leads.

[Explanation of symbols]

10 Insulating support plate 10a Opening 11 Surface acoustic wave device 12 Lead 13 Bump electrode 14 Insulating plate 14a Hole 15a, 15b Sealing resin 16, 17 Insulating plate 18, 19 Sealing resin

Claims (2)

[Claims] 1. A surface acoustic wave element having a surface acoustic wave element and an opening corresponding to the surface acoustic wave element, a plurality of leads protruding from the opening so as to be in contact with electrodes on the element on the upper surface, an insulating support plate supporting the element in the opening so that the electrode on the upper surface of the element comes into contact with the protruding lead from below, and a hole facing the protruding lead portion, the side on which the element is supported. and cover the opening on the opposite side.
A surface acoustic wave element comprising an insulating plate supported on the upper surface side of the insulating support plate, and a resin covering the lower surface of the element and closing the hole. 2. A surface acoustic wave element having an opening larger than the surface acoustic wave element, a plurality of leads protruding from the opening so as to be in contact with electrodes on the element on an upper surface thereof, and the element an insulating support plate supporting the element in the opening such that the electrode on the upper surface contacts the protruding lead from below; and an insulating support plate placed on the side where the lead is formed on the insulating support plate, and the opening and a second insulating plate placed on the insulating support plate on the opposite side of the first insulating plate and covering the element. surface acoustic wave device.